JPH01301214A - Manufacture of copper-plated panel - Google Patents
Manufacture of copper-plated panelInfo
- Publication number
- JPH01301214A JPH01301214A JP13147188A JP13147188A JPH01301214A JP H01301214 A JPH01301214 A JP H01301214A JP 13147188 A JP13147188 A JP 13147188A JP 13147188 A JP13147188 A JP 13147188A JP H01301214 A JPH01301214 A JP H01301214A
- Authority
- JP
- Japan
- Prior art keywords
- laminate
- copper foil
- copper
- thermal expansion
- wrinkles
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 34
- 239000011889 copper foil Substances 0.000 claims abstract description 25
- 238000000034 method Methods 0.000 claims abstract description 13
- 230000037303 wrinkles Effects 0.000 claims abstract description 12
- 229910052802 copper Inorganic materials 0.000 claims abstract description 9
- 239000010949 copper Substances 0.000 claims abstract description 9
- 229910052751 metal Inorganic materials 0.000 claims description 10
- 239000002184 metal Substances 0.000 claims description 10
- 238000000465 moulding Methods 0.000 claims description 7
- 229910052782 aluminium Inorganic materials 0.000 abstract description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract description 8
- 239000000463 material Substances 0.000 abstract description 5
- 229910045601 alloy Inorganic materials 0.000 abstract description 4
- 239000000956 alloy Substances 0.000 abstract description 4
- 238000010276 construction Methods 0.000 abstract 1
- 239000002648 laminated material Substances 0.000 description 7
- 230000000694 effects Effects 0.000 description 4
- 238000003475 lamination Methods 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- 229910000737 Duralumin Inorganic materials 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000002747 voluntary effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
Landscapes
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野］
本発明は、鏡面板を介して重ねた積層材を一組の熱盤間
に仕込み積層成形する方法において、銅箔に生じる「シ
ワ」を大幅に改善した積層板の製法であり、特に、多層
化積層成形に好適に使用さるものである。[Detailed Description of the Invention] [Field of Industrial Application] The present invention is directed to a method of laminating and forming laminate materials stacked one on top of the other with mirror plates interposed between a set of hot plates. This is a greatly improved method for manufacturing laminates, and is particularly suitable for multilayer laminate molding.
通常、積層板は、クツション、鏡面板、積層材、鏡面板
・・・・積層材、鏡面板、クツションの如く、積層材を
鏡面板で挟んで配置し、これを積層成形用プレスに仕込
み、加熱、加圧により積層成形される。このとき、鏡面
板と接する銅箔に「シワ」が発生し易いことが知られて
いる。Usually, laminates are made by placing the laminate between mirror plates, such as cushions, mirror plates, laminated materials, mirror plates...laminates, mirror plates, and cushions, and placing this in a laminate molding press. Laminated and molded by heating and pressure. At this time, it is known that "wrinkles" are likely to occur in the copper foil in contact with the mirror plate.
本発明者らは、積層成形時の銅箔の「シワ」挙動につい
て鋭意検討した結果、「シワ」発生は冷却時の鏡面板と
積層材の熱膨張率の差、特に鏡面板の熱膨張率が小さい
場合に著しく、大きい場合にはより良好であることが見
出された。ところが、熱膨張率が大きい鏡面板はキズや
打こんなどが生じ易く実用化が困難であった。As a result of intensive study on the "wrinkle" behavior of copper foil during laminated molding, the present inventors found that "wrinkles" occur due to the difference in thermal expansion coefficient between the mirrored plate and the laminate material during cooling, especially the thermal expansion coefficient of the mirrored plate. It was found that it is significantly better when the value is smaller, and better when it is larger. However, mirror plates with a large coefficient of thermal expansion are prone to scratches and nicks, making it difficult to put them into practical use.
これを解決する方法について鋭意検討した結果、表面硬
度の高い鏡面板と積層材との間に銅箔よりも熱膨張率の
高い金属シートを配置する方法を見出し、本発明に到達
した。As a result of intensive research into ways to solve this problem, we discovered a method of arranging a metal sheet with a higher coefficient of thermal expansion than copper foil between the mirror plate with high surface hardness and the laminate, and arrived at the present invention.
すなわち、本発明は、プレス熱盤間に積層材を仕込み積
層成形して銅張板を製造する方法において、銅箔にシワ
が発生することを防止する為に鏡面板と銅箔及び積層材
との間に該銅箔以上の熱膨張率をもった金属シートを挿
入することを特徴とする銅張板の製法であり、挿入する
金属シートとして厚み０．０５〜０．１ｍｍのものを使
用すること、特に多層化積層成形用の積層材の場合に好
適であるものである。That is, the present invention provides a method for manufacturing a copper clad board by placing a laminate between press hot plates and laminate forming the mirror plate, copper foil and laminate to prevent wrinkles from forming on the copper foil. This is a method for manufacturing a copper-clad board characterized by inserting a metal sheet having a coefficient of thermal expansion greater than the copper foil between the two, and the metal sheet to be inserted has a thickness of 0.05 to 0.1 mm. In particular, it is suitable for laminated materials for multilayer lamination molding.
以下、本発明の構成について説明する。The configuration of the present invention will be explained below.
本発明の銅箔以」二の熱膨張率をもった金属シートとし
ては、ｉ同、ｊＰＩ基合金、アルミニウム、アルミニウ
ム基合金などの材質からなるものが挙げられ、厚みとし
ては０．０４ｍｍ以上、特に０．０５〜０．１ｍｍの範
囲が好適であり、０．０４ｍｍ未満ではシワ発生を防止
する効果が著しく損なわれ、また、厚くても本発明の効
果には変化ないが、重くなること並びに本金属シートは
繰り返し使用することは通常困難なことから実用的では
ない。Examples of the metal sheet having a coefficient of thermal expansion higher than that of copper foil of the present invention include those made of materials such as PI-based alloys, aluminum, and aluminum-based alloys, and have a thickness of 0.04 mm or more, In particular, a range of 0.05 to 0.1 mm is preferable; if it is less than 0.04 mm, the effect of preventing wrinkles will be significantly impaired, and even if it is thick, the effect of the present invention will not change, but it will become heavy and This metal sheet is not practical because it is usually difficult to use it repeatedly.
本発明の鏡面板の材質としては、ステンレス、鉄、黄銅
、アルミニウム、ジュラルミンその他の金属からなるも
のが使用可能でるが、ソｆ命の点から硬度の高いステン
レスが好適である。As the material of the mirror plate of the present invention, stainless steel, iron, brass, aluminum, duralumin, and other metals can be used, but stainless steel with high hardness is preferred from the viewpoint of the life of the sofa.
また、本発明の積層材としては、通常の積層材、例えば
、プリプレグ、積層板、又は多層板内層用のプリント配
線板などと銅箔との組合せが例示され、特に限定はない
が、層構成が複雑な多層化用の積層材が本発明の効果を
有効に利用できる点から特に好適である。The laminated material of the present invention is exemplified by a combination of a normal laminated material, such as a prepreg, a laminated board, or a printed wiring board for the inner layer of a multilayer board, with copper foil, and there is no particular limitation, but the layer structure A multi-layered laminate material having a complex structure is particularly suitable since the effects of the present invention can be effectively utilized.
以下、実施例により本発明を説明する。 The present invention will be explained below with reference to Examples.
実施例１
基材厚み０ 、９ ｍｍのガラスエポキシ両面銅張積層
板にモデルパターンを形成した内層用配線板の両面に、
厚み０．１ｍｍのガラスエポキシプリプレグ３枚づつを
介して基材厚み０．０１８ｍｍの銅箔を配置した構成を
１組とし、これを鏡面板（ＳＯ５６３０）で挿む際、銅
箔と鏡面板との間に厚み０．０８０ｍｍのアルミシート
を配置して圧力 ４０ｋｇ／ｃイ、温度１７５°Ｃで９
０分間多層化積層成形した。Example 1 A model pattern was formed on a glass epoxy double-sided copper-clad laminate with a base material thickness of 0.9 mm on both sides of an inner layer wiring board.
One set consists of three sheets of glass epoxy prepreg each having a thickness of 0.1 mm and a copper foil with a base material thickness of 0.018 mm. When inserting this with a mirror plate (SO5630), the copper foil and mirror plate An aluminum sheet with a thickness of 0.080 mm was placed between them, and the pressure was 40 kg/c and the temperature was 175°C.
Multilayer lamination molding was carried out for 0 minutes.
得られた多層板の銅箔には「シワ」は全く見られなかっ
た。No "wrinkles" were observed in the copper foil of the obtained multilayer board.
実施例２
実施例１において、厚み０．０８０ｍｍのアルミシー１
−に代えて厚み０．０７０ｍｍの銅シートを使用する他
は同様とした。Example 2 In Example 1, aluminum sheet 1 with a thickness of 0.080 mm
The procedure was the same except that a copper sheet with a thickness of 0.070 mm was used instead of -.
得られた多層板の銅箔には「シワ」は全く見られなかっ
た。No "wrinkles" were observed in the copper foil of the obtained multilayer board.
比較例Ｉ
実施例１において、厚み０．０８０ｍｍのアルミシート
を使用しない他は同様とした。Comparative Example I The same procedure as in Example 1 was carried out except that the aluminum sheet having a thickness of 0.080 mm was not used.
得られた多層板の銅箔には著しい「シワ」の発生が見ら
れた。Significant "wrinkles" were observed in the copper foil of the obtained multilayer board.
以上、詳細な説明および実施例、比較例から明白な如く
、本発明の積層成形法によれば、銅箔と鏡面板との間に
銅箔の熱膨張率以上の金属シートを挟むだけで既存の条
件によって、「シワ」の発生を大幅に改善出来るもので
あり、しかも、その為の工程として特別のものを使用す
る必要はなく、又、そのための金属シートも比較的安価
に入手可能であることから実用的に極めて優れたもので
あることが理解される。As is clear from the above detailed description, examples, and comparative examples, according to the lamination molding method of the present invention, a metal sheet having a thermal expansion coefficient higher than that of the copper foil is simply sandwiched between the copper foil and the mirror plate. Depending on the conditions, the occurrence of "wrinkles" can be significantly improved, and there is no need to use any special process for this purpose, and the metal sheets for this purpose can be obtained at relatively low prices. Therefore, it is understood that it is extremely excellent in practical terms.
特許出願人 三菱瓦斯化学株式会社
代理人 弁理士（９０７０） 小堀 貞文手続補正書
く自発） １
昭和６３年８月１８日Patent applicant: Mitsubishi Gas Chemical Co., Ltd. Agent Patent attorney (9070) Sadafumi Kobori (Voluntary author of procedural amendments) 1 August 18, 1986
Claims (1)
を製造する方法において、銅箔にシワが発生することを
防止する為に鏡面板と銅箔及び積層材との間に該銅箔以
上の熱膨張率をもった金属シートを挿入することを特徴
とする銅張板の製造法。 ２ 該金属シートの厚みが０．０５〜０．１ｍｍである
請求項１記載の銅張板の製造法。３ 該積層材が、多層
化積層成形用の積層材である請求項１記載の銅張板の製
造法。[Claims] 1. In a method of manufacturing a copper clad board by placing a laminate between press hot platens and laminate forming, a mirror-surfaced plate, a copper foil and a laminate are used to prevent wrinkles from forming on the copper foil. A method for manufacturing a copper clad board, which comprises inserting a metal sheet having a coefficient of thermal expansion greater than the copper foil between the copper foil and the copper foil. 2. The method for manufacturing a copper clad board according to claim 1, wherein the metal sheet has a thickness of 0.05 to 0.1 mm. 3. The method for manufacturing a copper clad board according to claim 1, wherein the laminate is a laminate for multilayer laminate molding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13147188A JPH01301214A (en) | 1988-05-31 | 1988-05-31 | Manufacture of copper-plated panel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13147188A JPH01301214A (en) | 1988-05-31 | 1988-05-31 | Manufacture of copper-plated panel |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01301214A true JPH01301214A (en) | 1989-12-05 |
Family
ID=15058744
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13147188A Pending JPH01301214A (en) | 1988-05-31 | 1988-05-31 | Manufacture of copper-plated panel |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01301214A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114698266A (en) * | 2022-03-21 | 2022-07-01 | 深圳市奔强电路有限公司 | Treatment method for improving pressing glue shortage |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5715959A (en) * | 1980-07-02 | 1982-01-27 | Matsushita Electric Works Ltd | Manufacture of copper lined laminate |
| JPS6339537B2 (en) * | 1979-10-18 | 1988-08-05 | Yoshitomi Pharmaceutical |
-
1988
- 1988-05-31 JP JP13147188A patent/JPH01301214A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6339537B2 (en) * | 1979-10-18 | 1988-08-05 | Yoshitomi Pharmaceutical | |
| JPS5715959A (en) * | 1980-07-02 | 1982-01-27 | Matsushita Electric Works Ltd | Manufacture of copper lined laminate |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114698266A (en) * | 2022-03-21 | 2022-07-01 | 深圳市奔强电路有限公司 | Treatment method for improving pressing glue shortage |
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