JPS63139743A - Manufacture of laminated board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention is a method of laminating and forming multiple sets of laminated materials stacked on top of each other with mirror plates interposed between a set of hot plates. This is a method for manufacturing a laminate that significantly reduces the "warpage" that occurs in molded products (hereinafter referred to as base plate), and is particularly suitable for use in multilayer laminate molding.

[Conventional technology and its problems]

Normally, laminates are made by arranging multiple sets of laminate materials such as cushions, mirror plates, laminate materials, mirror plates... laminate materials, mirror plates, cushions, etc., and placing them in a laminate molding press, heating and processing them. Laminated and molded by pressure. At this time, it is known that the "warpage" of the upper and lower base plates closest to the heating plate is significantly larger than that of the other intermediate base plates.

Various methods have been taken to solve this "warp", but
There are advantages and disadvantages, and a more suitable solution was needed.

For example, by thickening the cushion and removing heat to slow down the heat transfer.
The slow cooling method has the disadvantage that the lamination molding time takes longer, and the method of inserting a dummy plate on the mother plate side reduces the production volume due to the handling of the dummy, and the method of reducing pressure during cooling has the disadvantage of In this case, especially when molding a multilayer board, the shrinkage of the inner layer pattern becomes large.

In addition, as a document that examines the mechanism of the occurrence of "warping", there is a book written by Chris James, "Physical Ca
use of Warp and Misregister
ation During Multilayer La
In the description, it is stated that ``Soriko improves the coefficient of thermal expansion of the mirror plate by bringing it closer to that of the laminated molding material, but in the case of actual laminated molding, as a mirror plate. , it is essential to prepare various laminated materials to match the coefficient of thermal expansion, which is not practical, and the "warpage" in this document is within the range of the comparative example of the present invention, However, it is still insufficient. In other words, the cause of this is only the mismatch in thermal expansion coefficient between the mirror plate and the laminated material.
It is thought that this is not the cause of the warpage, but is caused by other causes, such as a difference in the rate of heat transfer to the molded product.

[Means for solving problems]

The inventors of the present invention have carefully studied the "warpage" behavior of the base plate in laminated molding of multiple sets, and found that the convex part of the "warp" is usually directed toward the hot platen, so to prevent this, The present invention was achieved by discovering a method using a mirror plate closest to the heating plate and an intermediate mirror plate having different coefficients of thermal expansion.

That is, the present invention is a method of laminating and forming a large number of sets of laminated materials between press stages, in which mirror plates having a coefficient of thermal expansion larger than an intermediate mirror plate are arranged above and below in order to prevent warping of the molded product. This is a method for manufacturing a laminate plate characterized by the following, and it is particularly preferable to use a laminate material for multilayer laminate molding as the laminate material.

The configuration of the present invention will be explained below.

The mirror plate of the present invention may be made of stainless steel, iron, brass, aluminum, duralumin, or other metals, with stainless steel being particularly preferred in terms of hardness and coefficient of thermal expansion.

The thickness of the mirror plate used closest to the heating plate is approximately 1 to 1
0mm, the mirror plate used in the middle is about 1~2cm thick,
The difference in thermal expansion coefficient is 0.5 to 2. OXl0-'mm/mm/
A temperature of about ℃ is suitable.

The laminated material of the present invention is not particularly limited as long as it is a normal laminated material, but a multilayered laminated material with a complicated layer structure is particularly suitable.

〔Example〕

The present invention will be explained below with reference to Examples.

Example 1 A model pattern was formed on a glass epoxy double-sided copper-clad laminate with a base material thickness of 0.6 mm.A model pattern was formed on both sides of an inner layer wiring board with a base material thickness of 0.6 mm through 1172 sheets of glass epoxy resin each having a thickness of 0.1 mm. One set consists of 2++un glass epoxy single-sided copper clad laminates, and when inserting them with mirror plates, the mirror plates closest to the upper and lower heating plates are SO3304.
(Thermal expansion coefficient 13X10-'mm/mm/℃), the middle mirror plate is SOS 301 (Thermal expansion coefficient 12X 10-'
'mm/mm/t), a total of 6 sets of materials were inserted, the pressure was 40kg/c/, the temperature was 175°C, and the temperature was 90°C.
It was laminated and molded for minutes. Table 1 shows the results of measuring the "warpage" of the obtained multilayer board.

Example 2 In Example 1, the mirror plate closest to the upper and lower heating plates was SO3301 (thermal expansion coefficient 12X 10-'mm).
/mm/l), and the intermediate mirror plate was SO3630 (thermal expansion coefficient: 10 x 10-'mm/mm/t: ). The results are shown in Table 1, except that the same procedure was used.

Comparative Example 1 All mirror plates used were SO3304 (thermal expansion coefficient 13X1
m
It is shown in Table 1.

Comparative Example-2 All mirror plates used were SO3630 (thermal expansion coefficient 10X1
0-'mm/mm/t), but the same as Example 1.
The results obtained in the same manner as above are shown in Table 1.

From the comparison of Comparative Example 1.2, it can be seen that when the thermal expansion coefficient of the mirror plate is brought closer to that of the laminated material, the degree of "warpage" is reduced, but it is still insufficient.

Note) Book 1 After cutting the edges of the laminated molded product (330 x 500 mm), the base plate was taken out and the warpage rate was determined according to JIS C6481.

In addition, the code 1 in the table indicates that the warped convex surface of the molded product is directed toward the hot platen side, and the code - indicates the opposite.

[Operation and effects of the invention]

As is clear from the above detailed description, Examples, and Comparative Examples, according to the lamination molding method of the present invention, from among the existing mirror plates, a mirror plate used as an intermediate mirror plate to be used on the hot platen side of the mother plate. It is understood that by using a material with a coefficient of thermal expansion slightly larger than that of the face plate, the "warpage" of the base plate can be significantly improved, which is extremely excellent in practical terms.

Claims (1)

[Claims] 1. In a method for laminated molding in which multiple sets of laminated materials are placed between press stages, mirror plates having a coefficient of thermal expansion larger than that of an intermediate mirror plate are arranged above and below to prevent warping of the molded product. A method for manufacturing laminates characterized by: 2. The manufacturing method according to claim 1, wherein the laminate is a laminate for multilayer laminate molding.