JPH0951173A - Manufacture of copper clad laminated board - Google Patents

Manufacture of copper clad laminated board

Info

Publication number
JPH0951173A
JPH0951173A JP20090395A JP20090395A JPH0951173A JP H0951173 A JPH0951173 A JP H0951173A JP 20090395 A JP20090395 A JP 20090395A JP 20090395 A JP20090395 A JP 20090395A JP H0951173 A JPH0951173 A JP H0951173A
Authority
JP
Japan
Prior art keywords
thickness
plate
copper clad
clad laminate
mm
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP20090395A
Other languages
Japanese (ja)
Inventor
Sadahiro Kato
Yoshihiko Sekine
Hiroyuki Urabe
禎啓 加藤
博之 浦部
良彦 関根
Original Assignee
Mitsubishi Gas Chem Co Inc
三菱瓦斯化学株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Gas Chem Co Inc, 三菱瓦斯化学株式会社 filed Critical Mitsubishi Gas Chem Co Inc
Priority to JP20090395A priority Critical patent/JPH0951173A/en
Publication of JPH0951173A publication Critical patent/JPH0951173A/en
Pending legal-status Critical Current

Links

Abstract

(57) 【Abstract】 PROBLEM TO BE SOLVED: To provide a more inexpensive manufacturing method of copper clad laminates having good thickness, surface waviness, and the like. SOLUTION: In a manufacturing method of a copper clad laminate by charging and laminating laminated materials laminated via a mirror surface plate between press hot plates, all mirror surface plates have a thickness of 0.1 to 0.5 mm and a Rockwell T hardness. A method for producing a copper-clad laminate, characterized in that (HR30T) 50 or more metal plates are used.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a copper clad laminate.

2. Description of the Related Art Conventionally, a copper clad laminate is a cushion, a holding mirror surface plate, a mirror surface plate, a laminated material, a mirror surface plate, a laminated material, a mirror surface plate, ...
... Manufactured by stacking laminated materials such as mirror plate, laminated material, holding mirror surface plate, and cushion, and sandwiching them between mirror surface plates, placing them in a laminating molding press, and laminating and molding by heating and pressing. At this time, a stainless plate having a thickness of 1 to 5 mm was usually used as the mirror plate, but in order to efficiently manufacture a large number of copper-clad laminates, a metal foil such as aluminum having a thickness of 30 to 500 μm was used. Also came to be used (Patent Fair 7-
(See 16963 publication).

[0002]

However, since the copper clad laminate manufactured by using the metal foil for all the mirror-finished plates has a reduced plate thickness accuracy, it is not possible to use all the mirror-finished plates as the metal foil. It was necessary to form a laminate by combining with a rigid stainless steel plate of about 1 to 3 mm.

Further, in a copper clad laminate with an inner layer circuit manufactured by using a metal foil, swelling of the inner layer circuit occurs, so that
The appearance was remarkably inferior, and defects could occur during the formation of the outer layer circuit.

In the present invention, a light-weight and high-rigidity metal plate is used for all mirror-finished plates to obtain a copper clad laminate having a smoother surface and more accurate plate thickness than the case where metal foil is used. It is intended to be provided.

[0005]

In order to achieve the above object, the present invention is a method for producing a copper clad laminate, characterized in that the above-mentioned metal plate is used for all mirror surface plates. The metal plate used in the present invention has a thickness of 0.1 mm to 0.5 mm and a Rockwell T hardness (HR30T) of 50 or more. Specifically, it is stainless steel, titanium, steel, tin plate or the like.

The laminated material used in the present invention includes a prepreg used for forming a copper clad laminate, an inner layer used for forming a copper clad laminate with an inner layer circuit, a prepreg used for multilayer adhesion and an outer layer formation, and a copper foil or one side. Any material such as a copper clad laminate can be used as long as it is within the conventionally known concept, and is not particularly limited.

Any lamination molding method can be used as long as it is within the conventionally known concept, and examples thereof include hot plate press, hot plate vacuum press, autoclave molding and continuous press.

[0008]

By using the above-mentioned metal plates for all mirror-finished plates, the surface becomes smoother than that using metal foils, and a copper clad laminate having a precise plate thickness can be obtained.

[0009]

【Example】

Example 1 An example in which a double-sided copper-clad laminate is prepared by using a tin plate will be described with reference to FIG. Component 4 of the double-sided copper clad laminate is a glass cloth epoxy prepreg with a thickness of 0.2 mm and 500 mm square.
A total thickness of 0.8 mm was obtained by stacking the sheets, and a copper foil having a thickness of 35 μm was placed above and below the stacked prepregs. Cushion 2, holding mirror surface plate 5 (stainless steel plate of thickness 1.5 mm: SU
S304) in order, and a tin plate (thickness 0.25 mm,
Rockwell T hardness 73), 10 components 4 are stacked alternately, and a tin plate (0.25 mm thick, Rockwell T hardness 73), holding mirror surface plate 5 (1.5 mm thick stainless steel) Board: SU
S304), and cushion 2 in that order, and heat and pressurize for 90 minutes in a vacuum press at a pressure of 20 kg / cm 2 and a temperature of 175 ° C., and then cool at a pressure of 20 kg / cm 2 and a temperature of 20 ° C. for 40 minutes. A double-sided copper clad laminate was obtained.

The thickness of the double-sided copper-clad laminate was measured with a micrometer, and the results are shown in (Table 1). The surface waviness was measured by a surface roughness meter, and the results are shown in (Table 2).

Example 2 An example in which a copper clad laminate with an inner layer circuit in which an inner layer circuit is formed of a copper foil having a thickness of 35 μm was prepared by using a tin plate will be described with reference to FIG. Component 4 of the copper clad laminate with inner layer circuit (4 layer plate) has a pattern with about 50% of copper residue on the thickness 0.8 mm, 500 mm square double-sided copper clad laminate (copper foil thickness
(35μm) 0.1mm and 500mm square glass cloth epoxy prepregs are stacked on top of each other, and the thickness is further above and below
An 18 μm copper foil was placed. Cushion 2 on the hot platen 1,
Place the holding mirror surface plate 5 (stainless steel plate with a thickness of 1.5 mm: SUS304) in that order, and stack the tin plate (thickness: 0.25 mm, Rockwell T hardness: 73) and component 4 alternately on top of it. , And a tin plate (0.25 mm thick, Rockwell T hardness 73) on it,
Holding mirror surface plate 5 (stainless steel plate with a thickness of 1.5 mm: SUS304),
Cushion 2 is piled up in order and pressure is 20kg / c in a vacuum press.
Heat and pressurize for 90 minutes at m 2 and temperature of 175 ℃, then press
It was cooled at 20 kg / cm 2 and a temperature of 20 ° C. for 40 minutes to obtain 10 copper clad laminates with inner layer circuits.

The amount of protrusion of the inner layer pattern of the copper clad laminate containing the inner layer circuit was measured by a surface roughness meter and is shown in (Table 3).

Example 3 An example in which a copper clad laminate with an inner layer circuit in which an inner layer circuit is formed of a copper foil having a thickness of 70 μm was prepared by using a tin plate will be described with reference to FIG. The thickness of the copper foil forming the inner layer circuit
The same as Example 2 except that it was 70 μm.

The amount of protrusion of the inner layer pattern of the copper clad laminate containing the inner layer circuit was measured by a surface roughness meter and is shown in (Table 3).

Comparative Example 1 A comparative example in which a double-sided copper-clad laminate is made of aluminum will be described with reference to FIG. Double-sided copper clad laminate component 4
Was the same as in Example 1. Cushion 2, holding mirror plate 5 (stainless steel plate with a thickness of 1.5 mm: SUS30) on the hot platen 1.
4) are placed in order, and aluminum (thickness 0.25mm
, Aluminum specification: 3004-H19), component 4 alternately 1
0 pieces are piled up and aluminum (thickness 0.25mm, aluminum specification: 3004-H19), holding mirror surface plate 5 (thickness 1.5
mm stainless plate: SUS304), cushion 2 are stacked in order, and heated and pressed for 90 minutes in a vacuum press under the conditions of pressure 20 kg / cm 2 and temperature 175 ° C., then pressure 20 kg / cm 2 and temperature 20 ° C.
After cooling for 40 minutes, 10 double-sided copper-clad laminates were obtained.

The plate thickness of the double-sided copper-clad laminate was measured with a micrometer, and the results are shown in (Table 1). The surface waviness was measured by a surface roughness meter, and the results are shown in (Table 2).

Comparative Example 2 An example in which a copper clad laminate with an inner layer circuit in which an inner layer circuit is formed of a copper foil having a thickness of 35 μm was made by using aluminum will be described with reference to FIG. Copper clad laminate with inner layer circuit (4
The component 4 of the layer plate) was the same as in Example 2. Cushion 2 and holding mirror surface plate 5 (1.5 mm thick stainless steel plate: SUS304) are placed in this order on the hot platen 1, and the aluminum plate (thickness 0.25 mm, aluminum specification: 3004-H19) is placed on top of it. 10 pieces of 4 are piled up alternately, and aluminum (thickness
0.25 mm, aluminum specification: 3004-H19), holding mirror plate 5 (stainless steel plate with a thickness of 1.5 mm: SUS304), cushion 2 are stacked in this order, and pressure is 20 kg / cm 2 in vacuum press, and temperature is 175 ° C. And pressurize for 90 minutes, then pressure 20kg /
It was cooled at cm 2 at a temperature of 20 ° C. for 40 minutes to obtain 10 copper clad laminates with inner layer circuits.

The amount of protrusion of the inner layer pattern of the copper clad laminate containing the inner layer circuit was measured by a surface roughness meter and is shown in (Table 3).

Comparative Example 3 An example in which a copper clad laminate with an inner layer circuit in which an inner layer circuit is formed of a copper foil having a thickness of 70 μm was made by using aluminum will be described with reference to FIG. The same as Comparative Example 2 except that the thickness of the copper foil forming the inner layer circuit was 70 μm.

The amount of protrusion of the inner layer pattern of the copper clad laminate containing the inner layer circuit was measured by a surface roughness meter and is shown in (Table 3).

[0021]

[Table 1] Sheet thickness measurement results of double-sided copper clad laminates in Examples and Comparative Examples Item Example 1 Comparative Example 1 Average value (mm) 0.874 0.875 Maximum value (mm) 0.911 0.920 Minimum value (mm) 0.843 0.828 Maximum Value-Minimum value (mm) 0.068 0.092 Standard deviation (mm) 0.016 0.026

[0022]

[Table 2] Surface waviness measurement results of double-sided copper clad laminates in Examples and Comparative Examples Item Example 1 Comparative Example 1 Surface waviness (μm) 2.5 10.0

[0023]

[Table 3] Results of measurement of inner layer pattern protrusion amount [μm] in Examples and Comparative Examples Item Example 2 Comparative Example 2 Example 3 Comparative Example 3 Inner layer copper foil thickness (μm) 35 35 70 70 Inner layer pattern protrusion amount ( μm) 1.5 4.3 3.0 9.0

[0024]

According to the present invention, a copper clad laminate having a smooth surface and good plate thickness accuracy can be obtained with high productivity, as compared with the conventional manufacturing method using a metal foil.

[Brief description of drawings]

FIG. 1 is a schematic view showing a laminated structure of laminated materials. The specular plate 3 is a tin plate in the examples, and is an aluminum plate in the comparative examples.

[Explanation of symbols]

 1: Hot plate, 2: Cushion, 3: Mirror surface plate, 4: Components, 5: Holding mirror surface plate.

Claims (1)

[Claims]
1. A method for producing a copper clad laminate by laminating and laminating laminated materials which are laminated via a mirror surface plate between press heating plates, wherein all mirror surface plates have a thickness of 0.1 mm to 0.5 mm and Rockwell. A method for producing a copper-clad laminate, which comprises using a metal plate having a T hardness (HR30T) of 50 or more.
JP20090395A 1995-08-07 1995-08-07 Manufacture of copper clad laminated board Pending JPH0951173A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20090395A JPH0951173A (en) 1995-08-07 1995-08-07 Manufacture of copper clad laminated board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20090395A JPH0951173A (en) 1995-08-07 1995-08-07 Manufacture of copper clad laminated board

Publications (1)

Publication Number Publication Date
JPH0951173A true JPH0951173A (en) 1997-02-18

Family

ID=16432185

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20090395A Pending JPH0951173A (en) 1995-08-07 1995-08-07 Manufacture of copper clad laminated board

Country Status (1)

Country Link
JP (1) JPH0951173A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6977348B2 (en) 2002-05-28 2005-12-20 Via Technologies, Inc. High density laminated substrate structure and manufacture method thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6977348B2 (en) 2002-05-28 2005-12-20 Via Technologies, Inc. High density laminated substrate structure and manufacture method thereof

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