JPS6311721Y2 - - Google Patents

Info

Publication number
JPS6311721Y2
JPS6311721Y2 JP1983070394U JP7039483U JPS6311721Y2 JP S6311721 Y2 JPS6311721 Y2 JP S6311721Y2 JP 1983070394 U JP1983070394 U JP 1983070394U JP 7039483 U JP7039483 U JP 7039483U JP S6311721 Y2 JPS6311721 Y2 JP S6311721Y2
Authority
JP
Japan
Prior art keywords
resin
flip chip
wiring board
integrated circuit
active material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1983070394U
Other languages
English (en)
Japanese (ja)
Other versions
JPS59176150U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1983070394U priority Critical patent/JPS59176150U/ja
Publication of JPS59176150U publication Critical patent/JPS59176150U/ja
Application granted granted Critical
Publication of JPS6311721Y2 publication Critical patent/JPS6311721Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
JP1983070394U 1983-05-10 1983-05-10 混成集積回路装置 Granted JPS59176150U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1983070394U JPS59176150U (ja) 1983-05-10 1983-05-10 混成集積回路装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1983070394U JPS59176150U (ja) 1983-05-10 1983-05-10 混成集積回路装置

Publications (2)

Publication Number Publication Date
JPS59176150U JPS59176150U (ja) 1984-11-24
JPS6311721Y2 true JPS6311721Y2 (enExample) 1988-04-05

Family

ID=30200543

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1983070394U Granted JPS59176150U (ja) 1983-05-10 1983-05-10 混成集積回路装置

Country Status (1)

Country Link
JP (1) JPS59176150U (enExample)

Also Published As

Publication number Publication date
JPS59176150U (ja) 1984-11-24

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