JP2003347729A - Fabricating method for metallic foil attached laminated board with inner layer circuit - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To fabricate a metallic foil attached laminated board for a core wiring substrate in which in forming a number of the laminated board, metallic templates with a thickness of 0.8 or less are arranged between each of laminating components serving as a one sheet in the laminated board to reduce warping of the board and further improve the inner circuit positioning accuracy in a metallic foil attached laminated board with an inner circuit. <P>SOLUTION: A first metallic template 1 with a thickness of 0.8 mm or less are arranged between each of the laminating components serving as one sheet in the metallic foil attached laminated board for the core wiring substrate. The first metallic template 1 and a second metallic template 2 with thickness of 1 mm or more are arranged in the uppermost and lowermost surfaces of a plurality of groups of the laminating components put between press heating boards 20. Besides, one or more sheets of a third metallic template 3 is or are arranged between the first metallic template 1 and the second metallic template 2. The third metallic template is the same material as the first metallic plate or has an intermediate coefficient of thermal expansion between the first and second metallic templates. In forming a number of the metallic foil attached laminated boards for the core wiring substrates, the first metallic template is arranged between the laminating components and the second metallic template is arranged in the uppermost and the lowermost surfaces in a plurality of groups of the laminating components put between the press heating boards. <P>COPYRIGHT: (C)2004,JPO

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a metal foil-clad laminate having an inner layer circuit for manufacturing a multilayer printed wiring board.

[0002]

2. Description of the Related Art A metal foil-clad laminate with an inner circuit is a laminated structure in which a prepreg layer and a metal foil are laminated on both sides of a core wiring board in this order from the inside to the outside (this is a metal foil-clad laminate 1 with an inner circuit). (Equivalent to a sheet) are stacked, put into one stage of a press hot platen, and each laminated structure is integrated by heating and pressing. In a configuration in which a plurality of core wiring substrates are included in one set of the laminated structure, the prepreg layer is also interposed between the core wiring substrates, and the heat and pressure molding is performed. The resin in the prepreg is melted at the time of the heat and pressure molding, and functions as an adhesive layer for unifying the laminated structure. Further, the molten resin flows into and fills the recesses between the printed wirings of the core wiring board.
In the above-mentioned heat and pressure molding, a metal template is interposed between the laminated components in order to separate each laminated component. Then, a cushion material is interposed between the uppermost and lowermost metal template plates in which a plurality of the laminated components are stacked and the press hot platen.

[0003] A core wiring board prepared prior to the production of the above-mentioned metal foil-clad laminate containing an inner layer circuit is a laminated structure in which a metal foil is laminated on both sides of one or more prepreg layers (this is a double-sided metal foil-clad laminate). (Corresponding to one sheet) is stacked, put into a press hot platen at one stage, and heated and pressed to form. Also in this case, similarly to the production of the metal foil-clad laminate including the inner layer circuit, a metal template is interposed between the laminated components to separate each laminated component. And
A cushion material is interposed between the uppermost and lowermost metal mold plates, each of which is formed by stacking a plurality of the laminated structural members, and the press hot platen.

When a large number of products are to be manufactured by one heat and pressure molding, the manufacturing is required both when manufacturing a double-sided metal foil-clad laminate and when manufacturing a metal foil-clad laminate with an inner layer circuit. It is conceivable to increase the size or to increase the number of sets of the laminated structure to be put in one stage of the hot platen. As one of the methods for increasing the number of sets of the laminated components to be put into one stage of the press hot platen, there is a method of reducing the thickness of a metal template placed between the laminated components. However, since the strength of the metal template decreases as the thickness thereof is reduced, there is a concern that the surface properties of the cushion material are transferred to the surface of the laminate through the metal template. Also, particularly, in the manufacturing process of the metal foil-clad laminate with the inner layer circuit, the metal template is deformed by the unevenness of the printed wiring of the core wiring board at the time of heating and pressing, and as a result, the metal template is adjacent via the metal template. There is a concern that the irregularities may be transferred to the surface of the metal foil-clad laminate containing the inner layer circuit. A double-sided metal foil-clad laminate or a metal foil-clad laminate with an inner layer circuit, on which the irregularities are transferred,
There is a possibility that poor adhesion of a photosensitive resin film laminated on the surface of the printed wiring to form a printed wiring or defective mounting of components may occur.

In order to avoid the transfer of the irregularities, a thickness of 1 mm is set between the uppermost and lower sides of a plurality of sets of laminated components put in one stage of the press hot platen and between every predetermined number of stacked components. What is necessary is just to arrange | position the above-mentioned 2nd metal template. However, a laminated structure, a thin metal template and a thickness of 1 mm
If the three thermal expansion coefficients of the above thick second metal template are different,
In some cases, stress may remain contained in the formed laminate. In particular, when a double-sided metal foil-clad laminate containing such a stress is subjected to the manufacture of a metal-foil-clad laminate with an inner layer circuit, the manufactured metal-foil-clad laminate with an inner layer circuit may be warped or the positional accuracy of the inner layer circuit may deteriorate. , A problem occurs.

[0006] The above-mentioned stress generation is caused by prepreg occupying in the laminated structure in the heating and press-forming step of the metal foil-clad laminate containing the inner layer circuit (the main cause of the stress generation is that the resin of the prepreg is melted and hardened). Is not so noticeable because of the small percentage of On the other hand, in the step of heating and pressing a double-sided metal foil-clad laminate used for manufacturing a core wiring board, since the prepreg occupies most of the laminated structure, the included stress increases. In order to efficiently manufacture a metal-foil-clad laminate with an inner layer circuit, a metal mold with a thickness of 0.8 mm or less is required for both heat-press molding of a double-sided metal-foil-clad laminate and a metal-foil-clad laminate with an inner layer circuit. It is desirable to use a combination of the plate and the second metal template having a thickness of 1 mm or more. Usually, a stainless steel template having a thickness of about 1.2 mm is used as the metal template. It is difficult to manufacture a stainless steel template having a small thickness (0.8 mm or less), and a thin metal template must be selected from other materials. Then, the stress included in the double-sided metal foil-clad laminate becomes large. For the pressure molding, it was difficult to increase the production efficiency by employing a metal template having a thickness of 0.8 mm or less.

[0007]

The problem to be solved by the present invention is equivalent to one double-sided metal foil-clad laminate in the heat and pressure molding of a double-sided metal-foil-clad laminate used for manufacturing a core wiring board. Even when using a metal template with a thickness of 0.8 mm or less to separate the laminated components, the inclusion of stress is reduced, warpage is suppressed, and the inner layer circuit position accuracy is good. To produce boards.

[0008]

In order to solve the above-mentioned problems, a first manufacturing method according to the present invention is to stack a plurality of sets of a laminated structure in which a metal foil is stacked on both sides of at least one prepreg layer. A first step of manufacturing a double-sided metal foil-clad laminate by integrating each laminated structure by heating and press forming, and a circuit processing of printed wiring on the double-sided metal-foiled laminate And a second step of manufacturing a core wiring board by applying a plurality of sets of a laminated structure in which a prepreg layer and a metal foil are stacked in this order on both sides of the core wiring board from the inside to the outside, and a press heating plate In the manufacture of a metal foil-clad laminate with an inner layer circuit, which passes through a third step of integrating each laminated structure by heat and pressure molding, in the heat and pressure molding of the first step, the laminated structures are 0.8mm or less in thickness between Placing the metal mold plate. The first metal template and the second metal template having a thickness of 1 mm or more are arranged on the uppermost surface and the lowermost surface of the plural sets of the laminated components that are put in one press hot plate and stacked. In addition, one or more third metal templates are arranged between the second metal template and the first metal template, and the third metal template is made of the same material as the first metal template. And
In the heat-press molding in the third step, the first metal mold plate is arranged between the laminated structures, and the uppermost surface and the uppermost surface of a plurality of sets of the laminated structures which are put in one stack on a press hot platen are charged. The second metal template is disposed on the lower surface.

The internal stress which causes warpage of the double-sided metal foil-clad laminate is caused by a difference in thermal expansion coefficient between the double-sided metal foil-clad laminate and the metal template. In particular, when metal molds made of different materials are used together, the difference in the coefficient of thermal expansion between the different metal molds greatly affects. In the heat and pressure forming step of the second step, the third metal template is provided with a second metal template and a double-sided metal foil for preventing the surface properties of the cushion material from being transferred to the surface of the metal foil-clad laminate. It is located between the first metal mold plate and the first metal mold plate directly in contact with the laminate, thereby reducing the influence of the difference in thermal expansion coefficient between the two. If the stress included in the double-sided metal foil-clad laminate is small, it is subjected to the production of a double-sided metal-foil-clad laminate containing an inner layer circuit, and even if a metal mold plate of a different material is used in the heating and pressing molding process, the warping and The influence on the inner layer circuit position accuracy is reduced.

[0010] The second manufacturing method according to the present invention goes through the same steps as the first manufacturing method, except that the third metal mold plate is used in the first step of heating and pressing. A material having a thermal expansion coefficient intermediate between that of the first metal template and the second metal template. The third metal template having an intermediate coefficient of thermal expansion buffers the difference in the coefficient of thermal expansion between the first metal template and the second metal template.

[0011] In a third manufacturing method according to the present invention, in the heat and pressure forming in the first step of the first manufacturing method, a first metal template having a thickness of 0.8 mm or less is formed between the laminated structures. Place,
A fourth metal template of the same material as the first metal template and having a thickness of 1 mm or more is arranged on the uppermost surface and the lowermost surface of a plurality of stacked structural members which are put in one stack between the press hot plates. The thickness of the fourth metal template for preventing the surface properties of the cushioning material from being transferred to the surface of the metal foil-clad laminate is increased, and
By using the same material as the metal template, it is possible to eliminate the difference in the coefficient of thermal expansion between the first metal template and the fourth metal template, and to reduce the stress included in the metal foil-clad laminate.

In a fourth manufacturing method according to the present invention, a plurality of sets of laminated structures in which a metal foil is laminated on both sides of one or more prepreg layers are stacked and put into a press hot platen, and each laminated structure is placed. A first step of manufacturing a double-sided metal foil-clad laminate by heat and pressure molding, and a second step of manufacturing a core wiring board by subjecting the double-sided metal foil-clad laminate to circuit processing of printed wiring, Plural sets of laminated structures in which a prepreg layer and a metal foil are laminated in this order from the inside to the outside on both sides of the core wiring board are stacked and put into a press hot platen, and each laminated structure is heated and pressed. In the production of the metal foil-clad laminate with the inner layer circuit through the third step of integration, the first metal mold plate having a thickness of 0.8 mm or less between the laminated components is used in the heat-press molding of the first step. Place. A second metal mold plate having a thickness of 1 mm or more is arranged on the uppermost surface and the lowermost surface of a plurality of sets of laminated structures which are put in one press hot plate and stacked. The removal of the metal foil-clad laminate from the press hot plate after the heat-press molding is performed after the pressure is released immediately after the heat-press molding and the metal foil-clad laminate is allowed to cool to a temperature of 100 ° C. or less. Alternatively, it is carried out after cooling under pressure after the heat and pressure molding, and thereafter, the metal foil-clad laminate is
Reheat at 50 ° C or higher for 30 minutes or longer. In the heat-press molding in the third step, the first metal mold plate is disposed between the laminated structures, and the uppermost surface of a plurality of sets of the laminated structures which are stacked and placed between one stage of a press hot platen. And the second metal template is disposed on the lowermost surface. In the fourth production method according to the present invention, in the state after the heat and pressure molding, the laminated plate has an internal stress. Heating releases the intrinsic stress of the laminate.

Further, in the first to third manufacturing methods according to the present invention, the removal of the metal foil-clad laminate from the press hot plate after the heat and pressure molding is performed by immediately removing the pressure after the heat and pressure molding to remove the metal foil. A method in which the laminate is cooled to 100 ° C. or less and then cooled is preferred in order to further reduce the internal stress of the metal foil-clad laminate. Also, a method in which the metal foil-clad laminate is taken out after cooling while being pressurized after the heat-press molding and then reheated at 150 ° C. or more for 30 minutes or more is also required to reduce the internal stress of the metal foil-clad laminate. It is preferable to reduce the number.

[0014]

DESCRIPTION OF THE PREFERRED EMBODIMENTS In the manufacturing method according to the present invention, a set of laminated structures is a laminated material corresponding to one metal foil-clad laminate or one metal-clad laminate with an inner layer circuit. In the case of a metal foil-clad laminate, it is a metal foil disposed on one or more layers of one or more prepreg layers. In the case of a metal foil-clad laminate with an inner layer circuit, it is a core wiring board, a prepreg layer and a metal foil stacked on both sides from the inside to the outside. In some cases, a plurality of core wiring boards may be used.In this case, a set of laminated structures includes a plurality of core wiring boards stacked via a prepreg layer, and a prepreg layer stacked on both sides from the inside to the outside. Foil.

As the metal template used in the manufacturing method according to the present invention, a stainless steel plate, an aluminum plate, an aluminum alloy plate, a copper plate, an iron plate or the like is appropriately selected. To the extent that the irregularities caused by the prepreg are not transferred through the metal template to the surface of the metal foil-clad laminate that is molded next to it, the tensile strength and proof stress of the metal template are selected, and the thickness is also limited as described above. Is appropriately selected within the range.

Example 1 (First Production Method) (First Step) A glass fiber woven base epoxy resin prepreg (corresponding to ANSI grade FR-4) having a thickness of 0.2 mm was provided on both sides of five layers with a thickness of 35 μm on both sides. A copper foil was arranged to form a set of laminated components, and 40 sets of the laminated components were placed between one stage of a press hot platen and heated and pressed to obtain a 1.0 mm thick double-sided copper-clad laminate. The product size was 500 × 330 mm. (Second step) The above double-sided copper-clad laminate was subjected to circuit processing of printed wiring to obtain a core wiring substrate. (Third step) On both sides of the core wiring board, a 0.2 mm thick glass fiber woven fabric base epoxy resin prepreg and a 18 µm thick copper foil are arranged in this order from the inside to the outside to form a set of laminated components. Twenty sets of the above-mentioned laminated structure were put in one stage of the hot platen, and heated and pressed to obtain a double-sided copper-clad laminate having an inner layer circuit having a thickness of 1.5 mm. In the above-mentioned first step, as shown in FIG.
(Made of JIS5182 aluminum alloy, 0.4 mm thick), and the first metal template 1 and the outer surface of the first metal template 1 are provided on the uppermost surface and the lowermost surface of the 40 sets of laminated structures stacked between the press hot plates 20. (2) The metal mold plate 2 (made of stainless steel, 1.2 mm thick) and the cushion material 30 are arranged. Further, the second metal template 2
A third metal template 3 (JIS 51) is provided between the first metal template 1 and the first metal template 1.
82 aluminum alloy, 0.4 mm thick). Also, the removal of the double-sided copper-clad laminate after molding was performed after cooling was performed while pressing between press hot plates.
In the third step, as shown in FIG. 4, the first metal template 1 (made of JIS5182 aluminum alloy, 0.4 mm thick) is arranged between the respective laminated structures 11,
A second metal template 2 (stainless steel, 1.2 mm thick) is provided on the uppermost surface and the lowermost surface of the 20 sets of laminated structures stacked in one stage.
And the cushion material 30 was disposed outside the cushion member.

Example 2 (First Production Method) In Example 1, the copper-clad laminate after the molding in the first step was taken out immediately after the molding was completed by releasing the molding pressure to 100 ° C. between the press hot plates. It was carried out after cooling to room temperature.

Example 3 (Second Manufacturing Method) In Example 1, a 2.0 mm thick brass plate was used as the third metal template 3 in the first step. Others were the same as Example 1.

Example 4 (Second Production Method) In Example 3, the copper-clad laminate after the molding in the first step was taken out immediately after the molding was completed by releasing the molding pressure at 100 ° C. between the press hot plates. It was carried out after cooling to room temperature.

Example 5 (Third Manufacturing Method) In Example 1, the first step was performed as shown in FIG.
Others were the same as Example 1. That is, as shown in FIG. 2, the first metal template 1
(Made of JIS5182 aluminum alloy, 0.4 mm thick), and a fourth metal template 4 (JI
S7025 aluminum alloy, 2.0 mm thick) and the cushion material 30 were arranged. The removal of the copper-clad laminate after the forming in the first step was performed after cooling was performed while pressurizing between press hot plates.

Example 6 (Third Manufacturing Method) In Example 5, after the completion of molding in the first step, the laminate was taken out, immediately after the molding was completed, the molding pressure was released and the temperature was released to 100 ° C. between press hot plates. Performed after cooling.

Example 7 (Fourth Manufacturing Method) In Example 1, the first step was performed as shown in FIG.
Others were the same as Example 1. That is, as shown in FIG. 3, the first metal template 1
(Made of JIS5182 aluminum alloy, 0.4 mm thick), and the second metal template 2 (stainless steel, 1 .2 mm thick) and the cushion material 30. In addition, the removal of the copper-clad laminate after the molding in the first step was performed immediately after the completion of the molding, after releasing the molding pressure and allowing the press to cool to 100 ° C. between the hot plates.

Example 8 (Fourth Production Method) In Example 7, the copper-clad laminate after the molding in the first step was taken out after cooling while pressing between press hot plates. Then, 150 ° C.
Under the temperature condition of 30 minutes.

Comparative Example 1 In Example 1, a 1.2 mm thick stainless steel plate was used as the third metal mold plate 3 in the first step. Others were the same as Example 1.

Comparative Example 2 In Example 1, a 1.6 mm-thick copper-clad laminate (ANSI grade F) was used as the third metal template 3 in the first step.
R-4). Others were the same as Example 1.

Comparative Example 3 In Example 8, the 1.6 mm-thick copper-clad laminate taken out of the press hot plate after the forming in the first step was not subjected to the reheating treatment.

In the first conventional example, the first step was as follows, and the other steps were the same as in the first example. That is, each laminated structure 1
A second metal template (stainless steel, 1.2 mm thick) is placed between the first and second metal mold plates, and the uppermost surface and the lowermost surface of the 14 sets of laminated structures stacked between the one stage of the press hot platens. A second metal template (stainless steel, 1.2 mm thick) was also arranged on the lower surface, and the cushion material 30 was overlaid.

Table 1 shows the type (plate thickness, material, and coefficient of thermal expansion) of the metal template used in the first step of each of the above Examples, Comparative Examples and Conventional Examples, and the cooling method after forming the double-sided copper-clad laminate. Are shown together. Table 2 summarizes the type (plate thickness, material, and coefficient of thermal expansion) of the metal template used in the third step and the cooling method after forming the double-sided copper-clad laminate containing the inner layer circuit.

[0029]

[Table 1]

[0030]

[Table 2]

Table 3 shows the evaluation results of the warpage of the double-sided copper-clad laminate containing the inner layer circuit and the positional accuracy of the inner layer circuit manufactured in each of the above examples. The warpage was measured on a laminate obtained by etching the entire surface of a copper foil of a double-sided copper-clad laminate containing an inner layer circuit and removing the copper foil. It is shown by the maximum value of the edge lifting amount when the laminate is placed flat. The inner layer circuit position accuracy is indicated by the maximum value of the deviation of the actual inner layer circuit position from the design position after the double-sided copper-clad laminate containing the inner layer circuit is processed.

[0032]

[Table 3]

As is clear from Table 3, according to each embodiment of the present invention, it is possible to manufacture a double-sided copper-clad laminate with an inner layer circuit having the same degree of warpage suppression and inner layer circuit position accuracy as the conventional example. it can. Then, the number of double-sided copper-clad laminates that can be manufactured by a single molding while maintaining the above effects is dramatically increased from the conventional example (from 14 sheets to 40 sheets per press hot plate). In the first to third production methods, the pressure is immediately released after the heat and pressure molding, and the double-sided copper clad laminate is allowed to cool to 100 ° C. or cooled while being pressed after the heat and pressure molding. Take out double-sided copper-clad laminate 150 ° C
By reheating for 30 minutes or more,
The warpage can be reduced and the positional accuracy of the inner layer circuit can be improved. The above Examples 2, 4 and 6 are methods in which the pressure is immediately released after the heat-press molding, the double-sided copper-clad laminate is allowed to cool to 100 ° C., and then the double-sided copper-clad laminate is taken out from the press hot platen. However, after being heated and pressed, it is cooled while being pressed, and then the double-sided copper-clad laminate is taken out.
The method of reheating for more than one minute can also provide the same effect as the depressurized cooling.

[0034]

As described above, according to the method of the present invention, it is possible to efficiently manufacture a metal foil-clad laminate having an inner layer circuit and having a small warpage and a small displacement of the inner layer circuit.

[Brief description of the drawings]

FIG. 1 shows the first and second manufacturing methods according to the present invention.
It is explanatory drawing of a process.

FIG. 2 is an explanatory view of a first step of a third manufacturing method according to the present invention.

FIG. 3 is an explanatory view of a first step of a fourth manufacturing method according to the present invention.

FIG. 4 is an explanatory view of a third step of the manufacturing method according to the present invention.

[Explanation of symbols]

1 is the first metal template 2 is the second metal template 3 is the third metal template 4 is the fourth metal template 10 and 11 are laminated structures 20 is a press hot plate 30 is cushion material

Continuation of front page    F term (reference) 5E346 AA06 AA12 AA15 AA26 AA32                       BB01 CC04 CC09 CC32 DD02                       DD12 EE02 EE06 EE09 EE13                       EE14 GG02 GG28 HH11

Claims (5)

[Claims] 1. A plurality of sets of laminated structures in which metal foils are laminated on both sides of one or more prepreg layers are stacked and put into a press hot platen, and each laminated structure is integrated by heating and pressing. A first step of manufacturing a double-sided metal foil-clad laminate; a second step of performing a printed wiring circuit processing on the double-sided metal foil-clad laminate to manufacture a core wiring board; and prepreg layers on both sides of the core wiring board And a metal foil are stacked in this order from the inside to the outside, and a plurality of sets of stacked structures are stacked and put into one stage of a press hot platen, and an inner layer passing through a third step of integrating each stacked structure by heating and pressing is formed. In the production of a metal-foil-clad laminate with a circuit, in the heat-press molding in the first step, a first metal template having a thickness of 0.8 mm or less is arranged between the laminated structures, and a press hot plate is placed between Configuration of multiple sets stacked on top of each other The first metal template and the second metal template having a thickness of 1 mm or more are disposed on the outermost surface and the lowermost surface of the first metal template, and a third metal template is provided between the second metal template and the first metal template. One or more metal templates are arranged, and the third metal template is made of the same material as the first metal template. In the heat-press molding in the third step, the first metal is placed between the laminated structures. Metal foil cladding with an inner layer circuit, wherein the second metal template is arranged on the uppermost surface and the lowermost surface of a plurality of sets of laminated structures which are arranged with a template and placed between one stage of a press hot platen. Manufacturing method of laminated board. 2. The method according to claim 1, wherein the third metal template is made of a material having a coefficient of thermal expansion that is intermediate between that of the first metal template and the second metal template in the first step. Item 3. The method for producing a metal foil-clad laminate containing an inner layer circuit according to Item 1. 3. A plurality of sets in which a first metal template having a thickness of 0.8 mm or less is arranged between the laminated structural members in the first step of heat and pressure molding, and the first metal template is placed between one stage of hot press plates. 2. A metal foil-clad laminate with an inner layer circuit according to claim 1, wherein a fourth metal template having the same material as the first metal template and having a thickness of 1 mm or more is arranged on the uppermost surface and the lowermost surface of the laminated structure. The method of manufacturing the board. 4. The method for producing a metal foil-clad laminate having an inner layer circuit according to any one of claims 1 to 3, wherein the metal foil-clad laminate is pressed from a press hot plate after the heat-press molding in the first step. The removal is performed immediately after the pressure molding, the pressure is released, and the metal foil-clad laminate is allowed to cool to 100 ° C. or less, or is cooled. Thereafter, the metal foil-clad laminate is reheated at 150 ° C. or more for 30 minutes or more. 5. A plurality of sets of laminated structures in which metal foils are laminated on both sides of one or more prepreg layers are stacked and put into a press hot platen, and each laminated structure is integrated by heating and pressing. A first step of manufacturing a double-sided metal foil-clad laminate; a second step of performing a printed wiring circuit processing on the double-sided metal foil-clad laminate to manufacture a core wiring board; and prepreg layers on both sides of the core wiring board And a metal foil are stacked in this order from the inside to the outside, and a plurality of sets of stacked structures are stacked and put into one stage of a press hot platen, and an inner layer passing through a third step of integrating each stacked structure by heating and pressing is formed. In the production of a metal-foil-clad laminate with a circuit, in the heat-press molding in the first step, a first metal template having a thickness of 0.8 mm or less is arranged between the laminated structures, and a press hot plate is placed between Configuration of multiple sets stacked on top of each other A second metal template having a thickness of 1 mm or more is placed on the uppermost surface and the lowermost surface of the metal foil. Immediately depressurize and allow the metal foil-clad laminate to cool until the temperature becomes 100 ° C or lower, or execute it after cooling under pressure after heating and pressing, and then perform the metal foil-clad laminate. Reheated at 150 ° C. or more for 30 minutes or more. In the heat-press molding in the third step, the first metal template was placed between the laminated structural bodies, and was placed in a single-stage press hot plate. A method for manufacturing a metal foil-clad laminate with an inner layer circuit, wherein the second metal template is disposed on the uppermost surface and the lowermost surface of a plurality of sets of laminated structures.