JPS6311776B2 - - Google Patents
Info
- Publication number
- JPS6311776B2 JPS6311776B2 JP58084309A JP8430983A JPS6311776B2 JP S6311776 B2 JPS6311776 B2 JP S6311776B2 JP 58084309 A JP58084309 A JP 58084309A JP 8430983 A JP8430983 A JP 8430983A JP S6311776 B2 JPS6311776 B2 JP S6311776B2
- Authority
- JP
- Japan
- Prior art keywords
- suction
- semiconductor wafer
- light beam
- angle
- enclosure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H10P72/0616—
-
- H10P72/50—
-
- H10P72/78—
Landscapes
- Length Measuring Devices By Optical Means (AREA)
- Gripping Jigs, Holding Jigs, And Positioning Jigs (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58084309A JPS59208741A (ja) | 1983-05-12 | 1983-05-12 | 半導体ウエ−ハ用吸着チヤツク装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58084309A JPS59208741A (ja) | 1983-05-12 | 1983-05-12 | 半導体ウエ−ハ用吸着チヤツク装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59208741A JPS59208741A (ja) | 1984-11-27 |
| JPS6311776B2 true JPS6311776B2 (OSRAM) | 1988-03-16 |
Family
ID=13826890
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58084309A Granted JPS59208741A (ja) | 1983-05-12 | 1983-05-12 | 半導体ウエ−ハ用吸着チヤツク装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59208741A (OSRAM) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2554341B2 (ja) * | 1987-09-28 | 1996-11-13 | 東京エレクトロン株式会社 | プローブ装置 |
| JPH0989997A (ja) * | 1995-09-20 | 1997-04-04 | Hioki Ee Corp | 基板検査装置用吸引式基板固定具 |
| US5872694A (en) * | 1997-12-23 | 1999-02-16 | Siemens Aktiengesellschaft | Method and apparatus for determining wafer warpage for optimized electrostatic chuck clamping voltage |
| JP4795893B2 (ja) * | 2006-08-22 | 2011-10-19 | 東京エレクトロン株式会社 | 基板検知機構および基板収容容器 |
| JP5243139B2 (ja) * | 2008-07-31 | 2013-07-24 | 株式会社ディスコ | レーザ加工装置及びレーザ加工方法 |
| JP2014033057A (ja) * | 2012-08-02 | 2014-02-20 | Murata Mfg Co Ltd | 基板吸着装置 |
| JP6789187B2 (ja) * | 2017-07-07 | 2020-11-25 | 東京エレクトロン株式会社 | 基板反り検出装置及び基板反り検出方法、並びにこれらを用いた基板処理装置及び基板処理方法 |
-
1983
- 1983-05-12 JP JP58084309A patent/JPS59208741A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59208741A (ja) | 1984-11-27 |
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