JPS6313340B2 - - Google Patents
Info
- Publication number
- JPS6313340B2 JPS6313340B2 JP56093147A JP9314781A JPS6313340B2 JP S6313340 B2 JPS6313340 B2 JP S6313340B2 JP 56093147 A JP56093147 A JP 56093147A JP 9314781 A JP9314781 A JP 9314781A JP S6313340 B2 JPS6313340 B2 JP S6313340B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- insulating film
- temperature
- vapor phase
- forming
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H10P14/60—
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56093147A JPS57208146A (en) | 1981-06-17 | 1981-06-17 | Forming method for insulating film to compound semiconductor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56093147A JPS57208146A (en) | 1981-06-17 | 1981-06-17 | Forming method for insulating film to compound semiconductor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57208146A JPS57208146A (en) | 1982-12-21 |
| JPS6313340B2 true JPS6313340B2 (enExample) | 1988-03-25 |
Family
ID=14074415
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56093147A Granted JPS57208146A (en) | 1981-06-17 | 1981-06-17 | Forming method for insulating film to compound semiconductor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57208146A (enExample) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4560420A (en) * | 1984-06-13 | 1985-12-24 | At&T Technologies, Inc. | Method for reducing temperature variations across a semiconductor wafer during heating |
| US6594446B2 (en) | 2000-12-04 | 2003-07-15 | Vortek Industries Ltd. | Heat-treating methods and systems |
| JP2005515425A (ja) | 2001-12-26 | 2005-05-26 | ボルテック インダストリーズ リミテッド | 温度測定および熱処理方法およびシステム |
| CN1729554B (zh) | 2002-12-20 | 2014-05-07 | 马特森技术有限公司 | 用来支撑工件和用来热处理工件的方法和系统 |
| JP5630935B2 (ja) | 2003-12-19 | 2014-11-26 | マトソン テクノロジー、インコーポレイテッド | 工作物の熱誘起運動を抑制する機器及び装置 |
| WO2009137940A1 (en) | 2008-05-16 | 2009-11-19 | Mattson Technology Canada, Inc. | Workpiece breakage prevention method and apparatus |
-
1981
- 1981-06-17 JP JP56093147A patent/JPS57208146A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57208146A (en) | 1982-12-21 |
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