JPS6314056B2 - - Google Patents
Info
- Publication number
- JPS6314056B2 JPS6314056B2 JP57006061A JP606182A JPS6314056B2 JP S6314056 B2 JPS6314056 B2 JP S6314056B2 JP 57006061 A JP57006061 A JP 57006061A JP 606182 A JP606182 A JP 606182A JP S6314056 B2 JPS6314056 B2 JP S6314056B2
- Authority
- JP
- Japan
- Prior art keywords
- weight
- alloy
- copper
- strength
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910045601 alloy Inorganic materials 0.000 claims description 22
- 239000000956 alloy Substances 0.000 claims description 22
- 239000000463 material Substances 0.000 claims description 15
- 239000010949 copper Substances 0.000 claims description 13
- 239000004065 semiconductor Substances 0.000 claims description 10
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 7
- 239000000203 mixture Substances 0.000 claims description 5
- 239000012535 impurity Substances 0.000 claims description 4
- 229910052742 iron Inorganic materials 0.000 claims description 4
- 229910052749 magnesium Inorganic materials 0.000 claims description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 11
- 229910052802 copper Inorganic materials 0.000 description 11
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 5
- 238000007747 plating Methods 0.000 description 5
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 229910000906 Bronze Inorganic materials 0.000 description 2
- 229910017876 Cu—Ni—Si Inorganic materials 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- 229910052787 antimony Inorganic materials 0.000 description 2
- 239000010974 bronze Substances 0.000 description 2
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 229910000833 kovar Inorganic materials 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000005554 pickling Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Conductive Materials (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP606182A JPS58124254A (ja) | 1982-01-20 | 1982-01-20 | 半導体機器のリ−ド材用銅合金 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP606182A JPS58124254A (ja) | 1982-01-20 | 1982-01-20 | 半導体機器のリ−ド材用銅合金 |
Related Child Applications (5)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23369983A Division JPS59145746A (ja) | 1983-12-13 | 1983-12-13 | 半導体機器のリ−ド材用銅合金 |
| JP23370083A Division JPS59145747A (ja) | 1983-12-13 | 1983-12-13 | 半導体機器のリ−ド材用銅合金 |
| JP23370183A Division JPS59145748A (ja) | 1983-12-13 | 1983-12-13 | 半導体機器のリ−ド材用銅合金 |
| JP23370283A Division JPS59145749A (ja) | 1983-12-13 | 1983-12-13 | 半導体機器のリ−ド材用銅合金 |
| JP23369883A Division JPS59145745A (ja) | 1983-12-13 | 1983-12-13 | 半導体機器のリ−ド材用銅合金 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58124254A JPS58124254A (ja) | 1983-07-23 |
| JPS6314056B2 true JPS6314056B2 (US20090163788A1-20090625-C00002.png) | 1988-03-29 |
Family
ID=11628069
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP606182A Granted JPS58124254A (ja) | 1982-01-20 | 1982-01-20 | 半導体機器のリ−ド材用銅合金 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58124254A (US20090163788A1-20090625-C00002.png) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007100145A (ja) * | 2005-09-30 | 2007-04-19 | Dowa Holdings Co Ltd | 曲げ加工性と疲労特性を改善した銅合金板材 |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5949293B2 (ja) * | 1982-06-05 | 1984-12-01 | 株式会社神戸製鋼所 | 電気電子部品用銅合金及びその製造法 |
| JPS59136439A (ja) * | 1983-01-26 | 1984-08-06 | Sanpo Shindo Kogyo Kk | 銅基合金 |
| JPS6043448A (ja) * | 1983-08-16 | 1985-03-08 | Kobe Steel Ltd | 端子・コネクター用銅合金の製造方法 |
| JPS60218440A (ja) * | 1984-04-13 | 1985-11-01 | Furukawa Electric Co Ltd:The | リ−ドフレ−ム用銅合金 |
| JPS60218442A (ja) * | 1984-04-13 | 1985-11-01 | Furukawa Electric Co Ltd:The | リ−ドフレ−ム用銅合金 |
| JPS61177348A (ja) * | 1985-02-01 | 1986-08-09 | Kobe Steel Ltd | セラミツクパツケ−ジｉｃ用リ−ド材 |
| US4650123A (en) * | 1986-03-25 | 1987-03-17 | Toyota Jidosha Kabushiki Kaisha | Rotary type electrostatic spray painting device |
| US4700896A (en) * | 1986-04-11 | 1987-10-20 | Toyota Jidosha Kabushiki Kaisha | Rotary type electrostatic spray painting device |
| KR940010455B1 (ko) * | 1992-09-24 | 1994-10-22 | 김영길 | 고강도, 우수한 전기전도도 및 열적안정성을 갖는 동(Cu)합금 및 그 제조방법 |
| KR0157257B1 (ko) * | 1995-12-08 | 1998-11-16 | 정훈보 | 석출물 성장 억제형 고강도, 고전도성 동합금 및 그 제조방법 |
| JP4542008B2 (ja) * | 2005-06-07 | 2010-09-08 | 株式会社神戸製鋼所 | 表示デバイス |
| US7782413B2 (en) | 2007-05-09 | 2010-08-24 | Tohoku University | Liquid crystal display device and manufacturing method therefor |
| JP5121299B2 (ja) * | 2007-05-09 | 2013-01-16 | アルティアム サービシズ リミテッド エルエルシー | 液晶表示装置 |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5314612A (en) * | 1976-07-28 | 1978-02-09 | Toshiba Corp | Lead wire |
| US4191601A (en) * | 1979-02-12 | 1980-03-04 | Ampco-Pittsburgh Corporation | Copper-nickel-silicon-chromium alloy having improved electrical conductivity |
| JPS55104449A (en) * | 1979-02-02 | 1980-08-09 | Hitachi Ltd | High-strength high-electrically-conductive copper alloy with superior weldability |
| JPS55158246A (en) * | 1979-04-30 | 1980-12-09 | Delta Enfield Metals | Precipitation hardenable copper alloy |
| JPS56142840A (en) * | 1980-04-04 | 1981-11-07 | Hitachi Ltd | Copper alloy having minute crystal grain |
| JPS572851A (en) * | 1980-06-06 | 1982-01-08 | Nippon Mining Co Ltd | Copper alloy for lead material of semiconductor device |
-
1982
- 1982-01-20 JP JP606182A patent/JPS58124254A/ja active Granted
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5314612A (en) * | 1976-07-28 | 1978-02-09 | Toshiba Corp | Lead wire |
| JPS55104449A (en) * | 1979-02-02 | 1980-08-09 | Hitachi Ltd | High-strength high-electrically-conductive copper alloy with superior weldability |
| US4191601A (en) * | 1979-02-12 | 1980-03-04 | Ampco-Pittsburgh Corporation | Copper-nickel-silicon-chromium alloy having improved electrical conductivity |
| JPS55158246A (en) * | 1979-04-30 | 1980-12-09 | Delta Enfield Metals | Precipitation hardenable copper alloy |
| JPS56142840A (en) * | 1980-04-04 | 1981-11-07 | Hitachi Ltd | Copper alloy having minute crystal grain |
| JPS572851A (en) * | 1980-06-06 | 1982-01-08 | Nippon Mining Co Ltd | Copper alloy for lead material of semiconductor device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007100145A (ja) * | 2005-09-30 | 2007-04-19 | Dowa Holdings Co Ltd | 曲げ加工性と疲労特性を改善した銅合金板材 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58124254A (ja) | 1983-07-23 |
