JPS6296638A - リ−ドフレ−ム用アルミニウム合金 - Google Patents

リ−ドフレ−ム用アルミニウム合金

Info

Publication number
JPS6296638A
JPS6296638A JP23638085A JP23638085A JPS6296638A JP S6296638 A JPS6296638 A JP S6296638A JP 23638085 A JP23638085 A JP 23638085A JP 23638085 A JP23638085 A JP 23638085A JP S6296638 A JPS6296638 A JP S6296638A
Authority
JP
Japan
Prior art keywords
bendability
alloy
lead frame
strength
heat resistance
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP23638085A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0555582B2 (enrdf_load_html_response
Inventor
Haruyumi Kosuge
張弓 小菅
Katsuaki Kamio
神尾　勝秋
Tomoaki Sano
智章 佐野
Koichi Ito
紘一 伊藤
Nobuaki Nakajima
信昭 中島
Sumiyo Uzawa
鵜沢　澄代
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Nippon Light Metal Co Ltd
Original Assignee
Toshiba Corp
Nippon Light Metal Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Nippon Light Metal Co Ltd filed Critical Toshiba Corp
Priority to JP23638085A priority Critical patent/JPS6296638A/ja
Publication of JPS6296638A publication Critical patent/JPS6296638A/ja
Publication of JPH0555582B2 publication Critical patent/JPH0555582B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49579—Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Conductive Materials (AREA)
JP23638085A 1985-10-24 1985-10-24 リ−ドフレ−ム用アルミニウム合金 Granted JPS6296638A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP23638085A JPS6296638A (ja) 1985-10-24 1985-10-24 リ−ドフレ−ム用アルミニウム合金

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23638085A JPS6296638A (ja) 1985-10-24 1985-10-24 リ−ドフレ−ム用アルミニウム合金

Publications (2)

Publication Number Publication Date
JPS6296638A true JPS6296638A (ja) 1987-05-06
JPH0555582B2 JPH0555582B2 (enrdf_load_html_response) 1993-08-17

Family

ID=16999927

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23638085A Granted JPS6296638A (ja) 1985-10-24 1985-10-24 リ−ドフレ−ム用アルミニウム合金

Country Status (1)

Country Link
JP (1) JPS6296638A (enrdf_load_html_response)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1988002411A1 (en) * 1986-10-01 1988-04-07 Sky Aluminium Co., Ltd. Material for conductive parts of electronic and electric appliances
JPS6396237A (ja) * 1986-10-09 1988-04-27 Sky Alum Co Ltd リードフレーム、コネクタもしくはスイッチ用導電圧延材料
JPS6396239A (ja) * 1986-10-09 1988-04-27 Sky Alum Co Ltd リードフレーム、コネクタもしくはスイッチ用導電圧延材料
JPS63157831A (ja) * 1986-12-18 1988-06-30 Toyo Alum Kk 耐熱性アルミニウム合金
EP0808911A1 (de) * 1996-05-22 1997-11-26 Alusuisse Technology & Management AG Bauteil
US20160099200A1 (en) * 2014-10-01 2016-04-07 Stmicroelectronics S.R.L. Aluminum alloy lead frame for a semiconductor device and corresponding manufacturing process
JP2019057463A (ja) * 2017-09-22 2019-04-11 矢崎総業株式会社 端子付き電線

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5719065A (en) 1993-10-01 1998-02-17 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device with removable spacers
US7038239B2 (en) 2002-04-09 2006-05-02 Semiconductor Energy Laboratory Co., Ltd. Semiconductor element and display device using the same

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1988002411A1 (en) * 1986-10-01 1988-04-07 Sky Aluminium Co., Ltd. Material for conductive parts of electronic and electric appliances
JPS6389640A (ja) * 1986-10-01 1988-04-20 Sky Alum Co Ltd 電子電気機器導電部品材料
JPS6396237A (ja) * 1986-10-09 1988-04-27 Sky Alum Co Ltd リードフレーム、コネクタもしくはスイッチ用導電圧延材料
JPS6396239A (ja) * 1986-10-09 1988-04-27 Sky Alum Co Ltd リードフレーム、コネクタもしくはスイッチ用導電圧延材料
US4908078A (en) * 1986-10-09 1990-03-13 Sky Aluminium Co., Ltd. Material for conductive parts of electronic or electric devices
JPS63157831A (ja) * 1986-12-18 1988-06-30 Toyo Alum Kk 耐熱性アルミニウム合金
EP0808911A1 (de) * 1996-05-22 1997-11-26 Alusuisse Technology & Management AG Bauteil
US20160099200A1 (en) * 2014-10-01 2016-04-07 Stmicroelectronics S.R.L. Aluminum alloy lead frame for a semiconductor device and corresponding manufacturing process
JP2019057463A (ja) * 2017-09-22 2019-04-11 矢崎総業株式会社 端子付き電線

Also Published As

Publication number Publication date
JPH0555582B2 (enrdf_load_html_response) 1993-08-17

Similar Documents

Publication Publication Date Title
US4749548A (en) Copper alloy lead material for use in semiconductor device
US6132529A (en) Leadframe made of a high-strength, high-electroconductivity copper alloy
US4822560A (en) Copper alloy and method of manufacturing the same
JP3797882B2 (ja) 曲げ加工性が優れた銅合金板
JPS6296638A (ja) リ−ドフレ−ム用アルミニウム合金
JP3049137B2 (ja) 曲げ加工性が優れた高力銅合金及びその製造方法
JPS61287156A (ja) リードフレーム用素材およびその製造法
JPS63307232A (ja) 銅合金
JPH0788549B2 (ja) 半導体機器用銅合金とその製造法
JPH0440417B2 (enrdf_load_html_response)
JPS6296641A (ja) リ−ドフレ−ム用アルミニウム合金
JPH032341A (ja) 高強度高導電性銅合金
JPH0572455B2 (enrdf_load_html_response)
JPS6296644A (ja) リ−ドフレ−ム用アルミニウム合金
JP4132451B2 (ja) 耐熱性に優れた高強度高導電性銅合金
JPS6311418B2 (enrdf_load_html_response)
JPH034612B2 (enrdf_load_html_response)
JPS6142772B2 (enrdf_load_html_response)
JP3407527B2 (ja) 電子機器用銅合金材
JPS63109132A (ja) 高力導電性銅合金及びその製造方法
JP2597773B2 (ja) 異方性が少ない高強度銅合金の製造方法
KR100267810B1 (ko) 고강도 고전기전도도를 갖는 동합금 반도체 리드프레임용 소재의 제조방법
JPH01165733A (ja) 高強度高導電性銅合金
JPH02129326A (ja) 高力銅合金
JPH1081927A (ja) Ｃｕ合金製端子・コネクタ材