JPS63142842A - 垂直に挿入されるシングル−イン−ラインの形式の回路モジユール - Google Patents

垂直に挿入されるシングル−イン−ラインの形式の回路モジユール

Info

Publication number
JPS63142842A
JPS63142842A JP62297904A JP29790487A JPS63142842A JP S63142842 A JPS63142842 A JP S63142842A JP 62297904 A JP62297904 A JP 62297904A JP 29790487 A JP29790487 A JP 29790487A JP S63142842 A JPS63142842 A JP S63142842A
Authority
JP
Japan
Prior art keywords
region
support
resistance
circuit module
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62297904A
Other languages
English (en)
Japanese (ja)
Inventor
ミヒヤエル・カインドル
ヴエルナー・ピーペンブルク
エルンスト・フオルマーハウス
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens Corp
Original Assignee
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Corp filed Critical Siemens Corp
Publication of JPS63142842A publication Critical patent/JPS63142842A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors incorporating printed resistors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0317—Thin film conductor layer; Thin film passive component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09281—Layout details of a single conductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09727—Varying width along a single conductor; Conductors or pads having different widths
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10386—Clip leads; Terminals gripping the edge of a substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/366—Assembling printed circuits with other printed circuits substantially perpendicularly to each other

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Multi-Conductor Connections (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Glass Compositions (AREA)
  • Mechanical Operated Clutches (AREA)
  • Use Of Switch Circuits For Exchanges And Methods Of Control Of Multiplex Exchanges (AREA)
  • Fuses (AREA)
  • Channel Selection Circuits, Automatic Tuning Circuits (AREA)
  • Electronic Switches (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Prostheses (AREA)
  • Separation Using Semi-Permeable Membranes (AREA)
  • External Artificial Organs (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Details Of Resistors (AREA)
JP62297904A 1986-11-28 1987-11-27 垂直に挿入されるシングル−イン−ラインの形式の回路モジユール Pending JPS63142842A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE3640694 1986-11-28
DE3640694.5 1986-11-28

Publications (1)

Publication Number Publication Date
JPS63142842A true JPS63142842A (ja) 1988-06-15

Family

ID=6315002

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62297904A Pending JPS63142842A (ja) 1986-11-28 1987-11-27 垂直に挿入されるシングル−イン−ラインの形式の回路モジユール

Country Status (10)

Country Link
US (1) US4801916A (enExample)
EP (1) EP0268935B1 (enExample)
JP (1) JPS63142842A (enExample)
KR (1) KR880006967A (enExample)
AT (1) ATE70661T1 (enExample)
BR (1) BR8706423A (enExample)
DE (1) DE3775349D1 (enExample)
DK (1) DK168778B1 (enExample)
FI (1) FI875254A7 (enExample)
GR (1) GR3003994T3 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019529325A (ja) * 2016-09-02 2019-10-17 スンチョンヒャン ユニバーシティ インダストリー アカデミー コーポレーション ファウンデーションＳｏｏｎｃｈｕｎｈｙａｎｇ Ｕｎｉｖｅｒｓｉｔｙ Ｉｎｄｕｓｔｒｙ Ａｃａｄｅｍｙ Ｃｏｏｐｅｒａｔｉｏｎ Ｆｏｕｎｄａｔｉｏｎ 人工歯用ウラストナイト系結晶化ガラス及びこの着色方法

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5224021A (en) * 1989-10-20 1993-06-29 Matsushita Electric Industrial Co., Ltd. Surface-mount network device
JPH03291869A (ja) * 1990-04-09 1991-12-24 Hitachi Ltd 電子装置
US5039851A (en) * 1990-05-23 1991-08-13 Galileo Electro-Optics Corporation Plug in detector module
DE102018101792B4 (de) * 2018-01-26 2021-03-25 Harting Electric Gmbh & Co. Kg Leiterkartenverbinder und dazugehörige Leiterkartenanordnung zur Übertragung hoher Stromstärken

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5844561U (ja) * 1981-09-18 1983-03-25 篠塚　正男 直結式自動変速装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2691716A (en) * 1950-12-01 1954-10-12 William H Wellens Vaporizer
US2978664A (en) * 1958-11-05 1961-04-04 Texas Instruments Inc Resistive element
DE1245458B (de) * 1966-04-27 1967-07-27 Telefunken Patent Integrierte Schaltung, deren Traegerplaettchen gut waermeleitfaehig ist
US4118112A (en) * 1976-12-03 1978-10-03 Xerox Corporation Method for reducing power dissipation in tapered resistor devices
DE2655841C3 (de) * 1976-12-09 1981-11-19 Siemens AG, 1000 Berlin und 8000 München Integrierter Widerstandsbaustein zum Einlöten in eine Flachbaugruppe
DE3031912A1 (de) * 1980-08-23 1982-04-01 Brown, Boveri & Cie Ag, 6800 Mannheim Anordnung zur potentialunabhaengigen waermeabfuehrung
LU83439A1 (de) * 1980-09-25 1981-10-29 Siemens Ag Gehaeuseloses,senkrecht steckbares single-in-line-schaltungsmodul
DE3605692A1 (de) * 1986-02-21 1986-11-06 Siemens AG, 1000 Berlin und 8000 München Temperaturaenderungen ausgesetzte anordnung

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5844561U (ja) * 1981-09-18 1983-03-25 篠塚　正男 直結式自動変速装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019529325A (ja) * 2016-09-02 2019-10-17 スンチョンヒャン ユニバーシティ インダストリー アカデミー コーポレーション ファウンデーションＳｏｏｎｃｈｕｎｈｙａｎｇ Ｕｎｉｖｅｒｓｉｔｙ Ｉｎｄｕｓｔｒｙ Ａｃａｄｅｍｙ Ｃｏｏｐｅｒａｔｉｏｎ Ｆｏｕｎｄａｔｉｏｎ 人工歯用ウラストナイト系結晶化ガラス及びこの着色方法
US10889522B2 (en) 2016-09-02 2021-01-12 Soonchunhyang University Industry Academy Cooperation Foundation Wollastonite crystallized glass for artificial tooth and method for coloring same

Also Published As

Publication number Publication date
EP0268935B1 (de) 1991-12-18
DK168778B1 (da) 1994-06-06
DE3775349D1 (de) 1992-01-30
GR3003994T3 (enExample) 1993-03-16
US4801916A (en) 1989-01-31
ATE70661T1 (de) 1992-01-15
FI875254A7 (fi) 1988-05-29
EP0268935A1 (de) 1988-06-01
FI875254A0 (fi) 1987-11-27
DK625387D0 (da) 1987-11-27
KR880006967A (ko) 1988-07-25
BR8706423A (pt) 1988-07-12
DK625387A (da) 1988-05-29

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