JPS60166428A - Laminate molding method of metal lined laminated board - Google Patents

Abstract

PURPOSE:To equalize heat conduction from a hot plate in a upper section and a lower section by setting the thermal conductivity of a cushion material on the side, toward which a metallic foil is directed, to a value smaller than that of a cushion material on the other side. CONSTITUTION:Metallic foils 1 are set to one surfaces on one sides of prepregs 2 between hot plates 4 and 5 under the state in which the metallic foils are superposed so as to be upward directed, paired and held among plates 3 made of a metal. Cushion materials 6, 7 are inserted previously on the lower side of the hot plate 4 and the upper side of the hot plate 5. The cushion material 6 on the upper side is formed by a material, thermal conductivity thereof is more inferior than another cushion material 7. The cushion material 6 on the upper side is slower than another cushion material in the velocity of heat conduction from the hot plates 4, 5 on heating and pressure-molding. Since the metallic foil 1 is directed upward, however, the thermal conductivity of the prepreg in an upper section is faster than that of the prepreg in a lower section. Accordingly, both actions offset each other, and the velocity of heat conduction to the prepregs 2 from the hot plates 4, 5 is equalized approximately.

Description

Detailed Description of the Invention 1 Technical Field 1 The present invention relates to a method for laminating and forming a metal-clad bi-layer board used as a printed wiring board. It is related to.

[Background technology 1] 1'1In order to form a laminate covered with copper foil or metal foil, multiple sheets of prepreg are layered, and then metal foil is layered on the outer surface of this prepreg, and this is colored dark blue. This is done by placing 10 to 1 u+l between the plates and heating and pressurizing them between upper and lower heating plates. In this case, from the standpoint of process automation and productivity, the metal foils are placed between the hot platens so that they face the same side. Since the amount of heat conducted to the prepreg differs between the facing side and the non-facing side, there will be a difference in heating conditions between the prepreg close to the upper heating element and the lower heating element, and the formed laminate The problem with the board was that there were large variations in warpage.

Therefore, an attempt has been made to solve the above problem by changing the orientation of the metal foil depending on whether it is set in the second part or in the lower part, as shown in FIG. That is, in Fig. 1, 1 is metal foil,
2 is a prepreg, 3 is a plate, 4.5 is a heating body,
Set the metal foil 1 so that the upper part faces the 1ζ side, and the lower part so that the metal foil 1 faces the heating element 4 and heating element 5 side. This is to ensure that the heat (L) from the body 4.5 is uniform. In Fig. 1, 6.7 is a cushioning material to equalize the pressing force. By using this method, it is possible to reduce the variation in warpage of the laminate, but with this method, it is necessary to set the orientation of the metal foil 1 so that it is symmetrical with the downward direction.As a result, the above-mentioned automation and production This is difficult from a gender perspective.

[Objective of the Invention 1] The present invention has been made in view of the above points.
The purpose of this invention is to provide a lamination forming force method for metal-clad laminates that can form laminates with minimal warpage without causing automation or productivity problems. .

1 Disclosure of the Invention 1 However, in the forming force method of the metal-clad laminate according to the present invention, a plurality of metal foils 1 are stacked on one side of a prepreg 2, and a plurality of these are stacked via a plate 3. heating element 4
．． 5, a cushioning material 6.7 is interposed between the heating body 4.5 and the loaded object 1, and a cushioning material 6.7 is provided on the side facing the metal foil 1. The thermal conductivity of the cushioning material 6 is set to be lower than that of the cushioning material 7,
The above object has been achieved by using Kagaruri 7 John 6.7, and the present invention will be described in detail below with reference to examples.

The prepreg 2 is formed by impregnating paper or other material with a phenolic resin and drying it, and is used by stacking a plurality of sheets. Then, a metal foil 1 such as copper foil is layered on one side of this prepreg 2, and this is sandwiched between two metal plates 3 as shown in Fig. 2. It is set between the body 4 and a lower heating body 5 called a carrier plate.

At this time, the setting is performed so that the metal foil 1 faces in the same direction, for example, the upper side, and the lower side of the heating element 4 and the till of the heating element 5 are each made of kraft paper or the like. The cushioning material 6.7 formed is an insert.

Of these cushioning materials 6 and 7, the one on the side facing the metal foil 1, that is, the upper cushioning material 6 in FIG. 2 is made of a material having lower thermal conductivity than the other cushioning material 7. For example, if the cushion material 6, ■ is made of kraft paper, the number of layers of kraft paper is rl! [Thus, the difference in thermal conductivity is 111].

In this way, heating and pressure forming is performed between the heating bodies 4.5, but the rate of heat conduction from the heating bodies ↓, 5 is
．． 7, the cushioning material of Ichikawa 111), which has good thermal conductivity, is faster than 1.7, which has poor thermal conductivity. -11111
Cushion 6 is slower. However, metal foil 1 is ill! Since it is facing l, it is j of prepreg 2.
For yts, the prepreg 2 in the upper part has higher thermal conductivity than the prepreg 2 in the lower part.

Therefore, these two effects cancel each other out, and the conduction speed of heat from the C1 heating plate 4.5 to the prepreg 2 is approximately equal in the -1 part and in the -F part. The difference in thermal conductivity between the cushioning materials 6 and 7 can be easily determined experimentally. The single-sided copper-clad laminate formed according to the present invention is then fabricated into a printed wiring board.
Conventionally, the variation in warpage between the two digits and the outside was 1.5±0.5m.
m is 1, () ± 0, 3 III In
It will be about.

1 Effect of the invention 1 As mentioned above, in the present invention, by taking advantage of the difference in thermal conductivity of the cushioning material used to make the pressing force uniform,
Since the conductivity of the cushion material on the side facing the metal foil is set to be lower than the thermal conductivity of the cushion material on the other side, the heat conduction between the cushion material and the metal foil reduces the heat conduction from the hot body. There is no need to change the direction of the metal foil between the upper and lower parts, and there is no problem with process automation or productivity.
This makes it possible to reduce variations in warpage that occurs in the laminate.

[Brief explanation of the drawing]

FIG. 1 is a schematic exploded view of a conventional example, and FIG. 2 is a schematic exploded view of an embodiment of the present invention. 1 is metal foil, 2 is prepreg, :3 is plate, 4.5
is a heating body, and 6.7 is Kunjon material. Agent Patent Attorney Seki 111 Akichi Figure 1 Figure 2

Claims (1)

[Claims] (]) Metal foil is layered on one side of the prepreg, stacked in multiple sets via plates, and then heated and pressed between the upper and lower hot platens to form a laminated layer. A cushion 4.A is interposed between the heating body and the loaded object, and the thermal conductivity of the cushion shrine on the side facing the metal foil is set to be lower than the thermal conductivity of Kunjong paulownia wood in Ikegata. Lamination forming force method for metal-clad laminates.