JPS63116462A - 固体撮像装置のシ−リング方法 - Google Patents
固体撮像装置のシ−リング方法Info
- Publication number
- JPS63116462A JPS63116462A JP61261824A JP26182486A JPS63116462A JP S63116462 A JPS63116462 A JP S63116462A JP 61261824 A JP61261824 A JP 61261824A JP 26182486 A JP26182486 A JP 26182486A JP S63116462 A JPS63116462 A JP S63116462A
- Authority
- JP
- Japan
- Prior art keywords
- glass plate
- solid
- adhesive
- sheet
- epoxy resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/50—Encapsulations or containers
-
- H10W72/884—
Landscapes
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61261824A JPS63116462A (ja) | 1986-11-05 | 1986-11-05 | 固体撮像装置のシ−リング方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61261824A JPS63116462A (ja) | 1986-11-05 | 1986-11-05 | 固体撮像装置のシ−リング方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63116462A true JPS63116462A (ja) | 1988-05-20 |
| JPH057871B2 JPH057871B2 (cg-RX-API-DMAC10.html) | 1993-01-29 |
Family
ID=17367240
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61261824A Granted JPS63116462A (ja) | 1986-11-05 | 1986-11-05 | 固体撮像装置のシ−リング方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63116462A (cg-RX-API-DMAC10.html) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5343076A (en) * | 1990-07-21 | 1994-08-30 | Mitsui Petrochemical Industries, Ltd. | Semiconductor device with an airtight space formed internally within a hollow package |
| JP4771023B1 (ja) * | 2011-03-25 | 2011-09-14 | マックス株式会社 | 長尺媒体 |
-
1986
- 1986-11-05 JP JP61261824A patent/JPS63116462A/ja active Granted
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5343076A (en) * | 1990-07-21 | 1994-08-30 | Mitsui Petrochemical Industries, Ltd. | Semiconductor device with an airtight space formed internally within a hollow package |
| US6048754A (en) * | 1990-07-21 | 2000-04-11 | Mitsui Chemicals, Inc. | Method of manufacturing a semiconductor device with an airtight space formed internally within a hollow package |
| JP4771023B1 (ja) * | 2011-03-25 | 2011-09-14 | マックス株式会社 | 長尺媒体 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH057871B2 (cg-RX-API-DMAC10.html) | 1993-01-29 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |