JPS55143036A - Holder for semiconductor wafer - Google Patents

Holder for semiconductor wafer

Info

Publication number
JPS55143036A
JPS55143036A JP4818479A JP4818479A JPS55143036A JP S55143036 A JPS55143036 A JP S55143036A JP 4818479 A JP4818479 A JP 4818479A JP 4818479 A JP4818479 A JP 4818479A JP S55143036 A JPS55143036 A JP S55143036A
Authority
JP
Japan
Prior art keywords
holding part
suction hole
wafer
dusts
semiconductor wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4818479A
Other languages
Japanese (ja)
Other versions
JPS5756207B2 (en
Inventor
Hiroshi Kataoka
Narikazu Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP4818479A priority Critical patent/JPS55143036A/en
Publication of JPS55143036A publication Critical patent/JPS55143036A/en
Publication of JPS5756207B2 publication Critical patent/JPS5756207B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H01L21/3046—Mechanical treatment, e.g. grinding, polishing, cutting using blasting, e.g. sand-blasting

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

PURPOSE:To prevent a semiconductor wafer from being deformed, by making a semiconductor wafer holder of a recessed holding part having a suction hole in its bottom and a gas-permeable metal plate fitted in the holding part and by making the surface of the metal plate so rough that adhering dusts enter into the recesses of the rough surface. CONSTITUTION:A holding part 11 for holding a wafer 20 is shaped as a recess. A suction hole 13, which is connected to a vacuum pump, a plurality of annular grooves 14 surrounding the suction hole 13 and a plurality of radial grooves 15 are provided in the bottom of the holding part 11 so that the suction hole, the annular grooves and the radial grooves are connected to one another. An annular fitting groove 16 is provided on the top of the wall of the holding part 11 and filled with a sealing polyester resin material 17. A gas-permeable metal disc 18, whose surface 18 is made rough and which is made of a porous sintered metal or the like, is fitted in the recess of the holding part 11. A wafer 20 to be sucked is placed on the metal disc 18 and the sealing material 17. As a result, dusts are sucked into the recesses of the rought surface 18a so that the dusts are prevented from adhering to the wafer 20.
JP4818479A 1979-04-19 1979-04-19 Holder for semiconductor wafer Granted JPS55143036A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4818479A JPS55143036A (en) 1979-04-19 1979-04-19 Holder for semiconductor wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4818479A JPS55143036A (en) 1979-04-19 1979-04-19 Holder for semiconductor wafer

Publications (2)

Publication Number Publication Date
JPS55143036A true JPS55143036A (en) 1980-11-08
JPS5756207B2 JPS5756207B2 (en) 1982-11-29

Family

ID=12796294

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4818479A Granted JPS55143036A (en) 1979-04-19 1979-04-19 Holder for semiconductor wafer

Country Status (1)

Country Link
JP (1) JPS55143036A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5948050U (en) * 1982-09-21 1984-03-30 株式会社東芝 holding device
JPH04133971U (en) * 1991-06-04 1992-12-14 日本ケーブル株式会社 Cable ring liner for cableway
US6841049B2 (en) * 1999-02-09 2005-01-11 Ricoh Company, Ltd. Optical device substrate film-formation apparatus, optical disk substrate film-formation method, substrate holder manufacture method, substrate holder, optical disk and a phase-change recording type of optical disk
US7235139B2 (en) 2003-10-28 2007-06-26 Veeco Instruments Inc. Wafer carrier for growing GaN wafers
WO2005013334A3 (en) * 2003-08-01 2007-08-09 Sgl Carbon Ag Holder for supporting wafers during semiconductor manufacture
WO2008079913A1 (en) * 2006-12-20 2008-07-03 Lam Research Corporation Methods, apparatuses, and systems for fabricating three dimensional integrated circuits
JP2011044475A (en) * 2009-08-19 2011-03-03 Disco Abrasive Syst Ltd Grinder for wafer

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5948050U (en) * 1982-09-21 1984-03-30 株式会社東芝 holding device
JPS629726Y2 (en) * 1982-09-21 1987-03-06
JPH04133971U (en) * 1991-06-04 1992-12-14 日本ケーブル株式会社 Cable ring liner for cableway
US6841049B2 (en) * 1999-02-09 2005-01-11 Ricoh Company, Ltd. Optical device substrate film-formation apparatus, optical disk substrate film-formation method, substrate holder manufacture method, substrate holder, optical disk and a phase-change recording type of optical disk
US7273534B2 (en) 1999-02-09 2007-09-25 Ricoh Company, Ltd. Optical device substrate film-formation apparatus, optical disk substrate film-formation method, substrate holder manufacture method, substrate holder, optical disk and a phase-change recording type of optical disk
WO2005013334A3 (en) * 2003-08-01 2007-08-09 Sgl Carbon Ag Holder for supporting wafers during semiconductor manufacture
US7235139B2 (en) 2003-10-28 2007-06-26 Veeco Instruments Inc. Wafer carrier for growing GaN wafers
WO2008079913A1 (en) * 2006-12-20 2008-07-03 Lam Research Corporation Methods, apparatuses, and systems for fabricating three dimensional integrated circuits
US8034409B2 (en) 2006-12-20 2011-10-11 Lam Research Corporation Methods, apparatuses, and systems for fabricating three dimensional integrated circuits
JP2011044475A (en) * 2009-08-19 2011-03-03 Disco Abrasive Syst Ltd Grinder for wafer

Also Published As

Publication number Publication date
JPS5756207B2 (en) 1982-11-29

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