JPS646037U - - Google Patents
Info
- Publication number
- JPS646037U JPS646037U JP10062487U JP10062487U JPS646037U JP S646037 U JPS646037 U JP S646037U JP 10062487 U JP10062487 U JP 10062487U JP 10062487 U JP10062487 U JP 10062487U JP S646037 U JPS646037 U JP S646037U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor substrate
- sputtering
- chamber
- electrode
- etching
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims description 7
- 239000004065 semiconductor Substances 0.000 claims description 6
- 238000004544 sputter deposition Methods 0.000 claims description 6
- 238000005530 etching Methods 0.000 claims description 4
- 238000000992 sputter etching Methods 0.000 claims 2
- 238000007796 conventional method Methods 0.000 description 1
Description
第１図は本考案の第１の実施例を示す平面図、
第２図は第１図のＡ―Ａ線断面図、第３図は本考
案の第２の実施例を示す平面図、第４図は従来の
方法を示す平面図、第５図は第４図のＢ―Ｂ線断
面図である。
１……半導体基板、３……エツチング室、４…
…スパツタリング室、５……移送ベルト、１１…
…ゲートバルブ、１４……基板ホルダ、１４ａ…
…ストツパ部、１５……アーム、１６……アーム
駆動部、１７……エツチング電極、１９……スト
ツパ、２０……ストツパ駆動部。
FIG. 1 is a plan view showing a first embodiment of the present invention;
2 is a sectional view taken along the line AA in FIG. 1, FIG. 3 is a plan view showing the second embodiment of the present invention, FIG. 4 is a plan view showing the conventional method, and FIG. It is a sectional view taken along the line BB in the figure. 1... Semiconductor substrate, 3... Etching chamber, 4...
...Sputtering chamber, 5...Transfer belt, 11...
...Gate valve, 14...Substrate holder, 14a...
...Stopper section, 15...Arm, 16...Arm drive section, 17...Etching electrode, 19...Stopper, 20...Stopper drive section.
Claims (1)
ツチング室と、スパツタリング処理を行うスパツ
タリング室と、エツチング室とスパツタリング室
との間で半導体基板を移送する移送手段と、エツ
チング室とスパツタリング室との所定の位置に半
導体基板をセツトする位置決め手段とを有するス
パツタリング装置において、半導体基板を乗せる
スパツタエツチング電極を有し、半導体基板の外
周より大きく該電極の外形より小さい範囲内にお
ける該電極上面の形状を平面としたことを特徴と
するスパツタリング装置。 an etching chamber for sputter etching a semiconductor substrate; a sputtering chamber for sputtering; a transfer means for transferring the semiconductor substrate between the etching chamber and the sputtering chamber; A sputtering device having a positioning means for setting a semiconductor substrate, which has a sputter etching electrode on which the semiconductor substrate is placed, and the top surface of the electrode has a flat shape within a range larger than the outer circumference of the semiconductor substrate and smaller than the outer shape of the electrode. A sputtering device characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987100624U JPH0737313Y2 (en) | 1987-06-30 | 1987-06-30 | Sputtering equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987100624U JPH0737313Y2 (en) | 1987-06-30 | 1987-06-30 | Sputtering equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS646037U true JPS646037U (en) | 1989-01-13 |
| JPH0737313Y2 JPH0737313Y2 (en) | 1995-08-23 |
Family
ID=31328867
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987100624U Expired - Lifetime JPH0737313Y2 (en) | 1987-06-30 | 1987-06-30 | Sputtering equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0737313Y2 (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5681533U (en) * | 1979-11-27 | 1981-07-01 | ||
| JPS60249329A (en) * | 1984-05-25 | 1985-12-10 | Anelva Corp | Spatter etching mechanism in vacuum treatment unit |
-
1987
- 1987-06-30 JP JP1987100624U patent/JPH0737313Y2/en not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5681533U (en) * | 1979-11-27 | 1981-07-01 | ||
| JPS60249329A (en) * | 1984-05-25 | 1985-12-10 | Anelva Corp | Spatter etching mechanism in vacuum treatment unit |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0737313Y2 (en) | 1995-08-23 |