JPS63128634A - 半導体装置の製造方法 - Google Patents

半導体装置の製造方法

Info

Publication number
JPS63128634A
JPS63128634A JP61275912A JP27591286A JPS63128634A JP S63128634 A JPS63128634 A JP S63128634A JP 61275912 A JP61275912 A JP 61275912A JP 27591286 A JP27591286 A JP 27591286A JP S63128634 A JPS63128634 A JP S63128634A
Authority
JP
Japan
Prior art keywords
aluminum
pad
semiconductor device
electrode
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP61275912A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0546978B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html
Inventor
Eiji Hagimoto
萩本　英二
Seiichi Nishino
西野　誠一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP61275912A priority Critical patent/JPS63128634A/ja
Publication of JPS63128634A publication Critical patent/JPS63128634A/ja
Publication of JPH0546978B2 publication Critical patent/JPH0546978B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP61275912A 1986-11-18 1986-11-18 半導体装置の製造方法 Granted JPS63128634A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61275912A JPS63128634A (ja) 1986-11-18 1986-11-18 半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61275912A JPS63128634A (ja) 1986-11-18 1986-11-18 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS63128634A true JPS63128634A (ja) 1988-06-01
JPH0546978B2 JPH0546978B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1993-07-15

Family

ID=17562157

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61275912A Granted JPS63128634A (ja) 1986-11-18 1986-11-18 半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPS63128634A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6472304B2 (en) * 1999-01-23 2002-10-29 Agere Systems Inc. Wire bonding to copper
US20120032354A1 (en) * 2010-08-06 2012-02-09 National Semiconductor Corporation Wirebonding method and device enabling high-speed reverse wedge bonding of wire bonds
EP2444999A4 (en) * 2009-06-18 2012-11-14 Rohm Co Ltd SEMICONDUCTOR DEVICE
JP2017011176A (ja) * 2015-06-24 2017-01-12 ローム株式会社 半導体装置および半導体装置の製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56116634A (en) * 1980-02-20 1981-09-12 Hitachi Ltd Semiconductor device
JPS56162844A (en) * 1980-05-19 1981-12-15 Hitachi Ltd Semiconductor device and manufacture thereof
JPS59150460A (ja) * 1983-01-31 1984-08-28 Toshiba Corp 半導体装置の製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56116634A (en) * 1980-02-20 1981-09-12 Hitachi Ltd Semiconductor device
JPS56162844A (en) * 1980-05-19 1981-12-15 Hitachi Ltd Semiconductor device and manufacture thereof
JPS59150460A (ja) * 1983-01-31 1984-08-28 Toshiba Corp 半導体装置の製造方法

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6472304B2 (en) * 1999-01-23 2002-10-29 Agere Systems Inc. Wire bonding to copper
EP2444999A4 (en) * 2009-06-18 2012-11-14 Rohm Co Ltd SEMICONDUCTOR DEVICE
US9780069B2 (en) 2009-06-18 2017-10-03 Rohm Co., Ltd. Semiconductor device
US10163850B2 (en) 2009-06-18 2018-12-25 Rohm Co., Ltd. Semiconductor device
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