JPH03138142A - Preparation of metal-based laminated sheet - Google Patents
Preparation of metal-based laminated sheetInfo
- Publication number
- JPH03138142A JPH03138142A JP1278001A JP27800189A JPH03138142A JP H03138142 A JPH03138142 A JP H03138142A JP 1278001 A JP1278001 A JP 1278001A JP 27800189 A JP27800189 A JP 27800189A JP H03138142 A JPH03138142 A JP H03138142A
- Authority
- JP
- Japan
- Prior art keywords
- metal
- laminates
- plates
- laminate
- piled
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 53
- 239000002184 metal Substances 0.000 title claims abstract description 53
- 239000011888 foil Substances 0.000 claims abstract description 17
- 238000000465 moulding Methods 0.000 claims abstract description 16
- 239000011347 resin Substances 0.000 claims abstract description 15
- 229920005989 resin Polymers 0.000 claims abstract description 15
- 238000004519 manufacturing process Methods 0.000 claims description 13
- 238000000034 method Methods 0.000 claims description 4
- 238000010030 laminating Methods 0.000 abstract description 3
- 239000010410 layer Substances 0.000 description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 10
- 229910052782 aluminium Inorganic materials 0.000 description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 8
- 238000007796 conventional method Methods 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 239000011889 copper foil Substances 0.000 description 4
- 238000003475 lamination Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000010935 stainless steel Substances 0.000 description 4
- 229910001220 stainless steel Inorganic materials 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 3
- 229910000976 Electrical steel Inorganic materials 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 239000000123 paper Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Abstract
Description
【発明の詳細な説明】
(産業上の利用分野)
この発明は、金属ベース積層板の製造方法に関するもの
である。さらに詳しくは、この発明は、電気・電子機器
、計算機、通信機器等に用いられるプリント配線板用の
金属ベース積層板を高生産性で製造することのできる新
しい製造方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION (Industrial Field of Application) The present invention relates to a method of manufacturing a metal-based laminate. More specifically, the present invention relates to a new manufacturing method capable of manufacturing metal-based laminates for printed wiring boards used in electrical/electronic equipment, computers, communication equipment, etc. with high productivity.
(従来の技術)
従来より、電気・電子機器、計算機、通信機器等には各
種の構成からなるプリント配線板が用いられてきており
、このようなプリント配線板の一種として、機械的強度
、耐熱性、電気特性等の良好な金属ベースプリント配線
板が知られている。(Prior art) Printed wiring boards with various configurations have been used in electrical and electronic equipment, computers, communication equipment, etc., and as a type of printed wiring board, mechanical strength, heat resistance, Metal-based printed wiring boards with good properties such as physical properties and electrical properties are known.
これらのプリント配線板は、たとえば第2図に示したよ
うに、鉄、アルミニウム等の金属もしくはステンレス、
珪素鋼等の合金、さらにはアルミニウム被覆銅などの複
合材からなる金属板(ア)の上に樹脂フィルム、樹脂含
浸基材等からなる樹脂層(イ)を介して銅、アルミニウ
ム等の金属箔(つ)を積層一体止したものからなってい
る。These printed wiring boards are made of metals such as iron, aluminum, stainless steel, etc., as shown in Figure 2, for example.
A metal foil made of copper, aluminum, etc. is placed on a metal plate (a) made of an alloy such as silicon steel, or a composite material such as aluminum-coated copper, with a resin layer (b) made of a resin film, resin-impregnated base material, etc. It consists of (2) laminated and fixed together.
また、このような金属ベース積層板は、この第2図に示
したように、金属板(ア)、樹脂層(イ)および金属箔
(つ)からなる積層体(1)の−枚づつを、金型プレー
ト(オ)の間に入れて加圧加熱して一体化成形して製造
することが一般的でもある。Furthermore, as shown in FIG. 2, such a metal base laminate is made by stacking each of the laminates (1) consisting of a metal plate (A), a resin layer (B), and a metal foil (X). It is also common to manufacture it by placing it between mold plates (e) and pressurizing and heating it to form an integral mold.
(発明が解決しようとする課題)
しかしながら、この従来の金属ベース積層板の製造方法
においては、加圧加熱積層成形時の熱盤間のデーライト
が一定であることから、積層体(1)と金型プレート(
オ)とを交互に積載していくと、金型プレート(オ)の
厚さは非常に大きなものとなり、この厚さ分に相当する
積層体(1)の成形ができなくなるという欠点があった
。(Problem to be Solved by the Invention) However, in this conventional method for manufacturing metal-based laminates, since the daylight between the hot platens during pressure-heating laminate molding is constant, the laminate (1) Mold plate (
If the mold plates (e) and (e) are stacked alternately, the thickness of the mold plate (e) becomes extremely large, which has the disadvantage that it becomes impossible to mold a laminate (1) corresponding to this thickness. .
このため、金属ベース積層板の積層成形時に使用する金
型プレートの枚数を削減し、その削減分だけ、積層板の
成形製品数を増すための工夫が必要になっているが、こ
れまでのところ、このような課題を解決するに有効な手
段は見出されていないのが実情である。For this reason, it is necessary to reduce the number of mold plates used during lamination molding of metal-based laminates, and to increase the number of molded laminate products by the reduction. The reality is that no effective means have been found to solve these problems.
この発明は、以上の通りの事情に鑑みてなされたもので
あり、従来の積層成形法の欠点を解消し、生産性に優れ
た金属ベース積層板の新しい製造法を提供することを目
的としている。This invention was made in view of the above-mentioned circumstances, and aims to eliminate the drawbacks of the conventional laminate forming method and provide a new manufacturing method for metal-based laminates with excellent productivity. .
(課題を解決するための手段)
この発明は、上記の課題を解決するものとして、金属板
上に樹脂層を介して金属箔を載置した積層板を金属板の
相互当接により重ね合わせ、この重ね合わせた一対の積
層板をさらに金属箔の相互当接により所要枚数重ね、こ
れを金型プレート間に挿入して積層成形することを特徴
とする金属ベース槓層板の製造方法を提供する。(Means for Solving the Problems) The present invention solves the above problems by laminating a laminate in which a metal foil is placed on a metal plate through a resin layer by abutting the metal plates against each other. To provide a method for producing a metal base laminate, which comprises further stacking a required number of the paired laminates by abutting metal foils against each other, and inserting the stacked laminates between mold plates to perform laminate molding. .
(作 用)
この発明の方法においては、金属板、樹脂層および金属
箔からなる積層板を、その金属板相互を対向当接させて
重ね合わせ、さらに最外層の金属箔の相互当接によって
所要枚数重ねた積層板を金型プレート間に挿入するため
、従来法に比べて、金型プレート枚数を大きく削減する
ことができる。(Function) In the method of the present invention, a laminated plate consisting of a metal plate, a resin layer, and a metal foil is stacked with the metal plates facing each other and in contact with each other, and the outermost layer of metal foil is further brought into contact with each other to achieve the desired effect. Since a number of laminated plates are inserted between the mold plates, the number of mold plates can be greatly reduced compared to the conventional method.
金型プレートは、金属箔の成形時の損傷や積層板の変形
を抑え、かつ、熱伝導性を良好とするために用いられて
いるが、積層板の金属板相互の当接、重ね合わせ、さら
に金属箔面の当接、重ね合わせによって、所要の特性を
損うことなく、しかも優れた生産性の加圧加熱成形が可
能とする。Mold plates are used to suppress damage to the metal foil and deformation of the laminate during molding, and to improve thermal conductivity. Furthermore, by contacting and overlapping the metal foil surfaces, pressure and heat molding can be performed with excellent productivity without impairing the required properties.
以下、添付した図面に沿ってこの発明の製造方法をさら
に詳しく説明する。Hereinafter, the manufacturing method of the present invention will be explained in more detail with reference to the attached drawings.
(実施例) 第1図は、この発明の一例を示したものである。(Example) FIG. 1 shows an example of this invention.
この例に示したように、
(a) まず、鉄、アルミニウム、銅等の金属、また
はステンレス、珪素鋼等の合金、あるいはアルミニウム
被覆銅、クロムメツキや亜鉛メツキ等の複合材からなり
、その厚みが、たとえば0.5〜2.OBの金属板(1
)の上に、樹脂層(2)を介して金属箔(3)を載置す
る。As shown in this example, (a) First, it is made of metals such as iron, aluminum, and copper, or alloys such as stainless steel and silicon steel, or composite materials such as aluminum-coated copper, chrome plating, and zinc plating. , for example 0.5 to 2. OB metal plate (1
), a metal foil (3) is placed on top of the resin layer (2).
この場合の樹脂層(2)としては、フェノール樹脂、不
飽和ポリエステル樹脂、エポキシ樹脂、ポリイミド樹脂
、弗素樹脂等の樹脂を含浸したガラス、布、紙等の基材
からなる樹脂含浸基材、樹脂の塗布、樹脂シート等の単
独、またはその組合せによって形成する。t!l脂層(
2)の厚みを確保する上からは、樹脂含浸基材により構
成するのが好ましい。In this case, the resin layer (2) is a resin-impregnated base material made of glass, cloth, paper, etc., impregnated with resin such as phenol resin, unsaturated polyester resin, epoxy resin, polyimide resin, or fluororesin; Formed by coating, resin sheet, etc. alone, or a combination thereof. T! l fat layer (
In order to ensure the thickness of 2), it is preferable to use a resin-impregnated base material.
また、金属箔については、金属板と同様の素材から選択
し、その厚みを0.018〜0.07m5+とするのが
好ましい、必要に応じて樹脂層〈2)への接着面に接着
層を形成しておく。Regarding the metal foil, it is preferable to select it from the same material as the metal plate, and to have a thickness of 0.018 to 0.07m5+. If necessary, an adhesive layer may be added to the adhesive surface to the resin layer (2). Form it.
(b) このようにして得られた積層板(4)の2枚
を、金属板(1)の相互当接により重ね合わせる。一対
の重ね合せ積層板(5)とする。(b) Two of the thus obtained laminate plates (4) are overlapped by mutually abutting the metal plates (1). A pair of laminated plates (5) are formed.
この重ね合わせ積層板(5)を、所要枚数、この第1図
の例においては3枚、最外層の銅箔(3)が相互当接す
るように重ね合せ、厚み0.5〜4mnの、鉄、アルミ
ニウム、ステンレス、銅等の板体からなる金型プレート
(6)間に挿入する。The required number of stacked laminates (5), three in the example shown in Fig. 1, are stacked so that the outermost copper foils (3) are in contact with each other, and , inserted between mold plates (6) made of plates such as aluminum, stainless steel, copper, etc.
積層板(4〉の最外層の金属箔(3)にはこの金型プレ
ート(6)が当接する。This mold plate (6) comes into contact with the outermost metal foil (3) of the laminate (4>).
この状態において、熱盤ブレスにより加圧加熱積層成形
を行う。たとえば、成形圧力は30〜80kg/cj、
成形温度150〜(d)
(c)
180℃、成形時間40〜120分間程度とすることが
できる。In this state, pressure and heating lamination molding is performed using a hot platen press. For example, the molding pressure is 30 to 80 kg/cj,
The molding temperature can be 150 to (d) (c) 180° C., and the molding time can be about 40 to 120 minutes.
(e) 積層成形の終了後には、各々分割剥離して目
的とする金属ベース積層板を得る。(e) After the lamination molding is completed, each layer is separated and peeled to obtain the desired metal base laminate.
以上の製造工程を次に具体的に金属ベース積層板の製造
例として示す。The above manufacturing process will now be specifically described as an example of manufacturing a metal base laminate.
く製造例〉
第1図に示した方法に沿って金属ベース積層板を製造し
た。Manufacturing Example> A metal base laminate was manufactured according to the method shown in FIG.
まず、厚み1.0市のアルミニウム板に、厚み、0.1
市のエポキシ樹脂含浸ガラスクロス、および厚み0.0
35 mmの銅箔を載置して、積層板(4)を形成した
。First, on an aluminum plate with a thickness of 1.0 city, a thickness of 0.1
City epoxy resin impregnated glass cloth, and thickness 0.0
A 35 mm copper foil was placed to form a laminate (4).
この積層板(4)のアルミニウム板を相互に当接して、
2枚の積層板(4)を重ね合わせた。得られた重ね合わ
せ積層板(5)の3枚を、その銅箔面において当接して
重ね合わせ、これを厚み2圓のステンレス板の間に挿入
し、この状態において成形圧力40kH/ai、温度1
65°Cの条件下に、90分間、加圧加熱積層成形した
。The aluminum plates of this laminate (4) are brought into contact with each other,
Two laminates (4) were stacked on top of each other. Three of the obtained laminated laminates (5) were stacked with their copper foil surfaces in contact with each other, and this was inserted between two stainless steel plates with a thickness of 2 mm. In this state, the molding pressure was 40 kHz/ai and the temperature was 1.
Pressure and heat lamination molding was performed at 65°C for 90 minutes.
次いで、各々の積層板(4)を分割し、目的の金属ベー
ス積層板を得た。Next, each laminate (4) was divided to obtain the desired metal base laminate.
銅箔への損傷や、成形時の特性劣化は認められなかった
。No damage to the copper foil or deterioration of properties during molding was observed.
このようにして、従来方法に比べて、多数の金属ベース
積層板のより高効率での生産が可能となった。 もちろ
ん、この発明は、以上の例によって限定されるものでは
ない、、4111部について様々な態様が可能であるこ
とはいうまでもない。In this way, it is possible to produce a large number of metal-based laminates with higher efficiency than with conventional methods. Of course, the present invention is not limited to the above examples, and it goes without saying that the 4111 part can be modified in various ways.
(発明の効果)
この発明により、以上詳しく説明した通り、金属ベース
積層板を金型プレートと交互に重ねて成形していた従来
法に比べて、はるかに高効率での生産が可能となる。金
型プレートの使用枚数を削減し、その厚み分だけ積層板
の成形が可能になる。(Effects of the Invention) As explained in detail above, the present invention enables production with much higher efficiency than the conventional method in which metal base laminates are alternately stacked and molded with mold plates. The number of mold plates used can be reduced, and laminates can be formed with the same thickness.
金属ベース積層板の生産性は大きく向上する。The productivity of metal-based laminates is greatly improved.
第1図は、この発明の一実施例を示した積層板と金属プ
レートとの重ね合わせ断面図である。
第2図は、従来法におけるこの重ね合わせ状態を示した
断面図である。
1・・・金 属 板
2・・・樹 脂 層
3・・・金 属 箔
4・・・積 層 板
5・・・重ね合わせ積層板
6・・・金型プレート
第 1
図FIG. 1 is a cross-sectional view of a laminated plate and a metal plate stacked together, showing one embodiment of the present invention. FIG. 2 is a sectional view showing this overlapping state in the conventional method. 1... Metal plate 2... Resin layer 3... Metal foil 4... Laminated plate 5... Laminated laminate plate 6... Mold plate Fig. 1
Claims (1)
層板を金属板の相互当接によって重ね合わせ、この重ね
合せた一対の積層板をさらに金属箔の相互当接により所
要枚数重ね、これを金型プレート間に挿入して積層成形
することを特徴とする金属ベース積層板の製造方法。(1) Laminated plates in which metal foil is placed on metal plates via a resin layer are overlapped by mutual contact of the metal plates, and the required number of laminated plates are further stacked by mutual contact of the metal foils. A method for manufacturing a metal base laminate, which comprises stacking the sheets and inserting them between mold plates for laminated molding.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1278001A JPH03138142A (en) | 1989-10-25 | 1989-10-25 | Preparation of metal-based laminated sheet |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1278001A JPH03138142A (en) | 1989-10-25 | 1989-10-25 | Preparation of metal-based laminated sheet |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH03138142A true JPH03138142A (en) | 1991-06-12 |
Family
ID=17591247
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1278001A Pending JPH03138142A (en) | 1989-10-25 | 1989-10-25 | Preparation of metal-based laminated sheet |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH03138142A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4714796B1 (en) * | 2010-08-20 | 2011-06-29 | 紳一 中光 | Portable or body-mounted fracture treatment device |
-
1989
- 1989-10-25 JP JP1278001A patent/JPH03138142A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4714796B1 (en) * | 2010-08-20 | 2011-06-29 | 紳一 中光 | Portable or body-mounted fracture treatment device |
JP2012040228A (en) * | 2010-08-20 | 2012-03-01 | Shinichi Nakamitsu | Portable or wearable fracture treatment device |
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