JPS6290213A - 集積回路素子ケ−シングの射出成形による成形方法 - Google Patents

集積回路素子ケ−シングの射出成形による成形方法

Info

Publication number
JPS6290213A
JPS6290213A JP23172885A JP23172885A JPS6290213A JP S6290213 A JPS6290213 A JP S6290213A JP 23172885 A JP23172885 A JP 23172885A JP 23172885 A JP23172885 A JP 23172885A JP S6290213 A JPS6290213 A JP S6290213A
Authority
JP
Japan
Prior art keywords
mold
lead frame
movable
casing
cavity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP23172885A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0349729B2 (enrdf_load_stackoverflow
Inventor
Mitsuhiro Obara
小原　光博
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Metal Corp
Original Assignee
Mitsubishi Metal Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Metal Corp filed Critical Mitsubishi Metal Corp
Priority to JP23172885A priority Critical patent/JPS6290213A/ja
Publication of JPS6290213A publication Critical patent/JPS6290213A/ja
Publication of JPH0349729B2 publication Critical patent/JPH0349729B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/16—Making multilayered or multicoloured articles
    • B29C45/1671—Making multilayered or multicoloured articles with an insert

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
JP23172885A 1985-10-17 1985-10-17 集積回路素子ケ−シングの射出成形による成形方法 Granted JPS6290213A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP23172885A JPS6290213A (ja) 1985-10-17 1985-10-17 集積回路素子ケ−シングの射出成形による成形方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23172885A JPS6290213A (ja) 1985-10-17 1985-10-17 集積回路素子ケ−シングの射出成形による成形方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP18835890A Division JPH0381126A (ja) 1990-07-17 1990-07-17 集積回路素子ケーシングの射出成形装置

Publications (2)

Publication Number Publication Date
JPS6290213A true JPS6290213A (ja) 1987-04-24
JPH0349729B2 JPH0349729B2 (enrdf_load_stackoverflow) 1991-07-30

Family

ID=16928095

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23172885A Granted JPS6290213A (ja) 1985-10-17 1985-10-17 集積回路素子ケ−シングの射出成形による成形方法

Country Status (1)

Country Link
JP (1) JPS6290213A (enrdf_load_stackoverflow)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0324000A (ja) * 1989-05-26 1991-01-31 Gerard Lemaire マイクロプロセツサチツプを内蔵したマイクロチップカードを製造するための方法とこの方法により製造されたマイクロチップカード
US5876765A (en) * 1995-11-09 1999-03-02 Micron Technology, Inc. Injection molding equipment for encapsulating semiconductor die and the like
US6033933A (en) * 1997-02-14 2000-03-07 Lg Semicon Co., Ltd Method for attaching a removable tape to encapsulate a semiconductor package
WO2005025832A3 (de) * 2003-09-05 2005-08-25 Bosch Gmbh Robert Verfahren zur herstellung von kunststoffteilen mit integrierten leiterbahnen

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53121055A (en) * 1977-03-31 1978-10-23 Mitsubishi Rayon Co Ltd Manufacture of synthetic resin decorative article
JPS58147331A (ja) * 1982-02-26 1983-09-02 Matsushita Electric Works Ltd インサ−ト成形法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53121055A (en) * 1977-03-31 1978-10-23 Mitsubishi Rayon Co Ltd Manufacture of synthetic resin decorative article
JPS58147331A (ja) * 1982-02-26 1983-09-02 Matsushita Electric Works Ltd インサ−ト成形法

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0324000A (ja) * 1989-05-26 1991-01-31 Gerard Lemaire マイクロプロセツサチツプを内蔵したマイクロチップカードを製造するための方法とこの方法により製造されたマイクロチップカード
FR2659157A2 (fr) * 1989-05-26 1991-09-06 Lemaire Gerard Procede de fabrication d'une carte dite carte a puce, et carte obtenue par ce procede.
US5134773A (en) * 1989-05-26 1992-08-04 Gerard Lemaire Method for making a credit card containing a microprocessor chip
US5876765A (en) * 1995-11-09 1999-03-02 Micron Technology, Inc. Injection molding equipment for encapsulating semiconductor die and the like
US6033933A (en) * 1997-02-14 2000-03-07 Lg Semicon Co., Ltd Method for attaching a removable tape to encapsulate a semiconductor package
WO2005025832A3 (de) * 2003-09-05 2005-08-25 Bosch Gmbh Robert Verfahren zur herstellung von kunststoffteilen mit integrierten leiterbahnen

Also Published As

Publication number Publication date
JPH0349729B2 (enrdf_load_stackoverflow) 1991-07-30

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