JPS629723Y2 - - Google Patents

Info

Publication number
JPS629723Y2
JPS629723Y2 JP1981022982U JP2298281U JPS629723Y2 JP S629723 Y2 JPS629723 Y2 JP S629723Y2 JP 1981022982 U JP1981022982 U JP 1981022982U JP 2298281 U JP2298281 U JP 2298281U JP S629723 Y2 JPS629723 Y2 JP S629723Y2
Authority
JP
Japan
Prior art keywords
chip
film carrier
insulating resin
hole
inner lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1981022982U
Other languages
English (en)
Japanese (ja)
Other versions
JPS57135744U (enEXAMPLES
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1981022982U priority Critical patent/JPS629723Y2/ja
Publication of JPS57135744U publication Critical patent/JPS57135744U/ja
Application granted granted Critical
Publication of JPS629723Y2 publication Critical patent/JPS629723Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP1981022982U 1981-02-20 1981-02-20 Expired JPS629723Y2 (enEXAMPLES)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1981022982U JPS629723Y2 (enEXAMPLES) 1981-02-20 1981-02-20

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1981022982U JPS629723Y2 (enEXAMPLES) 1981-02-20 1981-02-20

Publications (2)

Publication Number Publication Date
JPS57135744U JPS57135744U (enEXAMPLES) 1982-08-24
JPS629723Y2 true JPS629723Y2 (enEXAMPLES) 1987-03-06

Family

ID=29820752

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1981022982U Expired JPS629723Y2 (enEXAMPLES) 1981-02-20 1981-02-20

Country Status (1)

Country Link
JP (1) JPS629723Y2 (enEXAMPLES)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60106153A (ja) * 1983-11-15 1985-06-11 Toshiba Corp 半導体装置およびその製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS523275B2 (enEXAMPLES) * 1974-07-31 1977-01-27
JPS5749397Y2 (enEXAMPLES) * 1978-03-24 1982-10-29

Also Published As

Publication number Publication date
JPS57135744U (enEXAMPLES) 1982-08-24

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