JPS59152858A - Manufacture of laminated board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing a laminate, the purpose of which is to reduce warping of the laminate located near a hot platen during molding.

Generally, the laminate is manufactured as follows. First, a base material such as paper or glass cloth is impregnated with a thermosetting resin to produce a B-stage prepreg. 1 of that prepreg
Layer one or more sheets, overlap copper foil, etc. as necessary, and sandwich this with mirror plates. After putting these 6 to 8 pairs between the heating plates.

Manufactured by heating and pressing.

By the way, in the production of printed wiring boards.

Recently, the design of a single circuit has become more dense, and at the same time automation of the manufacturing process is progressing. Therefore, strict requirements are placed on suppressing the warpage of a laminate to which copper foil or the like is pasted to be subjected to carbon cracking. However, 1. Normally, in order to increase productivity in the production of laminates, multiple sets of prepregs sandwiched between mirror plates are placed between hot platens, and FF (m-plates) are formed near the hot platen. The warpage was thicker than that of a laminate formed in the center between the hot platens, and this tended to cause problems when processing printed wiring boards.

As a result of intensive research to solve these problems, the present invention was developed by making the thickness of the mirror plate located near the heating plate thicker than that of the mirror plate located in the center between the heating plates. We have discovered a method for manufacturing laminates that can reduce the warpage of laminates formed near the hot plate to the same level as laminates formed in the center without deteriorating the properties of the board as a whole. This is thought to be due to the use of a thick mirrored plate located near the hot platen, which makes the molding pressure and heat conduction of the laminate plate uniform near the hot platen. .

It is sufficient to thicken the cough mirror plate closest to the heating plate, but it is also possible to gradually increase the thickness as it gets closer to the heating plate.However, if the thickness of the cough plate exceeds 8%, it will become heavy. This poses a problem in terms of safety and workability.The material of the end plate is not particularly limited, but one with high hardness is desirable.Usually.

Stainless steel plate is used.

Examples of the present invention will be described.

EXAMPLE A 3% thick stainless steel plate was used as the mirror plate closest to the heating plate, and a 1.5% thick stainless steel plate was used as the other mirror plates. 8 sheets of paper-phenol prepreg are stacked on top of each other with 3 sheets on each side.
Eight sets of 5 μm copper foil arranged and sandwiched between mirror plates were placed between hot platens, and heated and pressure molded using 20 sheets of kraft paper cushioning material at a pressure of 1 oov/i for 70 minutes.

Comparative Example 1 The mirror plate closest to the heating plate and the other mirror plates were made of stainless steel plates with a thickness of 15 to 15, and the other molding was the same as in the example.

Comparative Example 2 A 1% thick stainless steel plate was used as the mirror plate closest to the heating plate, and a 15~15 mm thick stainless steel plate was used as the other mirror plates, and the other molding was the same as in the example.

16-thick double-sided No. 1 obtained in the above Examples and Comparative Examples
In addition, solder resistance and insulation resistance were measured in accordance with JTSC6481. The amount of warpage was determined by etching the entire surface of a 400x400% test piece and measuring the warpage after heating at 150°C for 30 minutes in accordance with JIS 06481.

As is clear from Table 1, according to the present invention, the present invention has heat resistance and electrical insulation properties equivalent to those of the conventional ones, and furthermore, it is possible to suppress the warpage of the laminated plate formed near the heating plate. In fact, its industrial value is extremely large.

patent applicant

Claims (1)

[Claims] In the manufacture of laminates, in which multiple sets of one or more prepregs are stacked and sandwiched between head plates are heated and pressed between hot platens, the thickness of the head plate located near the hot platen is determined by the thickness between the hot platens. A method for manufacturing a laminate, characterized by making the thickness thicker than the mirror plate located in the center.