JPS6297773U - - Google Patents
Info
- Publication number
- JPS6297773U JPS6297773U JP19127185U JP19127185U JPS6297773U JP S6297773 U JPS6297773 U JP S6297773U JP 19127185 U JP19127185 U JP 19127185U JP 19127185 U JP19127185 U JP 19127185U JP S6297773 U JPS6297773 U JP S6297773U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- cream solder
- flat pack
- metal mask
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000006071 cream Substances 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 229910000679 solder Inorganic materials 0.000 claims description 4
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Printing Plates And Materials Therefor (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は本考案の一実施例であるメタルマスク
を示す斜視図、第２図はフラツトパツクＩＣが実
装されるプリント基板を示す斜視図、第３図はフ
ラツトパツクＩＣを示す斜視図、第４図は本実施
例のメタルマスクを使用してクリーム半田印刷さ
れた状態を示す図である。
１…メタルマスク、１ａ…くり抜き幅、１ｂ…
くり抜き長さ、２…プリント基板、２ａ…パツド
、２ｂ…パターン、２ｃ…パツド長、２ｂ…パツ
ド間長、３…フラツトパツクＩＣ、３ａ…リード
、４ａ…クリーム半田。
Fig. 1 is a perspective view showing a metal mask as an embodiment of the present invention, Fig. 2 is a perspective view showing a printed circuit board on which a flat pack IC is mounted, Fig. 3 is a perspective view showing a flat pack IC, and Fig. 4 is a perspective view showing a printed circuit board on which a flat pack IC is mounted. 2 is a diagram showing a state in which cream solder printing is performed using the metal mask of this example. 1... Metal mask, 1a... Hollowing width, 1b...
Hollowout length, 2... Printed circuit board, 2a... Pad, 2b... Pattern, 2c... Pad length, 2b... Length between pads, 3... Flat pack IC, 3a... Lead, 4a... Cream solder.
Claims (1)
メタルマスクにおいて、プリント基板のフラツト
パツクＩＣパターンのパツドに対して垂直方向に
４辺くり抜かれたくり抜き形状を有してなるクリ
ーム半田印刷用メタルマスク。 A metal mask for printing cream solder, which is used to supply cream solder to a printed circuit board, and has a hollow shape cut out on four sides in a direction perpendicular to a pad of a flat pack IC pattern of a printed circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19127185U JPS6297773U (en) | 1985-12-11 | 1985-12-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19127185U JPS6297773U (en) | 1985-12-11 | 1985-12-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6297773U true JPS6297773U (en) | 1987-06-22 |
Family
ID=31145257
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19127185U Pending JPS6297773U (en) | 1985-12-11 | 1985-12-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6297773U (en) |
-
1985
- 1985-12-11 JP JP19127185U patent/JPS6297773U/ja active Pending