JPS629741Y2 - - Google Patents
Info
- Publication number
- JPS629741Y2 JPS629741Y2 JP1980172970U JP17297080U JPS629741Y2 JP S629741 Y2 JPS629741 Y2 JP S629741Y2 JP 1980172970 U JP1980172970 U JP 1980172970U JP 17297080 U JP17297080 U JP 17297080U JP S629741 Y2 JPS629741 Y2 JP S629741Y2
- Authority
- JP
- Japan
- Prior art keywords
- package
- semiconductor chip
- clip
- semiconductor device
- lead wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 claims description 29
- 230000017525 heat dissipation Effects 0.000 claims description 10
- 239000012212 insulator Substances 0.000 claims description 4
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 16
- 239000000919 ceramic Substances 0.000 description 5
- 230000005855 radiation Effects 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- NEIHULKJZQTQKJ-UHFFFAOYSA-N [Cu].[Ag] Chemical compound [Cu].[Ag] NEIHULKJZQTQKJ-UHFFFAOYSA-N 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 229910000833 kovar Inorganic materials 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1980172970U JPS629741Y2 (US07345094-20080318-C00003.png) | 1980-12-02 | 1980-12-02 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1980172970U JPS629741Y2 (US07345094-20080318-C00003.png) | 1980-12-02 | 1980-12-02 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5794959U JPS5794959U (US07345094-20080318-C00003.png) | 1982-06-11 |
JPS629741Y2 true JPS629741Y2 (US07345094-20080318-C00003.png) | 1987-03-06 |
Family
ID=29531244
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1980172970U Expired JPS629741Y2 (US07345094-20080318-C00003.png) | 1980-12-02 | 1980-12-02 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS629741Y2 (US07345094-20080318-C00003.png) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0331085Y2 (US07345094-20080318-C00003.png) * | 1985-05-07 | 1991-07-01 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5315787A (en) * | 1976-07-28 | 1978-02-14 | Fujitsu Ltd | Integrated circuit package |
-
1980
- 1980-12-02 JP JP1980172970U patent/JPS629741Y2/ja not_active Expired
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5315787A (en) * | 1976-07-28 | 1978-02-14 | Fujitsu Ltd | Integrated circuit package |
Also Published As
Publication number | Publication date |
---|---|
JPS5794959U (US07345094-20080318-C00003.png) | 1982-06-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR920008248B1 (ko) | 반도체장치 | |
EP0785575A2 (en) | Semiconductor device and semiconductor module | |
ITMI952508A1 (it) | Componente elettronico pluripolare montabile sulla superficie | |
KR980006174A (ko) | 버틈 리드 패키지 | |
JPS629741Y2 (US07345094-20080318-C00003.png) | ||
JP2705030B2 (ja) | リードフレームおよび放熱板および半導体装置 | |
JPS6130742B2 (US07345094-20080318-C00003.png) | ||
JPH0878461A (ja) | 放熱板付き半導体装置及びその製造方法 | |
JPH05206315A (ja) | 半導体装置 | |
JPS6138193Y2 (US07345094-20080318-C00003.png) | ||
JPS6018848Y2 (ja) | 樹脂モ−ルド型半導体装置用リ−ドフレ−ム | |
JPS638618B2 (US07345094-20080318-C00003.png) | ||
KR100273226B1 (ko) | 버텀리드패키지 | |
JPS59110146A (ja) | パツケ−ジ形モジユ−ルの外部引出し端子 | |
JP2944588B2 (ja) | 半導体装置及び半導体装置用リードフレーム | |
JPS6130426B2 (US07345094-20080318-C00003.png) | ||
JPS6240449Y2 (US07345094-20080318-C00003.png) | ||
JPS6130287Y2 (US07345094-20080318-C00003.png) | ||
KR100206886B1 (ko) | 컬럼형 패키지 | |
JPH0357259A (ja) | 半導体装置 | |
JPS6057655A (ja) | 半導体装置 | |
JPS5926603Y2 (ja) | ハイブリッド・イグナイタ− | |
JP2561470Y2 (ja) | 絶縁封止電子部品 | |
JPH04171848A (ja) | 半導体装置 | |
KR100233378B1 (ko) | 열방출형 칼럼 리드 패키지 |