JPS63130620A - Epoxy resin composition - Google Patents
Epoxy resin compositionInfo
- Publication number
- JPS63130620A JPS63130620A JP27824386A JP27824386A JPS63130620A JP S63130620 A JPS63130620 A JP S63130620A JP 27824386 A JP27824386 A JP 27824386A JP 27824386 A JP27824386 A JP 27824386A JP S63130620 A JPS63130620 A JP S63130620A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- resin composition
- silicon dioxide
- hydrophobic
- epoxy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003822 epoxy resin Substances 0.000 title claims abstract description 37
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 37
- 239000000203 mixture Substances 0.000 title claims abstract description 25
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 49
- 230000002209 hydrophobic effect Effects 0.000 claims abstract description 20
- 239000000377 silicon dioxide Substances 0.000 claims abstract description 20
- 235000012239 silicon dioxide Nutrition 0.000 claims abstract description 18
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 17
- 239000013008 thixotropic agent Substances 0.000 claims abstract description 14
- 239000000945 filler Substances 0.000 claims abstract description 12
- 239000004593 Epoxy Substances 0.000 claims abstract description 10
- 229910002012 Aerosil® Inorganic materials 0.000 abstract description 5
- 230000014759 maintenance of location Effects 0.000 description 14
- 230000000694 effects Effects 0.000 description 7
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 5
- 239000003566 sealing material Substances 0.000 description 5
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 239000005350 fused silica glass Substances 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 239000000565 sealant Substances 0.000 description 3
- 230000009974 thixotropic effect Effects 0.000 description 3
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 2
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 2
- 238000004898 kneading Methods 0.000 description 2
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 231100000989 no adverse effect Toxicity 0.000 description 2
- 229920003986 novolac Polymers 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 239000004359 castor oil Substances 0.000 description 1
- 235000019438 castor oil Nutrition 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 229910002026 crystalline silica Inorganic materials 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 239000008393 encapsulating agent Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- ZEMPKEQAKRGZGQ-XOQCFJPHSA-N glycerol triricinoleate Natural products CCCCCC[C@@H](O)CC=CCCCCCCCC(=O)OC[C@@H](COC(=O)CCCCCCCC=CC[C@@H](O)CCCCCC)OC(=O)CCCCCCCC=CC[C@H](O)CCCCCC ZEMPKEQAKRGZGQ-XOQCFJPHSA-N 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 239000004849 latent hardener Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000004848 polyfunctional curative Substances 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- 150000003852 triazoles Chemical class 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔技術分野〕
この発明は、ＩＣ封止用の封止材等として用いられるエ
ポキシ樹脂組成物に関する。DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to an epoxy resin composition used as a sealing material for IC sealing.
チップオンボード等を封止材で封止するにあたっては、
封止材の形状保持性が重要である。ベアチップ（裸のチ
ップ）に上から封止材を塗布した際、ワイヤが露出する
ことのないよう封止材が充分に盛り上がらなければなら
ないからである。従来、封止材としては、エポキシ樹脂
組成物が広く用いられており、充斌材（フィラー）およ
び粉末の硬化剤を配合してチクソ性をもたせ、形状保持
性を出させることが行われている。しかし、まだ、形状
保持性が不充分であった。When sealing chip-on-board etc. with sealant,
The shape retention of the sealant is important. This is because when a sealing material is applied to a bare chip from above, the sealing material must rise sufficiently so that the wires are not exposed. Conventionally, epoxy resin compositions have been widely used as encapsulants, and fillers and powdered curing agents are added to impart thixotropic properties and shape retention. There is. However, the shape retention was still insufficient.
形状保持性を向上させるため、フィラー率を上げること
が考えられる。しかし、このようにすることは、封止材
が大分増粘するうえ、線膨張率も変化するので好ましく
ない。硬化剤の配合量を増やすことも考えられるが、こ
のようにすることは、封止材の反応性が変わるので、や
はり好ましくない。In order to improve shape retention, it is possible to increase the filler ratio. However, doing so is not preferable because the viscosity of the sealing material increases considerably and the coefficient of linear expansion also changes. Although it is conceivable to increase the blending amount of the curing agent, this is still not preferable since the reactivity of the sealing material changes.
（発明の目的〕
この発明は、このような事情に鑑みてなされたものであ
って、形状保持性の優れたエポキシ樹脂組成物を提供す
ることを目的としている。(Object of the Invention) The present invention has been made in view of the above circumstances, and an object thereof is to provide an epoxy resin composition with excellent shape retention.
前記のような目的を達成するため、発明者は、研究を重
ね、チクソ性付与剤をエポキシ樹脂組成物に含ませるこ
とを考え出した。しかし、水添ヒマシ油等の一般の有機
物系チクソ性付与剤を用いた場合、常温ではチクソ効果
により形状保持性を向上させることができるけれども、
１６０℃の硬化温度ではその効果がなくなることがわか
った。In order to achieve the above objects, the inventors conducted repeated research and came up with the idea of including a thixotropic agent in an epoxy resin composition. However, when a general organic thixotropic agent such as hydrogenated castor oil is used, although shape retention can be improved due to the thixotropic effect at room temperature,
It was found that the effect disappears at a curing temperature of 160°C.
また、親水性の二酸化ケイ素（アエロジル）を用いるこ
ととした場合、添加初期は効果が大きいが、１週間程度
で効果がほとんどなくなることがわかった。発明者は、
さらに研究を重ねた。その結果、疎水性の二酸化ケイ素
を用いるようにすると、添加初期の効果が高いうえ、１
６０℃においても効果が保たれ、経時変化も少ないとい
うことを見出し、ここに、この発明を完成した。Furthermore, when hydrophilic silicon dioxide (Aerosil) was used, it was found that although the effect was large at the initial stage of addition, the effect almost disappeared after about a week. The inventor is
Further research was conducted. As a result, the use of hydrophobic silicon dioxide not only has a high effect at the initial stage of addition, but also
It was discovered that the effect is maintained even at 60°C and there is little change over time, and the present invention has now been completed.
したがって、この発明は、エポキシ樹脂、エポキシ硬化
剤および充填材を含むエポキシ樹脂組成物であって、疎
水性の二酸化ケイ素がチクソ性付与剤として用いられて
いることを特徴とするエポキシ樹脂組成物をその要旨と
している。Therefore, the present invention provides an epoxy resin composition containing an epoxy resin, an epoxy curing agent, and a filler, characterized in that hydrophobic silicon dioxide is used as a thixotropic agent. This is the summary.
以下に、この発明の詳細な説明する。The present invention will be explained in detail below.
エポキシ樹脂としては、液状エポキシ樹脂、たとえば、
低分子量ビスフェノールＡ型エポキシ樹脂等が用いられ
るが、特に限定はされない。また、固体状エポキシ樹脂
であっても、液状のものと併用して全体が液状となるよ
うであれば、用いてもさしつかえない。たとえば、フェ
ノールノボラック型エポキシ樹脂、クレゾールノボラッ
ク型エポキシ樹脂があげられる。さらに、硬化物に可撓
性を付与するため、ゴム変性エポキシ樹脂、脂環式エポ
キシ樹脂等を用いることもでき、難燃性を付与するため
、各種のハロゲン化エポキシ樹脂等を用いることもでき
る。As the epoxy resin, liquid epoxy resin, for example,
A low molecular weight bisphenol A type epoxy resin or the like is used, but there is no particular limitation. Further, even a solid epoxy resin may be used as long as it is used in combination with a liquid epoxy resin so that the entire resin becomes liquid. Examples include phenol novolac type epoxy resins and cresol novolac type epoxy resins. Furthermore, in order to impart flexibility to the cured product, rubber-modified epoxy resins, alicyclic epoxy resins, etc. can also be used, and in order to impart flame retardance, various halogenated epoxy resins, etc. can also be used. .
エポキシ硬化剤としては、たとえば、潜在硬化性のある
２、４−ジヒドラジン−６−メチルアミノ−ｓｙｍ−）
リアジン（以下、ｒ２，４ＨＴＪと記す）等のトリアジ
ン系硬化剤等が用いられる。エポキシ硬化剤の使用量は
、エポキシ樹脂組成物の使用目的に応じて適宜法められ
るが、前記トリアジン系硬化剤の場合は、エポキシ樹脂
に対して、１０〜３０ＰＨＲ用いるのが好ましい。エポ
キシ硬化剤はエポキシ樹脂に分散させて一液化するとよ
い。As the epoxy curing agent, for example, latent curing 2,4-dihydrazine-6-methylamino-sym-)
A triazine-based curing agent such as riazine (hereinafter referred to as r2,4HTJ) is used. The amount of the epoxy curing agent to be used is determined as appropriate depending on the intended use of the epoxy resin composition, but in the case of the triazine curing agent, it is preferable to use 10 to 30 PHR based on the epoxy resin. The epoxy curing agent is preferably dispersed in an epoxy resin to form a single component.
充填材としては、溶融シリカ、結晶シリカ、水酸化アル
ミニウム、アルミナ等が用いられる。２種以上が併用さ
れるようであってもよい。充填材の使用量は、エポキシ
樹脂組成物の使用目的に応じて適宜法められるが、３０
〜８０重量％添加されるようにするのが好ましい。As the filler, fused silica, crystalline silica, aluminum hydroxide, alumina, etc. are used. Two or more types may be used in combination. The amount of filler used is determined as appropriate depending on the purpose of use of the epoxy resin composition, but
It is preferable to add 80% by weight.
チクソ性付与剤として用いられる疎水性二酸化ケイ素（
疎水性超微粒子状無水シリカ、疎水性アエロジル）は、
０．２〜５．０重量％と少量添加されるようにするのが
好ましく、普通は、０．５重量％程度添加される。疎水
性二酸化シリカは、表面がメチル化される等して、水に
対する親和性が小さくなった二酸化ケイ素のことである
。疎水性二酸化ケイ素の添加量が多すぎると、粘度の上
昇が大きくなるとともに、硬化物表面の状態も均一にな
らなくなる傾向にあるので好ましくない。Hydrophobic silicon dioxide (used as a thixotropic agent)
Hydrophobic ultrafine particulate anhydrous silica, hydrophobic Aerosil) is
It is preferable to add a small amount of 0.2 to 5.0% by weight, and usually about 0.5% by weight. Hydrophobic silica is silicon dioxide whose surface is methylated and has a reduced affinity for water. If the amount of hydrophobic silicon dioxide added is too large, the viscosity increases significantly and the surface condition of the cured product tends to become uneven, which is not preferable.
前記のような原材料のほか、硬化温度の低下および硬化
時間の短縮といった目的で、硬化促進剤を用いるように
してもよい。硬化促進剤としては、たとえば、２−エチ
ルメチルイミダゾール等の各種イミダゾール類、第３級
アミン、トリアゾール類等があげられ、２種以上が併用
されるようであってもよい。このほか、一般に使用され
ている種々の添加剤が用いられるようであってもよい。In addition to the above-mentioned raw materials, a curing accelerator may be used for the purpose of lowering the curing temperature and shortening the curing time. Examples of the curing accelerator include various imidazoles such as 2-ethylmethylimidazole, tertiary amines, and triazoles, and two or more types may be used in combination. In addition, various commonly used additives may be used.
たとえば、カップリング剤、レベリング剤、希釈剤、難
燃剤、潤滑剤、沈降防止剤、密着性付与剤、Ｒ料９分散
剤、消泡剤等である。Examples include coupling agents, leveling agents, diluents, flame retardants, lubricants, antisettling agents, adhesion agents, R material 9 dispersants, antifoaming agents, and the like.
この発明にかかるエポキシ樹脂組成物は、たとえば、前
記のような原材料を混合したのち、ニーダ、ロール、ア
ジホモミキサー、らいかい機、プラネタリ−ミキサ等で
混練して得ることができる、なお、混練中および混練後
、減圧下で脱気するようにするのが好ましい。また、疎
水性二酸化ケイ素は充填材にあらかじめ混合しておくよ
うにするとよい。The epoxy resin composition according to the present invention can be obtained by, for example, mixing the above-mentioned raw materials and then kneading the mixture in a kneader, roll, ajihomo mixer, sieve machine, planetary mixer, etc. During and after kneading, it is preferable to degas under reduced pressure. Further, it is preferable to mix hydrophobic silicon dioxide into the filler in advance.
この発明にかかるエポキシ樹脂組成物組成物は、疎水性
二酸化ケイ素が用いられているので、チクソ性が付与さ
れて、形状保持性が非常によくなり、１６０℃において
もその性能が維持され、経時変化も少なく高い形状保持
性が持続する。しかも、二酸化ケイ素の使用量は少なく
ても充分な効果を得ることができ、少ない場合は、硬化
物の物性はほとんど変化せず、熱線膨張率や電気的物性
に悪影響が出ることもないうえ、ＰＣＴ（プレッシャー
クツカーテスト）やＴＨＢ （ｔｈｅｒｍａｌ ｈｕｍ
ｉｄｉｔｙ ｂｉａｓ ）等の信頼性試験にも悪影響が
出ないつぎに、実施例および比較例について説明する実
施例１〜５および比較例１〜３では、エポキシ樹脂、エ
ポキシ硬化剤、充填材およびチクソ性付与剤を用いるよ
うにし、チクソ性付与剤を充填材に混合したのち、シア
（剪断力）をかけつつ、この混合物をプラネタリ−ミキ
サでエポキシ樹脂と混練してエポキシ樹脂組成物を得た
。従来例では、チクソ性付与剤を用いないほかは、前記
と同様にしてエポキシ樹脂組成物を得た。ただし、エポ
キシ樹脂としては、ビスフェノールＡ型エポキシ樹脂（
東部化成■製のＹＤ１２７）、エポキシ硬化剤としては
、潜在性硬化剤の２，４ＨＴ（日本ヒドラジン工業側製
）、充填剤としては、溶融シリカ（■龍森のＲＤ８、平
均粒径２５μｍ）をそれぞれ用いることとした。用いた
チクソ性付与剤の種類を、第１表に示す。疎水性二酸化
ケイ素としては、日本アエロジルａ−製の疎水性アエロ
ジルＲＹ２００を用いた。溶融シリカの添加量は６０重
量％とした。チクソ性付与剤の添加量は第１表に示した
とおりである。Since the epoxy resin composition composition according to the present invention uses hydrophobic silicon dioxide, it is imparted with thixotropy and has very good shape retention, maintains its performance even at 160°C, and maintains its properties over time. There is little change and high shape retention lasts. Moreover, sufficient effects can be obtained even if the amount of silicon dioxide used is small; if the amount is small, the physical properties of the cured product will hardly change, and there will be no adverse effect on the linear thermal expansion coefficient or electrical properties. PCT (pressure hum test) and THB (thermal hum test)
There is no adverse effect on reliability tests such as epoxy resin, epoxy curing agent, filler, and thixotropic properties. After mixing the thixotropic agent with the filler, the mixture was kneaded with an epoxy resin in a planetary mixer while applying shear (shearing force) to obtain an epoxy resin composition. In the conventional example, an epoxy resin composition was obtained in the same manner as described above except that no thixotropic agent was used. However, as an epoxy resin, bisphenol A type epoxy resin (
YD127 (manufactured by Tobu Kasei), the latent hardener 2,4HT (manufactured by Nippon Hydrazine Kogyo) as the epoxy hardener, and fused silica (RD8 of Ryumori, average particle size 25 μm) as the filler. We decided to use each. The types of thixotropic agents used are shown in Table 1. As the hydrophobic silicon dioxide, hydrophobic Aerosil RY200 manufactured by Nippon Aerosil A- was used. The amount of fused silica added was 60% by weight. The amount of the thixotropic agent added is as shown in Table 1.
実施例１〜５．比較例１〜３および従来例につき、流れ
高さ、粘度の上昇および硬化物の表面状態を調べた。た
だし、流れ高さは、エポキシ樹脂組成物を基板上に０．
６ｇ落としたときの高さを、添加初期の室温と１６０°
Ｃ硬化後、およびチクソ性付与剤添加後１カ月で１６０
℃硬化後の各場合につき測定することとした。なお、硬
化物の表面状態は、エポキシ樹脂組成物がフラットにレ
ベリングした場合は均一な表面となるが、チクソ性が高
すぎる場合はレベリングせず荒い表面となる。Examples 1-5. Comparative Examples 1 to 3 and the conventional example were examined for flow height, increase in viscosity, and surface condition of the cured product. However, the flow height of the epoxy resin composition on the substrate is 0.
The height when 6g is dropped is 160° from the room temperature at the beginning of addition.
C 160 after curing and one month after adding thixotropic agent
It was decided to measure each case after curing at °C. Note that the surface state of the cured product will be a uniform surface if the epoxy resin composition is leveled flat, but if the thixotropy is too high, there will be no leveling and a rough surface.
第１表より、実施例１〜５のエポキシ樹脂組成物は、室
温および１６０℃において形状保持性が非常によく、そ
の経時変化も少ないうえ、粘度の上昇が小さいことがわ
かる。これに対し、比較例１は、１６０℃における形状
保持性が悪く、その経時変化も大きいうえ、粘度の上昇
も大きい。比較例２は、形状保持性の経時変化が大きい
。比較例３は、形状保持性の経時変化が太き（、粘度の
上昇も大きい。従来例は、形状保持性が悪い。From Table 1, it can be seen that the epoxy resin compositions of Examples 1 to 5 have very good shape retention at room temperature and 160°C, have little change over time, and have a small increase in viscosity. On the other hand, Comparative Example 1 has poor shape retention at 160°C, large changes over time, and large increase in viscosity. Comparative Example 2 shows a large change in shape retention over time. In Comparative Example 3, the change in shape retention over time is large (and the increase in viscosity is also large).The conventional example has poor shape retention.
この発明にかかるエポキシ樹脂組成物は、エポキシ）封
脂、エポキシ硬化剤および充瞑材を含むエポキシ樹脂組
成物であって、疎水性の二酸化ケイ素がチクソ性付与剤
として用いられているので、形状保持性が非常によく、
１６０℃においてもその性能が維持され、経時変化も少
ない。The epoxy resin composition according to the present invention is an epoxy resin composition containing an epoxy sealant, an epoxy curing agent, and a filler material, and since hydrophobic silicon dioxide is used as a thixotropic agent, the shape Very good retention,
Its performance is maintained even at 160°C, and there is little change over time.
代理人 弁理士 松 本 武 彦
弓勾げ篩甫正書（自発）
昭和６２年 ４月 ８日
昭和６１年特許願第２７８２４３号
２、発明の名称
エポキシ樹脂組成物
３、補正をする者
事件との関係 特許出伸几入
住 所 大阪府門真市大字門真１０４８番
地名 称（５８３”）松下電工株式会社
代表者 イ懺眼帝役藤井貞夫
４、代理人
６、補正の対象 Ｐ６１−２７８２
４３明細書
７、補正の内容
（１１明細書第９頁の第１表中、実施例１〜５のチクソ
性付与剤の種類の欄に、それぞれ、「疏水性二酸化ケイ
素」とあるを、「疎水性二酸化ケイ素」と訂正する。Agent Patent Attorney Takehiko Matsumoto Yumi Kageshihosho (self-proposal) April 8, 1985 Patent Application No. 278243 of 1988 2, Title of invention: Epoxy resin composition 3, Person making amendment case Relationship with Patent Issue Address: 1048 Oaza Kadoma, Kadoma City, Osaka Name (583”) Matsushita Electric Works Co., Ltd. Representative: Sadao Fujii 4, Agent 6, Subject of amendment P61-2782
43 Specification 7, Contents of amendment (11 In Table 1 on page 9 of the specification, in the column for the type of thixotropic agent in Examples 1 to 5, the term "hydrophobic silicon dioxide" was replaced with " Hydrophobic silicon dioxide” is corrected.
（２）明細書第４頁第１２行ないし第１３行に「用いら
れる。」とあるを、「用いられるが、限定はされない。(2) On page 4, lines 12 to 13 of the specification, the phrase ``used'' was replaced with ``used, but not limited.''
ｊと訂正する。Correct it as j.
Claims (1)
むエポキシ樹脂組成物であって、疎水性の二酸化ケイ素
がチクソ性付与剤として用いられていることを特徴とす
るエポキシ樹脂組成物。(1) An epoxy resin composition containing an epoxy resin, an epoxy curing agent, and a filler, characterized in that hydrophobic silicon dioxide is used as a thixotropic agent.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61278243A JP2501804B2 (en) | 1986-11-20 | 1986-11-20 | Epoxy resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61278243A JP2501804B2 (en) | 1986-11-20 | 1986-11-20 | Epoxy resin composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63130620A true JPS63130620A (en) | 1988-06-02 |
| JP2501804B2 JP2501804B2 (en) | 1996-05-29 |
Family
ID=17594616
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61278243A Expired - Lifetime JP2501804B2 (en) | 1986-11-20 | 1986-11-20 | Epoxy resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2501804B2 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0360056A (en) * | 1989-07-28 | 1991-03-15 | Tomoegawa Paper Co Ltd | Solid state image sensing device sealing adhesive |
| EP0421390A2 (en) * | 1989-10-06 | 1991-04-10 | Somar Corporation | Hardening agent composition, method of preparing the same and thermosetting epoxy resin composition |
| JP2011521033A (en) * | 2008-05-15 | 2011-07-21 | エボニック デグサ ゲーエムベーハー | Electronic packaging |
| JP2013237865A (en) * | 2006-11-15 | 2013-11-28 | Hitachi Chemical Co Ltd | Thermosetting resin composition for light reflection, method of manufacturing the resin composition, optical semiconductor element-mounting substrate using the resin composition, and optical semiconductor device |
| CN108793829A (en) * | 2018-07-09 | 2018-11-13 | 河北建研材料技术有限公司 | Concrete crack healant and its preparation method and application |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS539297A (en) * | 1976-07-12 | 1978-01-27 | Nat Semiconductor Corp | Modified silica and method of making same |
| JPS59108026A (en) * | 1982-12-10 | 1984-06-22 | Toshiba Chem Corp | Epoxy resin composition for sealing |
| JPS6047019A (en) * | 1983-08-25 | 1985-03-14 | Toshiba Chem Corp | Sealing epoxy resin composition |
-
1986
- 1986-11-20 JP JP61278243A patent/JP2501804B2/en not_active Expired - Lifetime
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS539297A (en) * | 1976-07-12 | 1978-01-27 | Nat Semiconductor Corp | Modified silica and method of making same |
| JPS59108026A (en) * | 1982-12-10 | 1984-06-22 | Toshiba Chem Corp | Epoxy resin composition for sealing |
| JPS6047019A (en) * | 1983-08-25 | 1985-03-14 | Toshiba Chem Corp | Sealing epoxy resin composition |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0360056A (en) * | 1989-07-28 | 1991-03-15 | Tomoegawa Paper Co Ltd | Solid state image sensing device sealing adhesive |
| EP0421390A2 (en) * | 1989-10-06 | 1991-04-10 | Somar Corporation | Hardening agent composition, method of preparing the same and thermosetting epoxy resin composition |
| JP2013237865A (en) * | 2006-11-15 | 2013-11-28 | Hitachi Chemical Co Ltd | Thermosetting resin composition for light reflection, method of manufacturing the resin composition, optical semiconductor element-mounting substrate using the resin composition, and optical semiconductor device |
| US9387608B2 (en) | 2006-11-15 | 2016-07-12 | Hitachi Chemical Company, Ltd. | Thermosetting resin composition for light reflection, method for manufacturing the resin composition and optical semiconductor element mounting substrate and optical semiconductor device using the resin composition |
| US10381533B2 (en) | 2006-11-15 | 2019-08-13 | Hitachi Chemical Company, Ltd. | Optical semiconductor element mounting substrate and optical semiconductor device using thermosetting resin composition for light reflection |
| JP2011521033A (en) * | 2008-05-15 | 2011-07-21 | エボニック デグサ ゲーエムベーハー | Electronic packaging |
| CN108793829A (en) * | 2018-07-09 | 2018-11-13 | 河北建研材料技术有限公司 | Concrete crack healant and its preparation method and application |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2501804B2 (en) | 1996-05-29 |
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| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |