JPH057871B2 - - Google Patents
Info
- Publication number
- JPH057871B2 JPH057871B2 JP61261824A JP26182486A JPH057871B2 JP H057871 B2 JPH057871 B2 JP H057871B2 JP 61261824 A JP61261824 A JP 61261824A JP 26182486 A JP26182486 A JP 26182486A JP H057871 B2 JPH057871 B2 JP H057871B2
- Authority
- JP
- Japan
- Prior art keywords
- glass plate
- adhesive
- solid
- imaging device
- state imaging
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/50—Encapsulations or containers
-
- H10W72/884—
Landscapes
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61261824A JPS63116462A (ja) | 1986-11-05 | 1986-11-05 | 固体撮像装置のシ−リング方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61261824A JPS63116462A (ja) | 1986-11-05 | 1986-11-05 | 固体撮像装置のシ−リング方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63116462A JPS63116462A (ja) | 1988-05-20 |
| JPH057871B2 true JPH057871B2 (cg-RX-API-DMAC10.html) | 1993-01-29 |
Family
ID=17367240
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61261824A Granted JPS63116462A (ja) | 1986-11-05 | 1986-11-05 | 固体撮像装置のシ−リング方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63116462A (cg-RX-API-DMAC10.html) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE69131784T2 (de) * | 1990-07-21 | 2000-05-18 | Mitsui Chemicals, Inc. | Halbleiteranordnung mit einer Packung |
| DK2915680T3 (da) * | 2011-03-25 | 2019-05-13 | Max Co Ltd | Langt medium med en bageste ende-markering og printerindretning |
-
1986
- 1986-11-05 JP JP61261824A patent/JPS63116462A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63116462A (ja) | 1988-05-20 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4959008A (en) | Pre-patterned circuit board device-attach adhesive transfer system | |
| JP3692935B2 (ja) | 半導体装置の製造方法 | |
| EP0160345A2 (en) | Pre-patterned device substrate device-attach adhesive transfer system | |
| JPS6317338B2 (cg-RX-API-DMAC10.html) | ||
| JP4372241B2 (ja) | 固体撮像装置の製造方法 | |
| US4935086A (en) | Process of bonding an electrical device package to a mounting surface | |
| JP3312876B2 (ja) | 半導体パッケージ及びその製造方法 | |
| JPH057871B2 (cg-RX-API-DMAC10.html) | ||
| JP2673928B2 (ja) | 電子部品素子封止用蓋材 | |
| JPS63116461A (ja) | 固体撮像装置の気密封止方法 | |
| JPH01173696A (ja) | 積層回路基板 | |
| US4663186A (en) | Screenable paste for use as a barrier layer on a substrate during maskless cladding | |
| JPS63116449A (ja) | 固体撮像装置の気密封止用接着剤 | |
| JP2746826B2 (ja) | 電子部品収納用パッケージ | |
| JPH0691162B2 (ja) | 電子部品封止用キヤツプとその製造方法 | |
| JP3443522B2 (ja) | 光半導体素子収納用パッケージ | |
| JPH10321826A (ja) | 光学的ローパスフィルタ内蔵固体撮像装置及びその製造方法 | |
| JP3255090B2 (ja) | チップの実装構造およびバンプの形成方法 | |
| JP2000077823A (ja) | 電子部品の製造方法 | |
| JPS59168951U (ja) | 陰極線管 | |
| JPS63131494A (ja) | 薄膜ｅｌ素子およびその製造方法 | |
| JPH083013Y2 (ja) | 固体撮像装置 | |
| JPS58162036A (ja) | 半導体をド−プするド−プシ−ト及びその製造法 | |
| JPS6233337Y2 (cg-RX-API-DMAC10.html) | ||
| JPS59111945A (ja) | 光透過用窓への低融点ガラス溶着方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |