JPS63140541A - 厚膜多層混成集積回路 - Google Patents

厚膜多層混成集積回路

Info

Publication number
JPS63140541A
JPS63140541A JP61287127A JP28712786A JPS63140541A JP S63140541 A JPS63140541 A JP S63140541A JP 61287127 A JP61287127 A JP 61287127A JP 28712786 A JP28712786 A JP 28712786A JP S63140541 A JPS63140541 A JP S63140541A
Authority
JP
Japan
Prior art keywords
conductor
layer
insulating plate
thick film
integrated circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP61287127A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0571177B2 (esLanguage
Inventor
Megumi Sakamaki
坂巻 恵
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP61287127A priority Critical patent/JPS63140541A/ja
Publication of JPS63140541A publication Critical patent/JPS63140541A/ja
Publication of JPH0571177B2 publication Critical patent/JPH0571177B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/5449
    • H10W90/754

Landscapes

  • Wire Bonding (AREA)
JP61287127A 1986-12-02 1986-12-02 厚膜多層混成集積回路 Granted JPS63140541A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61287127A JPS63140541A (ja) 1986-12-02 1986-12-02 厚膜多層混成集積回路

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61287127A JPS63140541A (ja) 1986-12-02 1986-12-02 厚膜多層混成集積回路

Publications (2)

Publication Number Publication Date
JPS63140541A true JPS63140541A (ja) 1988-06-13
JPH0571177B2 JPH0571177B2 (esLanguage) 1993-10-06

Family

ID=17713420

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61287127A Granted JPS63140541A (ja) 1986-12-02 1986-12-02 厚膜多層混成集積回路

Country Status (1)

Country Link
JP (1) JPS63140541A (esLanguage)

Also Published As

Publication number Publication date
JPH0571177B2 (esLanguage) 1993-10-06

Similar Documents

Publication Publication Date Title
JP3105089B2 (ja) 半導体装置
US5383093A (en) Hybrid integrated circuit apparatus
JP2737318B2 (ja) 混成集積回路装置
US12363823B2 (en) Stretchable mounting substrate
US5527999A (en) Multilayer conductor for printed circuits
JPS6256664B2 (esLanguage)
JP4013339B2 (ja) バンプを有する電子部品の製造方法
JPS63140541A (ja) 厚膜多層混成集積回路
JP2002373961A (ja) 樹脂封止型電子装置
JPH02164096A (ja) 多層電子回路基板とその製造方法
JP4465852B2 (ja) 低温焼成セラミック回路基板
JPH05226107A (ja) チップ抵抗器
JPH07106503A (ja) 半導体装置用パッケージおよび半導体装置
JP3337368B2 (ja) 中継基板
JP2572626Y2 (ja) 多層回路基板
JPH08241935A (ja) 多層回路基板
JP3859045B2 (ja) 半導体チップの実装構造
JPS6390113A (ja) 抵抗−コンデンサ複合部品
US20030034559A1 (en) Ball grid array package with electrically-conductive bridge
JP2830816B2 (ja) 樹脂封止型半導体装置
JP2004241732A5 (ja) 厚膜多層配線基板及びその製造方法
JPH04186758A (ja) リードフレームとそれを用いた電子回路装置
JP2743524B2 (ja) 混成集積回路装置
JPS6025910Y2 (ja) 半導体装置
JPS6329566A (ja) 半導体装置