JPS63100875U - - Google Patents

Info

Publication number
JPS63100875U
JPS63100875U JP19566086U JP19566086U JPS63100875U JP S63100875 U JPS63100875 U JP S63100875U JP 19566086 U JP19566086 U JP 19566086U JP 19566086 U JP19566086 U JP 19566086U JP S63100875 U JPS63100875 U JP S63100875U
Authority
JP
Japan
Prior art keywords
leadless chip
ceramic
hybrid
output terminal
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19566086U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP19566086U priority Critical patent/JPS63100875U/ja
Publication of JPS63100875U publication Critical patent/JPS63100875U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の一実施例に係るセラミツク基
板の表面の斜視図、第2図はセラミツク基板の裏
面の斜視図、第3図は本考案のセラミツク基板を
用いたハイブリツドICの一実施例を示す斜視図
である。 1……セラミツク基板、2……入出力端子、3
a,3b……リードレスチツプキヤリア、4……
相互配線、5……入出力端子パツド、10……取
付けパツド、11……抵抗体、12……電力印加
導体、20……ハイブリツドIC。
FIG. 1 is a perspective view of the front surface of a ceramic substrate according to an embodiment of the present invention, FIG. 2 is a perspective view of the back surface of the ceramic substrate, and FIG. 3 is an embodiment of a hybrid IC using the ceramic substrate of the present invention. FIG. 1... Ceramic board, 2... Input/output terminal, 3
a, 3b...Leadless chip carrier, 4...
Mutual wiring, 5... Input/output terminal pad, 10... Mounting pad, 11... Resistor, 12... Power application conductor, 20... Hybrid IC.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 複数のリードレスチツプキヤリア並びにチツプ
形受動部品が搭載され、かつ少なくとも一辺に入
出力端子を有するハイブリツドICのセラミツク
基板において、リードレスチツプキヤリアがはん
だ付けされる取付けパツドの位置に対応する基板
本体の裏面に抵抗体を有することを特徴とするセ
ラミツク基板。
In a hybrid IC ceramic board on which a plurality of leadless chip carriers and chip-shaped passive components are mounted and which has an input/output terminal on at least one side, the part of the board body corresponding to the position of the mounting pad to which the leadless chip carrier is soldered is A ceramic substrate characterized by having a resistor on its back surface.
JP19566086U 1986-12-19 1986-12-19 Pending JPS63100875U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19566086U JPS63100875U (en) 1986-12-19 1986-12-19

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19566086U JPS63100875U (en) 1986-12-19 1986-12-19

Publications (1)

Publication Number Publication Date
JPS63100875U true JPS63100875U (en) 1988-06-30

Family

ID=31153748

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19566086U Pending JPS63100875U (en) 1986-12-19 1986-12-19

Country Status (1)

Country Link
JP (1) JPS63100875U (en)

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