JPH0259337A - Manufacture of thin copper foil plated circuit substrate - Google Patents
Manufacture of thin copper foil plated circuit substrateInfo
- Publication number
- JPH0259337A JPH0259337A JP20955288A JP20955288A JPH0259337A JP H0259337 A JPH0259337 A JP H0259337A JP 20955288 A JP20955288 A JP 20955288A JP 20955288 A JP20955288 A JP 20955288A JP H0259337 A JPH0259337 A JP H0259337A
- Authority
- JP
- Japan
- Prior art keywords
- copper foil
- metallic sheet
- copper
- thin copper
- thin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 62
- 239000011889 copper foil Substances 0.000 title claims abstract description 49
- 238000004519 manufacturing process Methods 0.000 title claims description 11
- 239000000758 substrate Substances 0.000 title abstract 3
- 229910052802 copper Inorganic materials 0.000 claims abstract description 13
- 239000010949 copper Substances 0.000 claims abstract description 13
- 238000000034 method Methods 0.000 claims abstract description 12
- 238000010030 laminating Methods 0.000 claims abstract description 6
- 229910052751 metal Inorganic materials 0.000 claims description 19
- 239000002184 metal Substances 0.000 claims description 19
- 239000002648 laminated material Substances 0.000 claims description 9
- 229910052782 aluminium Inorganic materials 0.000 abstract description 18
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract description 18
- 238000000465 moulding Methods 0.000 abstract description 11
- 229910045601 alloy Inorganic materials 0.000 abstract description 7
- 239000000956 alloy Substances 0.000 abstract description 7
- 239000000853 adhesive Substances 0.000 abstract description 5
- 230000001070 adhesive effect Effects 0.000 abstract description 4
- 239000004831 Hot glue Substances 0.000 abstract description 3
- 229920001169 thermoplastic Polymers 0.000 abstract description 2
- 229920001187 thermosetting polymer Polymers 0.000 abstract description 2
- 239000004416 thermosoftening plastic Substances 0.000 abstract description 2
- 238000003466 welding Methods 0.000 abstract description 2
- 239000004411 aluminium Substances 0.000 abstract 4
- 239000003795 chemical substances by application Substances 0.000 abstract 1
- -1 particularly Substances 0.000 abstract 1
- 239000011888 foil Substances 0.000 description 13
- 230000037303 wrinkles Effects 0.000 description 12
- 238000003475 lamination Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 238000011109 contamination Methods 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000004830 Super Glue Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- FGBJXOREULPLGL-UHFFFAOYSA-N ethyl cyanoacrylate Chemical compound CCOC(=O)C(=C)C#N FGBJXOREULPLGL-UHFFFAOYSA-N 0.000 description 1
- 239000005038 ethylene vinyl acetate Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、鏡面板を介して重ねた積層材を一組の熱盤間
に仕込み積層成形する方法において、薄銅箔を用いた場
合に銅箔に生じる「シワ」を大幅に改善した積層板の製
法であり、特に、多層化積層成形に好適に使用さるもの
である。[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a method of laminating and forming laminated materials stacked on top of each other with mirror-finished plates interposed between a set of hot platens, when thin copper foil is used. This is a method for producing a laminate that significantly reduces the wrinkles that occur in copper foil, and is particularly suitable for multilayer laminate molding.
通常、積層板は、クツション、鏡面板、積層材、鏡面板
・・・・積層材、鏡面板、クツションの如く、積層材を
鏡面板で挟んで配置し、これを積層成形用プレスに仕込
み、加熱、加圧により積層成形して製造されるが、この
とき、鏡面板と接する銅箔に「シワ」が発生し易いこと
が知られている。Usually, laminates are made by placing the laminate between mirror plates, such as cushions, mirror plates, laminated materials, mirror plates...laminates, mirror plates, and cushions, and placing this in a laminate molding press. It is manufactured by laminating and molding by heating and pressurizing, but it is known that "wrinkles" are likely to occur in the copper foil in contact with the mirror plate at this time.
本発明者は、積層成形時の銅箔の「シワ」挙動について
鋭意検討した結果、「シワ」発生は冷却時の鏡面板と積
層材の熱膨張率の差、特に鏡面板の熱膨張率が小さい場
合に著しく、大きい場合にはより良好であることが見出
された。ところが、熱膨張率が大きい鏡面板はキズや打
こんなどが生じ易く実用化が困難であった。As a result of intensive study on the "wrinkle" behavior of copper foil during laminated molding, the inventor found that "wrinkles" occur due to the difference in thermal expansion coefficient between the mirror plate and the laminate material during cooling, and in particular due to the difference in the coefficient of thermal expansion of the mirror plate. It has been found that it is significantly better when it is smaller, and better when it is larger. However, mirror plates with a large coefficient of thermal expansion are prone to scratches and nicks, making it difficult to put them into practical use.
これを解決する方法について鋭意検討した結果、表面硬
度の高い鏡面板と積層材との間に銅箔よりも熱膨張率の
高い金属シートを配置することによりシワの発生が大幅
に抑制されることを見出し、さらに検討した結果、本発
明に到達した。As a result of intensive research on ways to solve this problem, we found that by placing a metal sheet with a higher coefficient of thermal expansion than copper foil between the mirror plate with high surface hardness and the laminate material, the occurrence of wrinkles can be significantly suppressed. As a result of further investigation, we have arrived at the present invention.
すなわち、本発明は、プレス熱盤間に鏡面板を介して重
ねた積層材を仕込み積層成形して銅張板を製造する方法
において、銅箔として、平均厚さ６−以上で１８Ｅ１１
未満の薄銅箔と該銅箔以上の熱膨張率をもった金属シー
トとを重ね、実質的に銅張回路基板として使用しない該
銅箔の周囲部の一部又は全部を該金属シートに固定した
ものを使用することを特徴とする薄銅箔張回路基板の製
造法である。That is, the present invention provides a method for manufacturing a copper clad board by laminating and forming laminated materials stacked between press hot platens with a mirror plate interposed therebetween, in which the copper foil has an average thickness of 6- or more and is 18E11.
A thin copper foil of less than This is a method for manufacturing a thin copper foil-clad circuit board characterized by using a thin copper foil-clad circuit board.
以下、本発明の構成について説明する。The configuration of the present invention will be explained below.
本発明の平均厚さ６ρ以上で１８虜未満の薄銅箔とは、
通常電解法で製造され、通常、片面に接着性向上のため
に凹凸化処理がなされたものであり、長尺の連続箔又は
通常の積層成形用の大きさに切断した箔であり、単独で
取り扱う場合にはシワに成りやすいものである。厚さが
６ρ未満では、それ自体電解法で製造することが困難で
あり、又、本発明の方法でも取り扱いが困難でシワにな
りやすい。The thin copper foil of the present invention with an average thickness of 6ρ or more and less than 18μ is:
It is usually produced by an electrolytic method, and usually has a textured surface on one side to improve adhesion.It is a long continuous foil or a foil cut into the size for ordinary lamination molding, and it can be used alone. It tends to wrinkle when handled. If the thickness is less than 6ρ, it is difficult to manufacture by electrolytic method, and even with the method of the present invention, it is difficult to handle and wrinkles easily.
本発明の銅箔以上の熱膨張率をもった金属シートとして
は、銅、銅基合金、アルミニウム、アルミニウム基合金
などの材質からなるものが挙げられ、長尺の連続シート
又は通常の積層成形用の大きさに切断したシートであり
、アルミニウム、アルミニウム基合金が好適であり、厚
さは４０−以上、特に５０−〜１００−の範囲が好適で
ある。厚さ４０１未満ではシワ発生を防止する効果が著
しく損なわれ、また、厚くても本発明の効果には変化な
いが、重くなること並びに本金属シートは繰り返し使用
することは通常困難なことから実用的ではない。Examples of the metal sheet having a coefficient of thermal expansion greater than the copper foil of the present invention include those made of materials such as copper, copper-based alloys, aluminum, and aluminum-based alloys, and are suitable for long continuous sheets or ordinary lamination molding. It is a sheet cut into a size of , preferably made of aluminum or an aluminum-based alloy, and preferably has a thickness of 40 mm or more, particularly a range of 50 mm to 100 mm. If the thickness is less than 401, the effect of preventing wrinkles will be significantly impaired, and even if it is thick, the effect of the present invention will not change, but it will be heavy and it is usually difficult to use the metal sheet repeatedly, so it is not practical. Not the point.
本発明では、上記の薄銅箔の接着用処理面の反対側面と
金属シートとを重ね、実質的に銅張回路基板として使用
しない該銅箔の周囲部の一部又は全部を該金属シートに
固定したものとして、積層配置などの取り扱いを容易と
し、かつ、積層成形によるシワの発生を大幅に改善する
。In the present invention, the opposite side of the thin copper foil treated for adhesion is overlapped with a metal sheet, and a part or all of the peripheral area of the copper foil that is not used as a copper-clad circuit board is covered with the metal sheet. As a fixed product, it facilitates handling such as stacking and arrangement, and greatly reduces wrinkles caused by stacking.
ここに、薄銅箔と金属シートとを固定する方法としては
溶接、ホットメルト接着剤、粘着剤、熱硬化性接着剤、
熱可塑性接着剤、かしめ等の少なくとも室温下の取り扱
い等においても容易に剥離しないものである。固定の方
法は、薄銅箔及び金属シートとして長尺の連続シートを
用い、その両側端を固定し、所望の長さに切断後、必要
に応じて該切断部側端も固定する方法、又は予め所望の
大きさに切断したものの周囲を固定する方法が挙げられ
る。Here, methods for fixing the thin copper foil and metal sheet include welding, hot melt adhesive, adhesive, thermosetting adhesive,
Thermoplastic adhesives, caulking, etc., do not easily peel off even when handled at least at room temperature. The fixing method is to use a long continuous sheet as a thin copper foil and metal sheet, fix both ends of the sheet, cut it to the desired length, and then fix the cut side edges as necessary, or An example is a method of cutting the material into a desired size in advance and fixing the periphery thereof.
本発明の鏡面板とは、回路基板を製造するための通常の
硬質の金属板であり、本発明の製造法においては表面が
平滑であれば鏡面である必要はないものであり、ステン
レス、鉄、鉄基合金や多層板製造に使用する基準ピン等
を有する硬質金属板であって、厚さ１．Ｏｍｍ〜２０．
０ｍｍのものである。The mirror plate of the present invention is a normal hard metal plate for manufacturing circuit boards, and in the manufacturing method of the present invention, it is not necessary to have a mirror surface as long as the surface is smooth. , a hard metal plate having a reference pin, etc. used in the production of iron-based alloys and multilayer plates, and having a thickness of 1. Omm~20.
It is 0mm.
また、本発明の積層材としては、通常の積層材、例えば
、プリプレグ、又はプリプレグと積層板、多層板の内層
用のプリント配線板との組合せたものと上記の金属シー
ト固定の薄銅箔との組合せが例示されるものである。In addition, the laminated material of the present invention may be a normal laminated material such as prepreg, or a combination of prepreg and a laminated board or a printed wiring board for the inner layer of a multilayer board, and the above-mentioned thin copper foil fixed to a metal sheet. An example is a combination of the following.
積層成形後、銅張回路基板として使用する以外の薄銅箔
と金属シートとの固定部を含む周囲を切り落とすことに
より、金属シートはフリーとなるので、必要に応じて金
属シートを取り除いて本発明の薄銅張回路基板とする。After lamination molding, the metal sheet is freed by cutting off the surrounding area including the fixed part between the thin copper foil and the metal sheet that is not used as a copper-clad circuit board, so the metal sheet can be removed as necessary to produce the present invention. Thin copper-clad circuit board.
以下、実施例により本発明を説明する。 The present invention will be explained below with reference to Examples.
実施例１
薄銅箔として、平均厚さ９ρの片面凹凸処理された幅１
０８０ ｍｍの長尺の薄電解銅箔（以下、薄銅箔と記す
）を用意し、金属シートとして、平均厚さ８０虜、幅１
０８０ ｍｍの長尺のアルミニウム箔（以下、アルミ箔
と記す）を用意した。Example 1 Thin copper foil with an average thickness of 9ρ and a width of 1 treated with unevenness on one side.
A long thin electrolytic copper foil (hereinafter referred to as thin copper foil) of 0.080 mm was prepared, and a metal sheet with an average thickness of 80 mm and a width of 1 mm was prepared.
A long aluminum foil (hereinafter referred to as aluminum foil) having a length of 080 mm was prepared.
アルミ箔の片面の幅方向両側端より５〜１０ｍｍの位置
に１５０℃に加熱したエチレン酢酸ビニルコポリマー系
のホットメルト接着剤を幅３ｍｍ、長さ１ｃｍで長さ方
向１ｃｍ間隔で配置し、直ちに薄銅箔の凹凸処理面の反
対側面で重ねて１ｋｇ／ｃｍの線圧のロールで圧着した
。Place ethylene-vinyl acetate copolymer hot-melt adhesive heated to 150°C on one side of the aluminum foil at 5 to 10 mm from both ends in the width direction, with a width of 3 mm and a length of 1 cm, at intervals of 1 cm in the length direction, and immediately thin The copper foils were overlapped on the opposite side of the textured surface and crimped using a roll with a linear pressure of 1 kg/cm.
この圧着物を長さ方向１０６０ ｍｍに切断し、１０８
０Ｘ １０６０ｍｍの金属シート固定の薄銅箔とした。This crimped material was cut into lengths of 1060 mm, and
A thin copper foil fixed to a metal sheet of 0×1060 mm was used.
厚さ０．２ｍｍの１０３０ Ｘ １０３０ｍｍのガラス
布エポキシプリプレグを３枚重ね、その両側に上記の金
属シート固定の薄銅箔を重ねたものを一組とする積層材
を厚さ２ｍｍのステンレス板９枚の間に８組み挾み、圧
力 ４０ｋｇ／ｃｌＴｌ、温度１７０℃で１２０分間積
層成形した。A stainless steel plate 9 with a thickness of 2 mm is made of a laminated material consisting of three sheets of 1030 x 1030 mm glass cloth epoxy prepreg with a thickness of 0.2 mm, and the thin copper foil fixed to the metal sheet described above is layered on both sides. Eight sets were sandwiched between the sheets, and lamination molding was carried out at a pressure of 40 kg/clTl and a temperature of 170° C. for 120 minutes.
室温に冷却後、得られた銅張板の外周を切断して、１０
２０ Ｘ １０２０ｍｍの大きさとし、アルミニウム箔
を取り除いたところ、シワや表面汚染のない良好な薄銅
張回路基板が得られた。After cooling to room temperature, the outer periphery of the obtained copper clad board was cut to give 10
When the size was 20 x 1020 mm and the aluminum foil was removed, a good thin copper-clad circuit board with no wrinkles or surface contamination was obtained.
実施例２
平均厚さ１２ρの片面凹凸処理された５４０ Ｘ ３６
０ｍｍの薄電解銅箔き平均厚さ６０）ｓ、 ５４０ｘ
３６０ ｍｍアルミニウム箔を用意した。Example 2 540 x 36 with unevenness treatment on one side with average thickness of 12ρ
0mm thin electrolytic copper foil, average thickness 60)s, 540x
A 360 mm aluminum foil was prepared.
薄電解銅箔の凹凸処理面の反対側面を上面として置き、
この周囲端より１ｏｎｕｎ以内の位置にシアノアクリレ
ート接着材を略全周囲に渡って少量塗布し、直ちにアル
ミニウム箔を置き、薄電解銅箔とアルミニウム箔との間
の空気を追い出すようにして３分間保持してアルミ箔材
の銅箔とした。Place the surface opposite the textured surface of the thin electrolytic copper foil as the top surface.
Apply a small amount of cyanoacrylate adhesive around the entire circumference within 1 onun from this peripheral edge, immediately place aluminum foil, and hold for 3 minutes while expelling air between the thin electrolytic copper foil and aluminum foil. The aluminum foil material was made into copper foil.
大きさ５２０ｘ ３４０ 、ｍｍ、厚さＱ、９ｍｍ、銀
箔の厚さ７０ρの両面回路形成した多層プリント配線板
用の中間層の上下に、厚さ０．１ｍｍの５３０Ｘ３５０
ｍｍのガラス布エポキシプリプレグを３枚重ね、その
両側に上記のアルミ箔材の銅箔の銅箔凹凸処理面で重ね
、厚さ１０ｍｍのステンレス板間に挟み、圧力 ３０ｋ
ｇ／ｃＪ、温度１７０℃で１２０分間積層成形した。Size 520 x 340, mm, thickness Q, 9 mm, 530 x 350, 0.1 mm thick, on the top and bottom of the intermediate layer for a multilayer printed wiring board with double-sided circuits formed with silver foil thickness 70 ρ.
Three sheets of glass cloth epoxy prepreg with a thickness of 3 mm are stacked on top of each other, and the above-mentioned copper foil of the aluminum foil material is stacked on both sides with the copper foil textured surface, sandwiched between 10 mm thick stainless steel plates, and a pressure of 30 k is applied.
g/cJ and a temperature of 170° C. for 120 minutes.
室温に冷却後、外周を切り落とし、アルミニウム箔を取
り除いて５００Ｘ３３０ ｍｍの１２１Ｊｖ両面銅箔張
多層板を得た。After cooling to room temperature, the outer periphery was cut off and the aluminum foil was removed to obtain a 121 Jv double-sided copper foil-clad multilayer board measuring 500 x 330 mm.
得られた多層板の銅箔には「シワ」は全く見られなかっ
た。No "wrinkles" were observed in the copper foil of the obtained multilayer board.
以上、詳細な説明および実施例などから明白な如く、本
発明の製造法によれば、銅箔として銅箔よりも熱膨張率
の大きい金属箔と薄銅箔との周囲固定物を用いることに
より、薄銅箔単体に比較して銅箔の取り扱いが容易とな
り、また、積層成形による「シワ」の発生を大幅に改善
出来るものである。しかも、本発明の薄銅箔を固定する
金属シートは、薄銅箔上に異物が乗る事により発生する
「ダコン」や表面汚染を防ぐ保護シートの役割を果たし
、また、積層成形後、容易に取り除けるものであり、実
用的に極めて優れたものであることが理解される。As is clear from the above detailed description and examples, according to the manufacturing method of the present invention, by using a surrounding fixture of a thin copper foil and a metal foil having a larger coefficient of thermal expansion than the copper foil as the copper foil, Compared to thin copper foil alone, handling of the copper foil is easier, and the occurrence of "wrinkles" caused by laminated molding can be greatly reduced. In addition, the metal sheet for fixing the thin copper foil of the present invention serves as a protective sheet to prevent surface contamination and "contamination" that occurs when foreign objects get on the thin copper foil, and can be easily removed after lamination molding. It is understood that it can be removed and is extremely excellent in practical terms.
特許出願人 三菱瓦斯化学株式会社Patent applicant: Mitsubishi Gas Chemical Co., Ltd.
Claims (1)
層成形して銅張板を製造する方法において、銅箔として
、平均厚さ６μｍ以上で１８μｍ未満の薄銅箔と該銅箔
以上の熱膨張率をもった金属シートとを重ね、実質的に
銅張回路基板として使用しない該銅箔の周囲部の一部又
は全部を該金属シートに固定したものを使用することを
特徴とする薄銅箔張回路基板の製造法。In a method of manufacturing a copper clad board by laminating and forming laminated materials stacked between press hot platens via mirror plates, the copper foil includes a thin copper foil with an average thickness of 6 μm or more and less than 18 μm, and the copper foil or more. A metal sheet having a coefficient of thermal expansion of A method for manufacturing thin copper foil-clad circuit boards.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20955288A JPH0259337A (en) | 1988-08-25 | 1988-08-25 | Manufacture of thin copper foil plated circuit substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20955288A JPH0259337A (en) | 1988-08-25 | 1988-08-25 | Manufacture of thin copper foil plated circuit substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0259337A true JPH0259337A (en) | 1990-02-28 |
Family
ID=16574707
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20955288A Pending JPH0259337A (en) | 1988-08-25 | 1988-08-25 | Manufacture of thin copper foil plated circuit substrate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0259337A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5269198A (en) * | 1990-11-27 | 1993-12-14 | Kabushiki Kaisha Daikin Seisakusho | Liquid viscous damper |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS542179A (en) * | 1977-06-08 | 1979-01-09 | Toshiba Corp | Low concentration radioactive gas measuring apparatus provided with enrichment rate corrector |
| JPS59150680A (en) * | 1983-01-21 | 1984-08-28 | ゼネラル・エレクトリック・カンパニイ | Obtaining of predetermined peel strength in copper-aluminum interface |
-
1988
- 1988-08-25 JP JP20955288A patent/JPH0259337A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS542179A (en) * | 1977-06-08 | 1979-01-09 | Toshiba Corp | Low concentration radioactive gas measuring apparatus provided with enrichment rate corrector |
| JPS59150680A (en) * | 1983-01-21 | 1984-08-28 | ゼネラル・エレクトリック・カンパニイ | Obtaining of predetermined peel strength in copper-aluminum interface |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5269198A (en) * | 1990-11-27 | 1993-12-14 | Kabushiki Kaisha Daikin Seisakusho | Liquid viscous damper |
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