JPS6298641A - Semiconductor integrated circuit - Google Patents

Semiconductor integrated circuit

Info

Publication number
JPS6298641A
JPS6298641A JP60238765A JP23876585A JPS6298641A JP S6298641 A JPS6298641 A JP S6298641A JP 60238765 A JP60238765 A JP 60238765A JP 23876585 A JP23876585 A JP 23876585A JP S6298641 A JPS6298641 A JP S6298641A
Authority
JP
Japan
Prior art keywords
wiring
output terminals
terminal
functional block
equivalent output
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60238765A
Other languages
Japanese (ja)
Other versions
JPH0797620B2 (en
Inventor
Fusao Tsubokura
坪倉 富左雄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP60238765A priority Critical patent/JPH0797620B2/en
Publication of JPS6298641A publication Critical patent/JPS6298641A/en
Publication of JPH0797620B2 publication Critical patent/JPH0797620B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
    • H01L27/10Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration
    • H01L27/118Masterslice integrated circuits
    • H01L27/11803Masterslice integrated circuits using field effect technology
    • H01L27/11807CMOS gate arrays

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)

Abstract

PURPOSE:To prevent the generation of electro migration in the aluminum wirings without spreading the wiring width of the signal lines by a method wherein the functional block is provided with a plurality of pieces of equivalent output terminals connected with a metal wiring. CONSTITUTION:This layout pattern is ready-changed in such a way that several equivalent output terminals can be secured. That is, equivalent output terminals 31A and 31B are directly connected with an Al wiring 30 and can be used as the equivalent output terminals, and contacts 31A and 31B can be used according to an operating frequency and a load capacity. For example, in the case the load capacity is large, a through hole 32A is put on a lattice in the vicinity of the output terminal 31A, the 31A and the 32A are connected with a first layer Al wiring to wire a second layer Al wiring 33A from the through hole 32A in a Y direction and moreover, a first layer wiring 35A is wired in a through hole 34A and the terminal 31A is connected to an input terminal of other functional block, and at the same time, the terminal 31B is also connected to an input terminal of other functional block in the same shape as the above. By splitting the load capacity in such a way, the current density of the wiring from each output terminal can be reduced.

Description

【発明の詳細な説明】 〔産業上の利用分封〕 不発明は、CMOSマスタースライス力式集積回路やス
タンダード・セル方式の集積回路において、内部領域に
使用されているゲート基本セル上に配置される機能ブロ
ックに関する。
[Detailed Description of the Invention] [Industrial Application] The invention is directed to a CMOS master slice type integrated circuit or a standard cell type integrated circuit, which is arranged on a gate basic cell used in an internal area. Regarding functional blocks.

〔従来の技術〕[Conventional technology]

従来のこの種の機能プロ、りの例として、ゲート基本セ
ルを2つ使用しlc CM OSインバータ回路のレイ
アウトを第2図に示す。第2図において1個のゲート基
本セル1は、Pチャンネルトランジスタ領域2にはX方
向にV。oWL源ライン3が辿りX方向にポリシリゲー
ト4が設けられソース領域5とドレイン領域6とを有し
、Nチャンネルトランジスタ領域12にはX方向GND
電源ライン13が通りX方向ポリシリゲート14が設け
られソース領域15とドレイン領域16とを有している
As an example of this kind of conventional functional implementation, FIG. 2 shows the layout of an LC CM OS inverter circuit using two gate basic cells. In FIG. 2, one gate basic cell 1 has a P-channel transistor region 2 with V in the X direction. A polysilicate gate 4 is provided in the X direction along which the oWL source line 3 traces, and has a source region 5 and a drain region 6, and the N channel transistor region 12 is connected to the X direction GND.
A power supply line 13 passes through it, an X-direction polysilicate gate 14 is provided, and it has a source region 15 and a drain region 16 .

又、第2図においてX印はコンタクトを示し、0は1層
アルミと2層アルミを接続するスルーホールを示す。図
のようにアルミ配線7,8を用いて、所定のコンタクト
間ケ接続することによりCMOSインバータ回路が構成
てれる。その出力端子としてコンタクト21か一般に定
義される。こ ・こよりの配線は、CADシステムを使
用して自動的に行なわれる通常コンタクト21に近接し
てスルホール22全ひき、ここより第2層アルミ配線に
よりY力回に配線23を引く、次にスルホール;24全
おき、X方向に配線25を引く、このように第1層アル
ミ配線、第2層アルミ配線、スルホール、コンタクトを
使用しながら次段の複数の機能ブロックの入力端子に接
続される。
Further, in FIG. 2, marks X indicate contacts, and marks 0 indicate through holes connecting the first layer of aluminum and the second layer of aluminum. As shown in the figure, a CMOS inverter circuit is constructed by connecting predetermined contacts using aluminum wires 7 and 8. A contact 21 is generally defined as its output terminal.・The wiring from this side is automatically done using a CAD system. Draw all the through holes 22 in the vicinity of the normal contacts 21, and from here draw the wiring 23 in the Y direction using the second layer aluminum wiring, and then connect the through holes. ; Wiring 25 is drawn in the X direction every 24 minutes. In this way, the first layer aluminum wiring, the second layer aluminum wiring, through holes, and contacts are used to connect to the input terminals of a plurality of functional blocks in the next stage.

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

上述した従来の機能ブロックでは、自動配線出来るよう
にチャンネル格子が定義されている為、アルミ配線の配
線巾に、一義的に決まってしまい、自由に細くしたり、
太く1〜たり出来ない。従って、例えば上述のCMOS
インバータ回路のスイッチング周波数が高くなり、信号
ラインに流れる電流中がスイッチング周波数に比例し、
又、信号ラインにつく負荷容量0に比例して増えること
に対応できない。又、インバータ回路のON抵抗■によ
っても信号ラインに流nる電流は変化する。この様な状
恣で、負荷容量が大きく(具体的には、ファンアウト数
(Flo)が多く、アルミ配線長が長いことを意味する
。)、高速で動作させると、当然信号ラインを流れる電
流値が大きくなシ、アルミ配線にエレクトロマイグレー
ションが発生するおそれが生じる為、負荷容量、スイッ
チング動作周e数に制限ンウ;つくという入店があった
In the conventional functional blocks mentioned above, the channel grid is defined so that automatic wiring can be performed, so the wiring width is uniquely determined by the aluminum wiring, and you can freely make it thinner or thinner.
I can't get it to be thick enough. Therefore, for example, the above-mentioned CMOS
The switching frequency of the inverter circuit increases, and the current flowing through the signal line becomes proportional to the switching frequency.
Moreover, it cannot cope with the increase in load capacitance attached to the signal line in proportion to zero. Furthermore, the current flowing through the signal line changes depending on the ON resistance (1) of the inverter circuit. Under these circumstances, if the load capacity is large (specifically, the number of fan-outs (Flo) is large and the length of the aluminum wiring is long) and the operation is performed at high speed, the current flowing through the signal line will naturally increase. If the value is large, there is a risk that electromigration will occur in the aluminum wiring, so the load capacity and switching frequency will be limited.

〔問題点を解決するための手段〕[Means for solving problems]

本発明の半導体集積回路は、半導体チップ上に複数のゲ
ート基本セルゲ蘭列し、該ゲート基本セル間に配線チャ
ンネル格子を規定した配純領域奮設けておき、配列さn
た前記ゲート基本セルを前記配線チャンネル格子に沿っ
て接続することにより、論理回路を構成する半導体集積
回路において、ゲート基本セル上に配置ltaれろ機能
ブロックが金属配線によって褒続された等価な出力端子
を複数個有していることを特長とする。
In the semiconductor integrated circuit of the present invention, a plurality of gate basic cells are arrayed on a semiconductor chip, and a wiring region defining a wiring channel lattice is provided between the gate basic cells.
By connecting the gate basic cells along the wiring channel lattice, in a semiconductor integrated circuit constituting a logic circuit, functional blocks arranged on the gate basic cells can be connected to equivalent output terminals by metal wiring. It is characterized by having multiple.

〔実施例〕〔Example〕

次Gて、本発明について図面ヲ診照して説明する。 Next, the present invention will be explained with reference to the drawings.

第1図は本発明の一笑施例の機能ブロックのレイアクト
図でめる。第2図と共通な個所は同一番号記号で示して
いる。第2図の従来例と異なる点は、等価な出力端子が
社数個幕保出来るようにレイアウトパターンを変えてい
る点であり、等価出力端子31A、31Bをアルミ配線
30にて直接結んでいる点である。
FIG. 1 is a layout diagram of functional blocks of a simple embodiment of the present invention. Parts common to FIG. 2 are indicated by the same numbers and symbols. The difference from the conventional example shown in Fig. 2 is that the layout pattern has been changed so that several equivalent output terminals can be installed, and the equivalent output terminals 31A and 31B are directly connected with aluminum wiring 30. It is a point.

この様にすることにより、等価な出力端子として、コン
タク)31A、31Bを、動作周波数、負荷容量に応じ
て使用することが出来る。例えは、負荷容%か多い場合
出力端子31Aの近傍の格子にスルホール32Aを註き
31Aと32Aの間を第1層アルミ配線で結んでスルホ
ール32AよりY方向に第2層アルミ配線33Aを配線
し1、又、スルホール34Aにおいて第1層配線35A
を配線して他の機能ブロックの入力端子に接続すると共
に、端子31Bについでも同様な形で他の機能ブロック
の入力端子に接続する。このように負iπ」容量を公害
りする形にすることにより各出力端子からの配線の゛1
a流゛d度が低減出来る。
By doing so, the contacts 31A and 31B can be used as equivalent output terminals depending on the operating frequency and load capacity. For example, if the load capacity % is large, make a note of a through hole 32A in the grid near the output terminal 31A, connect 31A and 32A with the first layer aluminum wiring, and wire the second layer aluminum wiring 33A in the Y direction from the through hole 32A. 1. Also, in the through hole 34A, the first layer wiring 35A
The terminal 31B is wired and connected to the input terminal of another functional block, and the terminal 31B is also connected to the input terminal of another functional block in a similar manner. By making the negative iπ capacitance polluted in this way, the wiring from each output terminal is
The a-flow rate can be reduced.

〔発明の効果〕〔Effect of the invention〕

以上説明したよう(・ζ本発明は、機能ブロックが金属
配線によって接続きれた等価な出力端子を複数個有する
ことにより、機能ブロックの高速動作℃負荷容量が太き
いときにべ、等価な出力端子を使用し出力信号ラインを
分離することにより、一本の信号ラインに極端ンこ電流
が集中することをなくすことが出来、信号ラインの配線
幅を広げることなく、アルミ配線へのエレクトロマイグ
レーシランの発生ケ防ぐことが出来る効果がある。
As explained above (・ζThe present invention allows the functional block to have a plurality of equivalent output terminals connected by metal wiring, so that when the functional block operates at high speed and has a large load capacitance, the equivalent output terminal By separating the output signal lines by using a It has the effect of preventing injury from occurring.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本発明の半導体集積回路の機能ブロックのレイ
アウト図、第2図は従来の機能ブロックのレイアウト図
である。 代理人 弁理士  内 r3.    ″1、i 26B 牟7 フ 丞2 区
FIG. 1 is a functional block layout diagram of a semiconductor integrated circuit according to the present invention, and FIG. 2 is a conventional functional block layout diagram. Agent Patent Attorney r3. ″1, i 26B Mu7 Fujo 2 Ward

Claims (1)

【特許請求の範囲】[Claims] 半導体チップ上に複数のゲート基本セルを配列し、該ゲ
ート基本セル間に配線チャンネルを規定した配線領域を
設けておき、配列された前記ゲート基本セルを前記配線
チヤンネル格子に沿って接続することにより、論理回路
を構成する半導体集積回路において、ゲート基本セル上
に配置される機能ブロツクが金属配線によって接続され
た等価な出力端子を複数個有していることを特長とする
半導体集積回路。
By arranging a plurality of basic gate cells on a semiconductor chip, providing a wiring area defining a wiring channel between the basic gate cells, and connecting the arranged basic gate cells along the wiring channel lattice. A semiconductor integrated circuit constituting a logic circuit, characterized in that a functional block arranged on a basic gate cell has a plurality of equivalent output terminals connected by metal wiring.
JP60238765A 1985-10-24 1985-10-24 Semiconductor integrated circuit Expired - Lifetime JPH0797620B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60238765A JPH0797620B2 (en) 1985-10-24 1985-10-24 Semiconductor integrated circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60238765A JPH0797620B2 (en) 1985-10-24 1985-10-24 Semiconductor integrated circuit

Publications (2)

Publication Number Publication Date
JPS6298641A true JPS6298641A (en) 1987-05-08
JPH0797620B2 JPH0797620B2 (en) 1995-10-18

Family

ID=17034929

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60238765A Expired - Lifetime JPH0797620B2 (en) 1985-10-24 1985-10-24 Semiconductor integrated circuit

Country Status (1)

Country Link
JP (1) JPH0797620B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02105569A (en) * 1988-10-14 1990-04-18 Nec Corp Semiconductor integrated circuit device
JP2007063019A (en) * 2005-08-04 2007-03-15 Ricoh Co Ltd Automatic document feeder

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56118350A (en) * 1980-02-21 1981-09-17 Chiyou Lsi Gijutsu Kenkyu Kumiai Semiconductor integrated circuit device
JPS57133712A (en) * 1981-02-12 1982-08-18 Fujitsu Ltd Constituting method of delay circuit in master slice ic

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56118350A (en) * 1980-02-21 1981-09-17 Chiyou Lsi Gijutsu Kenkyu Kumiai Semiconductor integrated circuit device
JPS57133712A (en) * 1981-02-12 1982-08-18 Fujitsu Ltd Constituting method of delay circuit in master slice ic

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02105569A (en) * 1988-10-14 1990-04-18 Nec Corp Semiconductor integrated circuit device
JP2007063019A (en) * 2005-08-04 2007-03-15 Ricoh Co Ltd Automatic document feeder

Also Published As

Publication number Publication date
JPH0797620B2 (en) 1995-10-18

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Legal Events

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