JPS63114165A - 赤外線撮像装置 - Google Patents

赤外線撮像装置

Info

Publication number
JPS63114165A
JPS63114165A JP61258377A JP25837786A JPS63114165A JP S63114165 A JPS63114165 A JP S63114165A JP 61258377 A JP61258377 A JP 61258377A JP 25837786 A JP25837786 A JP 25837786A JP S63114165 A JPS63114165 A JP S63114165A
Authority
JP
Japan
Prior art keywords
main surface
imaging device
silicon substrate
infrared imaging
package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP61258377A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0563022B2 (enrdf_load_stackoverflow
Inventor
Shinichi Teranishi
信一 寺西
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP61258377A priority Critical patent/JPS63114165A/ja
Publication of JPS63114165A publication Critical patent/JPS63114165A/ja
Publication of JPH0563022B2 publication Critical patent/JPH0563022B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/40—Optical elements or arrangements
    • H10F77/413—Optical elements or arrangements directly associated or integrated with the devices, e.g. back reflectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Photometry And Measurement Of Optical Pulse Characteristics (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Light Receiving Elements (AREA)
JP61258377A 1986-10-31 1986-10-31 赤外線撮像装置 Granted JPS63114165A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61258377A JPS63114165A (ja) 1986-10-31 1986-10-31 赤外線撮像装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61258377A JPS63114165A (ja) 1986-10-31 1986-10-31 赤外線撮像装置

Publications (2)

Publication Number Publication Date
JPS63114165A true JPS63114165A (ja) 1988-05-19
JPH0563022B2 JPH0563022B2 (enrdf_load_stackoverflow) 1993-09-09

Family

ID=17319396

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61258377A Granted JPS63114165A (ja) 1986-10-31 1986-10-31 赤外線撮像装置

Country Status (1)

Country Link
JP (1) JPS63114165A (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003078123A (ja) * 2001-09-06 2003-03-14 Sony Corp 撮像装置
JP2007184680A (ja) * 2006-01-04 2007-07-19 Fujifilm Corp 固体撮像装置及びその製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58171849A (ja) * 1982-03-31 1983-10-08 Fujitsu Ltd 固体撮像装置
JPS6173369A (ja) * 1984-09-17 1986-04-15 Mitsubishi Electric Corp 赤外線検出素子

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58171849A (ja) * 1982-03-31 1983-10-08 Fujitsu Ltd 固体撮像装置
JPS6173369A (ja) * 1984-09-17 1986-04-15 Mitsubishi Electric Corp 赤外線検出素子

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003078123A (ja) * 2001-09-06 2003-03-14 Sony Corp 撮像装置
JP2007184680A (ja) * 2006-01-04 2007-07-19 Fujifilm Corp 固体撮像装置及びその製造方法

Also Published As

Publication number Publication date
JPH0563022B2 (enrdf_load_stackoverflow) 1993-09-09

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