JPS63144956A - 平面ラツピング装置 - Google Patents

平面ラツピング装置

Info

Publication number
JPS63144956A
JPS63144956A JP61288023A JP28802386A JPS63144956A JP S63144956 A JPS63144956 A JP S63144956A JP 61288023 A JP61288023 A JP 61288023A JP 28802386 A JP28802386 A JP 28802386A JP S63144956 A JPS63144956 A JP S63144956A
Authority
JP
Japan
Prior art keywords
workpiece
surface plate
lapping
support
robot
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP61288023A
Other languages
English (en)
Japanese (ja)
Other versions
JPH055632B2 (enrdf_load_stackoverflow
Inventor
Isao Suzuki
鈴木　勲夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Electric Co Ltd
Original Assignee
Fuji Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Electric Co Ltd filed Critical Fuji Electric Co Ltd
Priority to JP61288023A priority Critical patent/JPS63144956A/ja
Publication of JPS63144956A publication Critical patent/JPS63144956A/ja
Publication of JPH055632B2 publication Critical patent/JPH055632B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
JP61288023A 1986-12-03 1986-12-03 平面ラツピング装置 Granted JPS63144956A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61288023A JPS63144956A (ja) 1986-12-03 1986-12-03 平面ラツピング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61288023A JPS63144956A (ja) 1986-12-03 1986-12-03 平面ラツピング装置

Publications (2)

Publication Number Publication Date
JPS63144956A true JPS63144956A (ja) 1988-06-17
JPH055632B2 JPH055632B2 (enrdf_load_stackoverflow) 1993-01-22

Family

ID=17724811

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61288023A Granted JPS63144956A (ja) 1986-12-03 1986-12-03 平面ラツピング装置

Country Status (1)

Country Link
JP (1) JPS63144956A (enrdf_load_stackoverflow)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011083852A (ja) * 2009-10-15 2011-04-28 Hallys Corp 研削装置
JP2015013320A (ja) * 2013-07-03 2015-01-22 浜井産業株式会社 ワーク嵌合装置および嵌合方法
TWI476854B (zh) * 2012-03-08 2015-03-11 Lg Cns Co Ltd Led晶圓的提供裝置及方法
US9045827B2 (en) 2012-03-09 2015-06-02 Lg Cns Co., Ltd. Apparatus and method for supplying light-emitting diode (LED) wafer
CN105904324A (zh) * 2015-05-28 2016-08-31 海宁奇晟轴承有限公司 一种自动双盘研磨机
CN115870868A (zh) * 2022-12-27 2023-03-31 西安奕斯伟材料科技有限公司 装卸装置、方法及硅片双面抛光设备
JP2024151787A (ja) * 2023-04-13 2024-10-25 株式会社太陽 両面研磨装置

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011083852A (ja) * 2009-10-15 2011-04-28 Hallys Corp 研削装置
TWI476854B (zh) * 2012-03-08 2015-03-11 Lg Cns Co Ltd Led晶圓的提供裝置及方法
US9045827B2 (en) 2012-03-09 2015-06-02 Lg Cns Co., Ltd. Apparatus and method for supplying light-emitting diode (LED) wafer
JP2015013320A (ja) * 2013-07-03 2015-01-22 浜井産業株式会社 ワーク嵌合装置および嵌合方法
CN105904324A (zh) * 2015-05-28 2016-08-31 海宁奇晟轴承有限公司 一种自动双盘研磨机
CN115870868A (zh) * 2022-12-27 2023-03-31 西安奕斯伟材料科技有限公司 装卸装置、方法及硅片双面抛光设备
JP2024151787A (ja) * 2023-04-13 2024-10-25 株式会社太陽 両面研磨装置

Also Published As

Publication number Publication date
JPH055632B2 (enrdf_load_stackoverflow) 1993-01-22

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