JPH01301214A - Manufacture of copper-plated panel - Google Patents

Manufacture of copper-plated panel

Info

Publication number
JPH01301214A
JPH01301214A JP13147188A JP13147188A JPH01301214A JP H01301214 A JPH01301214 A JP H01301214A JP 13147188 A JP13147188 A JP 13147188A JP 13147188 A JP13147188 A JP 13147188A JP H01301214 A JPH01301214 A JP H01301214A
Authority
JP
Japan
Prior art keywords
laminate
copper foil
copper
thermal expansion
wrinkles
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13147188A
Other languages
Japanese (ja)
Inventor
Shunichi Takigawa
滝川 俊一
Ryuta Shiraishi
白石 竜太
Kiyoshi Hosoya
細谷 清
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Gas Chemical Co Inc
Original Assignee
Mitsubishi Gas Chemical Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Gas Chemical Co Inc filed Critical Mitsubishi Gas Chemical Co Inc
Priority to JP13147188A priority Critical patent/JPH01301214A/en
Publication of JPH01301214A publication Critical patent/JPH01301214A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/02Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates

Landscapes

  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)

Abstract

PURPOSE:To contrive to improve remarkably the wrinkles to be generated on a copper foil by arranging the metallic sheet having higher thermal expansion coifficient than the copper foil in between the mirror surface-plate with high surface-hardness and a laminate. CONSTITUTION:When a laminate is charged in between the hot platens of a press and a copper plated panel is produced by laminate-forming the laminate, the metallic sheet having larger thermal expansion coifficient than a copper foil, is inserted into between a mirror surface-plate and both the copper foil and the laminate to prevent the wrinkles of the copper foil from being generated. As such metallic sheet, the materials such as copper, copper base-alloy, aluminum, aluminum base-alloy, etc. are required, and as its thickness, the range of 0.05-0.1mm is preferably used. The forming process is especially effective in the laminate for multilayer-making in a complicated larger construction.

Description

【発明の詳細な説明】 〔産業上の利用分野] 本発明は、鏡面板を介して重ねた積層材を一組の熱盤間
に仕込み積層成形する方法において、銅箔に生じる「シ
ワ」を大幅に改善した積層板の製法であり、特に、多層
化積層成形に好適に使用さるものである。
[Detailed Description of the Invention] [Field of Industrial Application] The present invention is directed to a method of laminating and forming laminate materials stacked one on top of the other with mirror plates interposed between a set of hot plates. This is a greatly improved method for manufacturing laminates, and is particularly suitable for multilayer laminate molding.

〔従来の技術およびその問題点〕[Conventional technology and its problems]

通常、積層板は、クツション、鏡面板、積層材、鏡面板
・・・・積層材、鏡面板、クツションの如く、積層材を
鏡面板で挟んで配置し、これを積層成形用プレスに仕込
み、加熱、加圧により積層成形される。このとき、鏡面
板と接する銅箔に「シワ」が発生し易いことが知られて
いる。
Usually, laminates are made by placing the laminate between mirror plates, such as cushions, mirror plates, laminated materials, mirror plates...laminates, mirror plates, and cushions, and placing this in a laminate molding press. Laminated and molded by heating and pressure. At this time, it is known that "wrinkles" are likely to occur in the copper foil in contact with the mirror plate.

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

本発明者らは、積層成形時の銅箔の「シワ」挙動につい
て鋭意検討した結果、「シワ」発生は冷却時の鏡面板と
積層材の熱膨張率の差、特に鏡面板の熱膨張率が小さい
場合に著しく、大きい場合にはより良好であることが見
出された。ところが、熱膨張率が大きい鏡面板はキズや
打こんなどが生じ易く実用化が困難であった。
As a result of intensive study on the "wrinkle" behavior of copper foil during laminated molding, the present inventors found that "wrinkles" occur due to the difference in thermal expansion coefficient between the mirrored plate and the laminate material during cooling, especially the thermal expansion coefficient of the mirrored plate. It was found that it is significantly better when the value is smaller, and better when it is larger. However, mirror plates with a large coefficient of thermal expansion are prone to scratches and nicks, making it difficult to put them into practical use.

〔問題点を解決するための手段〕[Means for solving problems]

これを解決する方法について鋭意検討した結果、表面硬
度の高い鏡面板と積層材との間に銅箔よりも熱膨張率の
高い金属シートを配置する方法を見出し、本発明に到達
した。
As a result of intensive research into ways to solve this problem, we discovered a method of arranging a metal sheet with a higher coefficient of thermal expansion than copper foil between the mirror plate with high surface hardness and the laminate, and arrived at the present invention.

すなわち、本発明は、プレス熱盤間に積層材を仕込み積
層成形して銅張板を製造する方法において、銅箔にシワ
が発生することを防止する為に鏡面板と銅箔及び積層材
との間に該銅箔以上の熱膨張率をもった金属シートを挿
入することを特徴とする銅張板の製法であり、挿入する
金属シートとして厚み0.05〜0.1mmのものを使
用すること、特に多層化積層成形用の積層材の場合に好
適であるものである。
That is, the present invention provides a method for manufacturing a copper clad board by placing a laminate between press hot plates and laminate forming the mirror plate, copper foil and laminate to prevent wrinkles from forming on the copper foil. This is a method for manufacturing a copper-clad board characterized by inserting a metal sheet having a coefficient of thermal expansion greater than the copper foil between the two, and the metal sheet to be inserted has a thickness of 0.05 to 0.1 mm. In particular, it is suitable for laminated materials for multilayer lamination molding.

以下、本発明の構成について説明する。The configuration of the present invention will be explained below.

本発明の銅箔以」二の熱膨張率をもった金属シートとし
ては、i同、jPI基合金、アルミニウム、アルミニウ
ム基合金などの材質からなるものが挙げられ、厚みとし
ては0.04mm以上、特に0.05〜0.1mmの範
囲が好適であり、0.04mm未満ではシワ発生を防止
する効果が著しく損なわれ、また、厚くても本発明の効
果には変化ないが、重くなること並びに本金属シートは
繰り返し使用することは通常困難なことから実用的では
ない。
Examples of the metal sheet having a coefficient of thermal expansion higher than that of copper foil of the present invention include those made of materials such as PI-based alloys, aluminum, and aluminum-based alloys, and have a thickness of 0.04 mm or more, In particular, a range of 0.05 to 0.1 mm is preferable; if it is less than 0.04 mm, the effect of preventing wrinkles will be significantly impaired, and even if it is thick, the effect of the present invention will not change, but it will become heavy and This metal sheet is not practical because it is usually difficult to use it repeatedly.

本発明の鏡面板の材質としては、ステンレス、鉄、黄銅
、アルミニウム、ジュラルミンその他の金属からなるも
のが使用可能でるが、ソf命の点から硬度の高いステン
レスが好適である。
As the material of the mirror plate of the present invention, stainless steel, iron, brass, aluminum, duralumin, and other metals can be used, but stainless steel with high hardness is preferred from the viewpoint of the life of the sofa.

また、本発明の積層材としては、通常の積層材、例えば
、プリプレグ、積層板、又は多層板内層用のプリント配
線板などと銅箔との組合せが例示され、特に限定はない
が、層構成が複雑な多層化用の積層材が本発明の効果を
有効に利用できる点から特に好適である。
The laminated material of the present invention is exemplified by a combination of a normal laminated material, such as a prepreg, a laminated board, or a printed wiring board for the inner layer of a multilayer board, with copper foil, and there is no particular limitation, but the layer structure A multi-layered laminate material having a complex structure is particularly suitable since the effects of the present invention can be effectively utilized.

〔実施例〕〔Example〕

以下、実施例により本発明を説明する。 The present invention will be explained below with reference to Examples.

実施例1 基材厚み0 、9 mmのガラスエポキシ両面銅張積層
板にモデルパターンを形成した内層用配線板の両面に、
厚み0.1mmのガラスエポキシプリプレグ3枚づつを
介して基材厚み0.018mmの銅箔を配置した構成を
1組とし、これを鏡面板(SO5630)で挿む際、銅
箔と鏡面板との間に厚み0.080mmのアルミシート
を配置して圧力 40kg/cイ、温度175°Cで9
0分間多層化積層成形した。
Example 1 A model pattern was formed on a glass epoxy double-sided copper-clad laminate with a base material thickness of 0.9 mm on both sides of an inner layer wiring board.
One set consists of three sheets of glass epoxy prepreg each having a thickness of 0.1 mm and a copper foil with a base material thickness of 0.018 mm. When inserting this with a mirror plate (SO5630), the copper foil and mirror plate An aluminum sheet with a thickness of 0.080 mm was placed between them, and the pressure was 40 kg/c and the temperature was 175°C.
Multilayer lamination molding was carried out for 0 minutes.

得られた多層板の銅箔には「シワ」は全く見られなかっ
た。
No "wrinkles" were observed in the copper foil of the obtained multilayer board.

実施例2 実施例1において、厚み0.080mmのアルミシー1
−に代えて厚み0.070mmの銅シートを使用する他
は同様とした。
Example 2 In Example 1, aluminum sheet 1 with a thickness of 0.080 mm
The procedure was the same except that a copper sheet with a thickness of 0.070 mm was used instead of -.

得られた多層板の銅箔には「シワ」は全く見られなかっ
た。
No "wrinkles" were observed in the copper foil of the obtained multilayer board.

比較例I 実施例1において、厚み0.080mmのアルミシート
を使用しない他は同様とした。
Comparative Example I The same procedure as in Example 1 was carried out except that the aluminum sheet having a thickness of 0.080 mm was not used.

得られた多層板の銅箔には著しい「シワ」の発生が見ら
れた。
Significant "wrinkles" were observed in the copper foil of the obtained multilayer board.

〔発明の作用および効果〕[Operation and effects of the invention]

以上、詳細な説明および実施例、比較例から明白な如く
、本発明の積層成形法によれば、銅箔と鏡面板との間に
銅箔の熱膨張率以上の金属シートを挟むだけで既存の条
件によって、「シワ」の発生を大幅に改善出来るもので
あり、しかも、その為の工程として特別のものを使用す
る必要はなく、又、そのための金属シートも比較的安価
に入手可能であることから実用的に極めて優れたもので
あることが理解される。
As is clear from the above detailed description, examples, and comparative examples, according to the lamination molding method of the present invention, a metal sheet having a thermal expansion coefficient higher than that of the copper foil is simply sandwiched between the copper foil and the mirror plate. Depending on the conditions, the occurrence of "wrinkles" can be significantly improved, and there is no need to use any special process for this purpose, and the metal sheets for this purpose can be obtained at relatively low prices. Therefore, it is understood that it is extremely excellent in practical terms.

特許出願人  三菱瓦斯化学株式会社 代理人 弁理士(9070)  小堀 貞文手続補正書
く自発)   1 昭和63年8月18日
Patent applicant: Mitsubishi Gas Chemical Co., Ltd. Agent Patent attorney (9070) Sadafumi Kobori (Voluntary author of procedural amendments) 1 August 18, 1986

Claims (1)

【特許請求の範囲】 1 プレス熱盤間に積層材を仕込み積層成形して銅張板
を製造する方法において、銅箔にシワが発生することを
防止する為に鏡面板と銅箔及び積層材との間に該銅箔以
上の熱膨張率をもった金属シートを挿入することを特徴
とする銅張板の製造法。 2 該金属シートの厚みが0.05〜0.1mmである
請求項1記載の銅張板の製造法。3 該積層材が、多層
化積層成形用の積層材である請求項1記載の銅張板の製
造法。
[Claims] 1. In a method of manufacturing a copper clad board by placing a laminate between press hot platens and laminate forming, a mirror-surfaced plate, a copper foil and a laminate are used to prevent wrinkles from forming on the copper foil. A method for manufacturing a copper clad board, which comprises inserting a metal sheet having a coefficient of thermal expansion greater than the copper foil between the copper foil and the copper foil. 2. The method for manufacturing a copper clad board according to claim 1, wherein the metal sheet has a thickness of 0.05 to 0.1 mm. 3. The method for manufacturing a copper clad board according to claim 1, wherein the laminate is a laminate for multilayer laminate molding.
JP13147188A 1988-05-31 1988-05-31 Manufacture of copper-plated panel Pending JPH01301214A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13147188A JPH01301214A (en) 1988-05-31 1988-05-31 Manufacture of copper-plated panel

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13147188A JPH01301214A (en) 1988-05-31 1988-05-31 Manufacture of copper-plated panel

Publications (1)

Publication Number Publication Date
JPH01301214A true JPH01301214A (en) 1989-12-05

Family

ID=15058744

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13147188A Pending JPH01301214A (en) 1988-05-31 1988-05-31 Manufacture of copper-plated panel

Country Status (1)

Country Link
JP (1) JPH01301214A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114698266A (en) * 2022-03-21 2022-07-01 深圳市奔强电路有限公司 Treatment method for improving pressing glue shortage

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5715959A (en) * 1980-07-02 1982-01-27 Matsushita Electric Works Ltd Manufacture of copper lined laminate
JPS6339537B2 (en) * 1979-10-18 1988-08-05 Yoshitomi Pharmaceutical

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6339537B2 (en) * 1979-10-18 1988-08-05 Yoshitomi Pharmaceutical
JPS5715959A (en) * 1980-07-02 1982-01-27 Matsushita Electric Works Ltd Manufacture of copper lined laminate

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114698266A (en) * 2022-03-21 2022-07-01 深圳市奔强电路有限公司 Treatment method for improving pressing glue shortage

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