JPS629726Y2 - - Google Patents
Info
- Publication number
- JPS629726Y2 JPS629726Y2 JP1982141944U JP14194482U JPS629726Y2 JP S629726 Y2 JPS629726 Y2 JP S629726Y2 JP 1982141944 U JP1982141944 U JP 1982141944U JP 14194482 U JP14194482 U JP 14194482U JP S629726 Y2 JPS629726 Y2 JP S629726Y2
- Authority
- JP
- Japan
- Prior art keywords
- sintered
- layer
- coarse
- wafer
- adsorbent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000002245 particle Substances 0.000 claims description 30
- 239000010410 layer Substances 0.000 claims description 26
- 239000008187 granular material Substances 0.000 claims description 21
- 239000003463 adsorbent Substances 0.000 claims description 15
- 238000001179 sorption measurement Methods 0.000 claims description 6
- 238000007790 scraping Methods 0.000 claims description 2
- 239000002356 single layer Substances 0.000 claims description 2
- 235000012431 wafers Nutrition 0.000 description 25
- 238000003860 storage Methods 0.000 description 6
- 238000005245 sintering Methods 0.000 description 4
- 229910000906 Bronze Inorganic materials 0.000 description 2
- 239000010974 bronze Substances 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
Landscapes
- Jigs For Machine Tools (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14194482U JPS5948050U (ja) | 1982-09-21 | 1982-09-21 | 保持装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14194482U JPS5948050U (ja) | 1982-09-21 | 1982-09-21 | 保持装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5948050U JPS5948050U (ja) | 1984-03-30 |
| JPS629726Y2 true JPS629726Y2 (US06312121-20011106-C00033.png) | 1987-03-06 |
Family
ID=30317312
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14194482U Granted JPS5948050U (ja) | 1982-09-21 | 1982-09-21 | 保持装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5948050U (US06312121-20011106-C00033.png) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2651354B2 (ja) * | 1994-08-01 | 1997-09-10 | シーケーディ株式会社 | 真空チャックの吸着板 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55143036A (en) * | 1979-04-19 | 1980-11-08 | Toshiba Corp | Holder for semiconductor wafer |
-
1982
- 1982-09-21 JP JP14194482U patent/JPS5948050U/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55143036A (en) * | 1979-04-19 | 1980-11-08 | Toshiba Corp | Holder for semiconductor wafer |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5948050U (ja) | 1984-03-30 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP0850723B1 (en) | Wafer holding jig | |
| TWI416653B (zh) | 半導體晶圓及其處理方法 | |
| CN100550313C (zh) | 包括半导体存储器元件的半导体器件及其制造方法 | |
| JP3250290B2 (ja) | ウエハチャック | |
| JP2019136806A (ja) | 保持面の研削方法 | |
| JP4782788B2 (ja) | 試料保持具とこれを用いた試料吸着装置およびこれを用いた試料処理方法 | |
| JP2009166150A (ja) | ウェハの製造方法 | |
| JPH06302569A (ja) | ウェーハの研磨方法 | |
| JPS629726Y2 (US06312121-20011106-C00033.png) | ||
| JP3325441B2 (ja) | 真空吸着装置 | |
| US20070032177A1 (en) | Wafer processing apparatus and wafer processing method using the same | |
| JPH08330401A (ja) | ウエハチャック | |
| JP2009224496A (ja) | ウェーハエッジ研削方法、ウェーハエッジ研削ユニット及びウェーハ裏面研削装置 | |
| JPS6133831A (ja) | 真空吸着装置 | |
| KR20080113682A (ko) | 웨이퍼용 연마 휠 및 이를 갖는 웨이퍼 이면 연마 장치 | |
| JP7353714B2 (ja) | 研削方法 | |
| JPH0332537A (ja) | ユニバーサルチャックテーブル | |
| JPS60259372A (ja) | 両面ポリツシング方法 | |
| JPH03213265A (ja) | ラップ盤の定盤 | |
| JPS6040275Y2 (ja) | 吸着固定装置 | |
| JP7321649B2 (ja) | 研削方法 | |
| JPS6233319Y2 (US06312121-20011106-C00033.png) | ||
| US20230234183A1 (en) | Method of processing workpiece | |
| JP2010067783A (ja) | 半導体ウェーハ吸着保持具及び半導体ウェーハ裏面研削装置 | |
| JPS61226272A (ja) | ウエ−ハ研削用砥石 |
