JPH08142265A - Mirror surface panel for producing copper clad laminated sheet and production of copper clad laminated sheet - Google Patents
Mirror surface panel for producing copper clad laminated sheet and production of copper clad laminated sheetInfo
- Publication number
- JPH08142265A JPH08142265A JP6290818A JP29081894A JPH08142265A JP H08142265 A JPH08142265 A JP H08142265A JP 6290818 A JP6290818 A JP 6290818A JP 29081894 A JP29081894 A JP 29081894A JP H08142265 A JPH08142265 A JP H08142265A
- Authority
- JP
- Japan
- Prior art keywords
- laminated sheet
- copper
- mirror surface
- copper foil
- clad laminated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/0007—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving treatment or provisions in order to avoid deformation or air inclusion, e.g. to improve surface quality
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
Landscapes
- Engineering & Computer Science (AREA)
- Quality & Reliability (AREA)
- Laminated Bodies (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、銅張り積層板のそり・
ねじれの低減に有効な銅張り積層板製造用鏡面板と銅張
り積層板の製造法に関するものである。BACKGROUND OF THE INVENTION The present invention relates to a warp for a copper-clad laminate.
The present invention relates to a mirror-finished plate for producing a copper-clad laminate and a method for producing a copper-clad laminate that are effective in reducing twist.
【０００２】[0002]
【従来の技術】電気用の銅張り積層板は、プリプレグ層
の片面または両面に銅箔を載置し、この構成材料を鏡面
板の間に挟んで、加熱加圧成形して製造される。鏡面板
には、ＳＵＳ６３０やＳＵＳ３０４のステンレス板が多
く用いられている。このように製造された銅張り積層板
をプリント配線板に加工するとき、回路加工（銅箔のエ
ッチング工程）で積層板両面の残銅率が異なると、積層
板のそり・ねじれが発生しやすくなっている。片面銅張
り積層板おいては、積層板厚さ方向の非対称性から、よ
り大きなそり・ねじれが発生する。2. Description of the Related Art Copper-clad laminates for electrical use are manufactured by placing a copper foil on one or both sides of a prepreg layer, sandwiching this constituent material between mirror-finished plates, and heating and pressing. A stainless plate such as SUS630 or SUS304 is often used as the mirror plate. When processing the copper-clad laminate manufactured in this way into a printed wiring board, if the residual copper rate on both sides of the laminate differs during circuit processing (copper foil etching process), warpage and twisting of the laminate are likely to occur. Has become. In a single-sided copper-clad laminate, greater warpage / twist occurs due to the asymmetry in the thickness direction of the laminate.
【０００３】[0003]
【本発明が解決しようとする課題】上記のように、積層
板にそり・ねじれが発生するのは、積層板製造に用いた
鏡面板の線膨張係数と銅箔の線膨張係数との差が大きい
ためと推測される。積層板の成形時に、銅箔が線膨張係
数の小さい鏡面板からの拘束を受けて、銅箔に残留応力
が残ったまま積層板が成形される。このため、銅箔のエ
ッチング工程で積層板両面の残銅率が異なってくると、
積層板両面の銅箔内に残る残留応力の大きさに差ができ
るので、そり・ねじれが発生する要因となる。本発明が
解決しようとする課題は、銅張り積層板の成形時に銅箔
内に残る残留応力を小さくし、積層板のそり・ねじれを
低減することである。As described above, the warpage and twisting of the laminated plate is caused by the difference between the linear expansion coefficient of the specular plate used for manufacturing the laminated plate and the linear expansion coefficient of the copper foil. It is speculated that it is large. During the forming of the laminated plate, the copper foil is constrained by the mirror surface plate having a small linear expansion coefficient, and the laminated plate is formed while residual stress remains in the copper foil. For this reason, if the residual copper rate on both sides of the laminate changes during the copper foil etching process,
There is a difference in the magnitude of residual stress remaining in the copper foil on both sides of the laminate, which causes warping and twisting. The problem to be solved by the present invention is to reduce the residual stress remaining in the copper foil during the formation of the copper-clad laminate, and to reduce the warpage and twist of the laminate.
【０００４】[0004]
【課題を解決するための手段】上記の課題を解決するた
めに、本発明に係る銅張り積層板成形用鏡面板は、線膨
張係数が１８〜２２ｐｐｍ／℃であることを特徴とす
る。また、本発明に係る銅張り積層板の製造法は、プリ
プレグ層の少なくとも片面に銅箔を載置し、これを鏡面
板で挟んで加熱加圧成形する方法において、銅箔に当接
する前記鏡面板の線膨張係数を１８〜２２ｐｐｍ／℃と
することを特徴とする。In order to solve the above problems, the copper-clad laminate molding mirror surface plate according to the present invention is characterized by having a linear expansion coefficient of 18 to 22 ppm / ° C. The method for producing a copper-clad laminate according to the present invention is a method of placing a copper foil on at least one surface of a prepreg layer, sandwiching the copper foil with a mirror surface plate, and heating and pressurizing the copper foil. It is characterized in that the linear expansion coefficient of the face plate is set to 18 to 22 ppm / ° C.
【０００５】[0005]
【作用】積層板成形時に使用する鏡面板の線膨張係数と
銅箔の線膨張係数（１７ｐｐｍ／℃）の差に注目し、積
層板成形後の銅箔の残留応力を小さくできるように鏡面
板の線膨張係数を特定したものである。その特定した範
囲は、銅箔の線膨張係数を含まず、銅箔の線膨張係数よ
り大きいところに鏡面板の線膨張係数を特定することに
より、銅張り積層板のそり・ねじれを減少させることが
できる。[Operation] Paying attention to the difference between the linear expansion coefficient of the mirror surface plate used for forming the laminated plate and the linear expansion coefficient of the copper foil (17 ppm / ° C), the mirror surface plate can be made to reduce the residual stress of the copper foil after forming the laminated plate. The linear expansion coefficient of is specified. The specified range does not include the coefficient of linear expansion of the copper foil, and reduces the warpage and twist of the copper-clad laminate by specifying the coefficient of linear expansion of the specular plate at a place larger than the coefficient of linear expansion of the copper foil. You can
【０００６】[0006]
【実施例】ガラスクロスに樹脂分が約４４重量％となる
ようにエポキシ樹脂ワニスを含浸乾燥してプリプレグを
製造した。このプリプリグを８枚重ね、当該プレプレグ
層の両表面に１８μｍ厚の銅箔を載置し、この構成材料
を表１に示す各種鏡面板の間に挟んで、圧力４ＭＰａ、
熱盤温度１７０℃で１３０分間加熱加圧成形した。その
後、５０分間冷却して、板厚１．６mmのＦＲ−４構成の
両面銅張り積層板を得た。EXAMPLE A glass cloth was impregnated with an epoxy resin varnish so that the resin content was about 44% by weight and dried to produce a prepreg. Eight sheets of this prepreg were stacked, copper foil having a thickness of 18 μm was placed on both surfaces of the prepreg layer, and the constituent material was sandwiched between various mirror surface plates shown in Table 1 to obtain a pressure of 4 MPa,
Heat-press molding was carried out at a hot plate temperature of 170 ° C. for 130 minutes. Then, it cooled for 50 minutes and obtained the double-sided copper clad laminated board of FR-4 structure of 1.6 mm in board thickness.
【０００７】[0007]
【表１】 [Table 1]
【０００８】上記各種鏡面板を用いて製造した両面銅張
り積層板の銅箔に残る残留応力およびそりを測定して、
鏡面板の線膨張係数との関係を図１に示した。残留応力
は、逐次除去法に基づき歪ゲージによって測定し、測定
した歪をもとに算出した。そりは、両面銅張り積層板の
片面の銅箔を全面エッチングした試料を用い、４隅の最
大はね上がり量をダイアルゲージにて測定した。図１よ
り、鏡面板の線膨張係数が１８〜２２ｐｐｍ／℃の間
で、銅箔の残留応力が圧縮から０を経て引張りへと変化
していることが分かる。そして、鏡面板の線膨張係数が
１８〜２２ｐｐｍ／℃において、成形後に両面から片面
銅張りの状態にした積層板のそりが小さいことを理解で
きる。The residual stress and warpage remaining on the copper foil of the double-sided copper-clad laminate produced by using the above various mirror-finished plates were measured,
The relationship with the linear expansion coefficient of the mirror plate is shown in FIG. The residual stress was measured by a strain gauge based on the sequential removal method, and calculated based on the measured strain. As the sled, a sample obtained by completely etching a copper foil on one side of a double-sided copper-clad laminate was used, and the maximum amount of rebound at four corners was measured with a dial gauge. It can be seen from FIG. 1 that the residual stress of the copper foil changes from compression to 0 and then to tensile when the linear expansion coefficient of the mirror plate is between 18 and 22 ppm / ° C. It can be understood that when the coefficient of linear expansion of the mirror-finished plate is 18 to 22 ppm / ° C., the warpage of the laminated plate which is copper-clad from both surfaces after molding is small.
【０００９】[0009]
【発明の効果】上述のように、本発明に係る鏡面板を用
いて成形を行なうことにより、銅箔の残留応力が少な
く、そり・ねじれを減少させた銅張り積層板を製造でき
る。銅箔の残留応力が少なくなるので、両面銅張り積層
板だけでなく、片面銅張り積層板を製造したときにも、
そり・ねじれを抑制するのに有効である。As described above, by forming using the mirror surface plate according to the present invention, it is possible to manufacture a copper clad laminate having less residual stress of the copper foil and reduced warpage and twist. Since the residual stress of copper foil is reduced, not only double-sided copper-clad laminates, but also when one-sided copper-clad laminates are manufactured,
It is effective in suppressing warpage and twist.
【図１】銅張り積層板を成形する鏡面板の線膨張係数
と、成形した銅張り積層板の銅箔の残留応力および積層
板のそりとの関係を示す曲線図である。FIG. 1 is a curve diagram showing a relationship between a linear expansion coefficient of a mirror surface plate for molding a copper-clad laminate, residual stress of a copper foil of the molded copper-clad laminate, and warpage of the laminate.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 庁内整理番号 ＦＩ 技術表示箇所 // Ｂ２９Ｋ 105:06 Ｂ２９Ｌ 31:34 ─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. 6 Identification number Office reference number FI technical display location // B29K 105: 06 B29L 31:34
Claims (2)
ことを特徴とする銅張り積層板製造用鏡面板。1. A mirror face plate for producing a copper-clad laminate, which has a coefficient of linear expansion of 18 to 22 ppm / ° C.
置し、これを鏡面板で挟んで加熱加圧成形する銅張り積
層板の製造において、 銅箔に当接する前記鏡面板の線膨張係数が１８〜２２ｐ
ｐｍ／℃であることを特徴とする銅張り積層板製造法。2. In the production of a copper-clad laminate in which a copper foil is placed on at least one surface of a prepreg layer and is sandwiched by mirror surface plates and heat-pressed, a linear expansion coefficient of the mirror surface plate contacting the copper foil is produced. Is 18-22p
A method for producing a copper-clad laminate, characterized in that it is pm / ° C.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6290818A JPH08142265A (en) | 1994-11-25 | 1994-11-25 | Mirror surface panel for producing copper clad laminated sheet and production of copper clad laminated sheet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6290818A JPH08142265A (en) | 1994-11-25 | 1994-11-25 | Mirror surface panel for producing copper clad laminated sheet and production of copper clad laminated sheet |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH08142265A true JPH08142265A (en) | 1996-06-04 |
Family
ID=17760886
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6290818A Pending JPH08142265A (en) | 1994-11-25 | 1994-11-25 | Mirror surface panel for producing copper clad laminated sheet and production of copper clad laminated sheet |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH08142265A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015145115A (en) * | 2014-02-04 | 2015-08-13 | 日立化成株式会社 | Method for producing metal-clad laminated plate, and metal-clad laminated plate |
-
1994
- 1994-11-25 JP JP6290818A patent/JPH08142265A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015145115A (en) * | 2014-02-04 | 2015-08-13 | 日立化成株式会社 | Method for producing metal-clad laminated plate, and metal-clad laminated plate |
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