JPH0951173A - Manufacture of copper clad laminated board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a copper clad laminated board which has smoother surface and better thickness accuracy compared with the case where metal foil is used by performing lamination by placing the piled laminating materials through mirror plane boards which have a specific thickness and a Rockwell hardness between the heating plates of a press. SOLUTION: Laminating material 4 of a double side copper clad laminated board is formed by, for example, overlapping four pieces of glass dilute epoxy prepreg and placing copper foil at the top and bottom of the overlapped prepreg. On the heating plate 1, a cushion 2 and a holding mirror plane board 5, which is 0.1-0.5mm thick, has a Rockwell T hardness (HR30T) of 50 or more and composed of, for example, stainless board, are subsequently placed, ten pieces of tin plates and the laminating material 4 are alternately piled, and a tin plate, a holding mirror plane board 5 and a cushion 2 are subsequently placed. Then, the laminating material is heat-pressed, for example, for 90 minutes in a vacuum press under a pressure of 20kg/cm<2> at 175 deg.C. Then, the temperature is reduced to 20 deg.C, and the laminating material is cooled for 40 minutes under the same pressure, and ten pieces of double side copper clad laminated boards are provided.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a copper clad laminate.

2. Description of the Related Art Conventionally, a copper clad laminate is a cushion, a holding mirror surface plate, a mirror surface plate, a laminated material, a mirror surface plate, a laminated material, a mirror surface plate, ...
... Manufactured by stacking laminated materials such as mirror plate, laminated material, holding mirror surface plate, and cushion, and sandwiching them between mirror surface plates, placing them in a laminating molding press, and laminating and molding by heating and pressing. At this time, a stainless plate having a thickness of 1 to 5 mm was usually used as the mirror plate, but in order to efficiently manufacture a large number of copper-clad laminates, a metal foil such as aluminum having a thickness of 30 to 500 μm was used. Also came to be used (Patent Fair 7-
(See 16963 publication).

[0002]

However, since the copper clad laminate manufactured by using the metal foil for all the mirror-finished plates has a reduced plate thickness accuracy, it is not possible to use all the mirror-finished plates as the metal foil. It was necessary to form a laminate by combining with a rigid stainless steel plate of about 1 to 3 mm.

Further, in a copper clad laminate with an inner layer circuit manufactured by using a metal foil, swelling of the inner layer circuit occurs, so that
The appearance was remarkably inferior, and defects could occur during the formation of the outer layer circuit.

In the present invention, a light-weight and high-rigidity metal plate is used for all mirror-finished plates to obtain a copper clad laminate having a smoother surface and more accurate plate thickness than the case where metal foil is used. It is intended to be provided.

[0005]

In order to achieve the above object, the present invention is a method for producing a copper clad laminate, characterized in that the above-mentioned metal plate is used for all mirror surface plates. The metal plate used in the present invention has a thickness of 0.1 mm to 0.5 mm and a Rockwell T hardness (HR30T) of 50 or more. Specifically, it is stainless steel, titanium, steel, tin plate or the like.

The laminated material used in the present invention includes a prepreg used for forming a copper clad laminate, an inner layer used for forming a copper clad laminate with an inner layer circuit, a prepreg used for multilayer adhesion and an outer layer formation, and a copper foil or one side. Any material such as a copper clad laminate can be used as long as it is within the conventionally known concept, and is not particularly limited.

Any lamination molding method can be used as long as it is within the conventionally known concept, and examples thereof include hot plate press, hot plate vacuum press, autoclave molding and continuous press.

[0008]

By using the above-mentioned metal plates for all mirror-finished plates, the surface becomes smoother than that using metal foils, and a copper clad laminate having a precise plate thickness can be obtained.

[0009]

【Example】

Example 1 An example in which a double-sided copper-clad laminate is prepared by using a tin plate will be described with reference to FIG. Component 4 of the double-sided copper clad laminate is a glass cloth epoxy prepreg with a thickness of 0.2 mm and 500 mm square.
A total thickness of 0.8 mm was obtained by stacking the sheets, and a copper foil having a thickness of 35 μm was placed above and below the stacked prepregs. Cushion 2, holding mirror surface plate 5 (stainless steel plate of thickness 1.5 mm: SU
S304) in order, and a tin plate (thickness 0.25 mm,
Rockwell T hardness 73), 10 components 4 are stacked alternately, and a tin plate (0.25 mm thick, Rockwell T hardness 73), holding mirror surface plate 5 (1.5 mm thick stainless steel) Board: SU
S304), and cushion 2 in that order, and heat and pressurize for 90 minutes in a vacuum press at a pressure of 20 kg / cm ² and a temperature of 175 ° C., and then cool at a pressure of 20 kg / cm ² and a temperature of 20 ° C. for 40 minutes. A double-sided copper clad laminate was obtained.

The thickness of the double-sided copper-clad laminate was measured with a micrometer, and the results are shown in (Table 1). The surface waviness was measured by a surface roughness meter, and the results are shown in (Table 2).

Example 2 An example in which a copper clad laminate with an inner layer circuit in which an inner layer circuit is formed of a copper foil having a thickness of 35 μm was prepared by using a tin plate will be described with reference to FIG. Component 4 of the copper clad laminate with inner layer circuit (4 layer plate) has a pattern with about 50% of copper residue on the thickness 0.8 mm, 500 mm square double-sided copper clad laminate (copper foil thickness
(35μm) 0.1mm and 500mm square glass cloth epoxy prepregs are stacked on top of each other, and the thickness is further above and below
An 18 μm copper foil was placed. Cushion 2 on the hot platen 1,
Place the holding mirror surface plate 5 (stainless steel plate with a thickness of 1.5 mm: SUS304) in that order, and stack the tin plate (thickness: 0.25 mm, Rockwell T hardness: 73) and component 4 alternately on top of it. , And a tin plate (0.25 mm thick, Rockwell T hardness 73) on it,
Holding mirror surface plate 5 (stainless steel plate with a thickness of 1.5 mm: SUS304),
Cushion 2 is piled up in order and pressure is 20kg / c in a vacuum press.
Heat and pressurize for 90 minutes at m ² and temperature of 175 ℃, then press
It was cooled at 20 kg / cm ² and a temperature of 20 ° C. for 40 minutes to obtain 10 copper clad laminates with inner layer circuits.

The amount of protrusion of the inner layer pattern of the copper clad laminate containing the inner layer circuit was measured by a surface roughness meter and is shown in (Table 3).

Example 3 An example in which a copper clad laminate with an inner layer circuit in which an inner layer circuit is formed of a copper foil having a thickness of 70 μm was prepared by using a tin plate will be described with reference to FIG. The thickness of the copper foil forming the inner layer circuit
The same as Example 2 except that it was 70 μm.

The amount of protrusion of the inner layer pattern of the copper clad laminate containing the inner layer circuit was measured by a surface roughness meter and is shown in (Table 3).

Comparative Example 1 A comparative example in which a double-sided copper-clad laminate is made of aluminum will be described with reference to FIG. Double-sided copper clad laminate component 4
Was the same as in Example 1. Cushion 2, holding mirror plate 5 (stainless steel plate with a thickness of 1.5 mm: SUS30) on the hot platen 1.
4) are placed in order, and aluminum (thickness 0.25mm
, Aluminum specification: 3004-H19), component 4 alternately 1
0 pieces are piled up and aluminum (thickness 0.25mm, aluminum specification: 3004-H19), holding mirror surface plate 5 (thickness 1.5
mm stainless plate: SUS304), cushion 2 are stacked in order, and heated and pressed for 90 minutes in a vacuum press under the conditions of pressure 20 kg / cm ² and temperature 175 ° C., then pressure 20 kg / cm ² and temperature 20 ° C.
After cooling for 40 minutes, 10 double-sided copper-clad laminates were obtained.

The plate thickness of the double-sided copper-clad laminate was measured with a micrometer, and the results are shown in (Table 1). The surface waviness was measured by a surface roughness meter, and the results are shown in (Table 2).

Comparative Example 2 An example in which a copper clad laminate with an inner layer circuit in which an inner layer circuit is formed of a copper foil having a thickness of 35 μm was made by using aluminum will be described with reference to FIG. Copper clad laminate with inner layer circuit (4
The component 4 of the layer plate) was the same as in Example 2. Cushion 2 and holding mirror surface plate 5 (1.5 mm thick stainless steel plate: SUS304) are placed in this order on the hot platen 1, and the aluminum plate (thickness 0.25 mm, aluminum specification: 3004-H19) is placed on top of it. 10 pieces of 4 are piled up alternately, and aluminum (thickness
0.25 mm, aluminum specification: 3004-H19), holding mirror plate 5 (stainless steel plate with a thickness of 1.5 mm: SUS304), cushion 2 are stacked in this order, and pressure is 20 kg / cm ² in vacuum press, and temperature is 175 ° C. And pressurize for 90 minutes, then pressure 20kg /
It was cooled at cm ^{2 at} a temperature of 20 ° C. for 40 minutes to obtain 10 copper clad laminates with inner layer circuits.

The amount of protrusion of the inner layer pattern of the copper clad laminate containing the inner layer circuit was measured by a surface roughness meter and is shown in (Table 3).

Comparative Example 3 An example in which a copper clad laminate with an inner layer circuit in which an inner layer circuit is formed of a copper foil having a thickness of 70 μm was made by using aluminum will be described with reference to FIG. The same as Comparative Example 2 except that the thickness of the copper foil forming the inner layer circuit was 70 μm.

The amount of protrusion of the inner layer pattern of the copper clad laminate containing the inner layer circuit was measured by a surface roughness meter and is shown in (Table 3).

[0021]

[Table 1] Sheet thickness measurement results of double-sided copper clad laminates in Examples and Comparative Examples Item Example 1 Comparative Example 1 Average value (mm) 0.874 0.875 Maximum value (mm) 0.911 0.920 Minimum value (mm) 0.843 0.828 Maximum Value-Minimum value (mm) 0.068 0.092 Standard deviation (mm) 0.016 0.026

[0022]

[Table 2] Surface waviness measurement results of double-sided copper clad laminates in Examples and Comparative Examples Item Example 1 Comparative Example 1 Surface waviness (μm) 2.5 10.0

[0023]

[Table 3] Results of measurement of inner layer pattern protrusion amount [μm] in Examples and Comparative Examples Item Example 2 Comparative Example 2 Example 3 Comparative Example 3 Inner layer copper foil thickness (μm) 35 35 70 70 Inner layer pattern protrusion amount ( μm) 1.5 4.3 3.0 9.0

[0024]

According to the present invention, a copper clad laminate having a smooth surface and good plate thickness accuracy can be obtained with high productivity, as compared with the conventional manufacturing method using a metal foil.

[Brief description of drawings]

FIG. 1 is a schematic view showing a laminated structure of laminated materials. The specular plate 3 is a tin plate in the examples, and is an aluminum plate in the comparative examples.

[Explanation of symbols]

 1: Hot plate, 2: Cushion, 3: Mirror surface plate, 4: Components, 5: Holding mirror surface plate.

Claims (1)

[Claims] 1. A method for producing a copper clad laminate by laminating and laminating laminated materials which are laminated via a mirror surface plate between press heating plates, wherein all mirror surface plates have a thickness of 0.1 mm to 0.5 mm and Rockwell. A method for producing a copper-clad laminate, which comprises using a metal plate having a T hardness (HR30T) of 50 or more.