JPS6285448A - 半導体装置の冷却構造 - Google Patents

半導体装置の冷却構造

Info

Publication number
JPS6285448A
JPS6285448A JP60225211A JP22521185A JPS6285448A JP S6285448 A JPS6285448 A JP S6285448A JP 60225211 A JP60225211 A JP 60225211A JP 22521185 A JP22521185 A JP 22521185A JP S6285448 A JPS6285448 A JP S6285448A
Authority
JP
Japan
Prior art keywords
cooling
heat exchanger
refrigerant
semiconductor device
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60225211A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0365901B2 (cg-RX-API-DMAC7.html
Inventor
Kishio Yokouchi
貴志男 横内
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP60225211A priority Critical patent/JPS6285448A/ja
Priority to KR8603274A priority patent/KR900001393B1/ko
Priority to ES554529A priority patent/ES8801064A1/es
Priority to AU56801/86A priority patent/AU566105B2/en
Priority to CA000507879A priority patent/CA1249063A/en
Priority to DE8686105963T priority patent/DE3685909T2/de
Priority to EP86105963A priority patent/EP0200221B1/en
Priority to US06/857,303 priority patent/US4704658A/en
Publication of JPS6285448A publication Critical patent/JPS6285448A/ja
Publication of JPH0365901B2 publication Critical patent/JPH0365901B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP60225211A 1985-04-30 1985-10-09 半導体装置の冷却構造 Granted JPS6285448A (ja)

Priority Applications (8)

Application Number Priority Date Filing Date Title
JP60225211A JPS6285448A (ja) 1985-10-09 1985-10-09 半導体装置の冷却構造
KR8603274A KR900001393B1 (en) 1985-04-30 1986-04-28 Evaporation cooling module for semiconductor device
ES554529A ES8801064A1 (es) 1985-04-30 1986-04-29 Un modulo de refrigeracion por evaporacion para enfriar multiples chips semiconductores
AU56801/86A AU566105B2 (en) 1985-04-30 1986-04-29 Semiconductor cooling
CA000507879A CA1249063A (en) 1985-04-30 1986-04-29 Evaporation cooling module for semiconductor devices
DE8686105963T DE3685909T2 (de) 1985-04-30 1986-04-30 Modul fuer verdampfungskuehlung fuer halbleiteranordnungen.
EP86105963A EP0200221B1 (en) 1985-04-30 1986-04-30 Evaporation cooling module for semiconductor devices
US06/857,303 US4704658A (en) 1985-04-30 1986-04-30 Evaporation cooling module for semiconductor devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60225211A JPS6285448A (ja) 1985-10-09 1985-10-09 半導体装置の冷却構造

Publications (2)

Publication Number Publication Date
JPS6285448A true JPS6285448A (ja) 1987-04-18
JPH0365901B2 JPH0365901B2 (cg-RX-API-DMAC7.html) 1991-10-15

Family

ID=16825724

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60225211A Granted JPS6285448A (ja) 1985-04-30 1985-10-09 半導体装置の冷却構造

Country Status (1)

Country Link
JP (1) JPS6285448A (cg-RX-API-DMAC7.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4949164A (en) * 1987-07-10 1990-08-14 Hitachi, Ltd. Semiconductor cooling apparatus and cooling method thereof

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5312541A (en) * 1976-07-20 1978-02-04 Mitsubishi Electric Corp Ebullition cooling device
JPS5358661A (en) * 1976-11-08 1978-05-26 Tokyo Shibaura Electric Co Device for cooling electronic parts
JPS56103453A (en) * 1980-01-21 1981-08-18 Hitachi Ltd Lsi apparatus system
JPS60761A (ja) * 1983-06-17 1985-01-05 Fujitsu Ltd 液冷モジユ−ル
JPS61131553A (ja) * 1984-11-30 1986-06-19 Fujitsu Ltd 浸漬液冷装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5312541A (en) * 1976-07-20 1978-02-04 Mitsubishi Electric Corp Ebullition cooling device
JPS5358661A (en) * 1976-11-08 1978-05-26 Tokyo Shibaura Electric Co Device for cooling electronic parts
JPS56103453A (en) * 1980-01-21 1981-08-18 Hitachi Ltd Lsi apparatus system
JPS60761A (ja) * 1983-06-17 1985-01-05 Fujitsu Ltd 液冷モジユ−ル
JPS61131553A (ja) * 1984-11-30 1986-06-19 Fujitsu Ltd 浸漬液冷装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4949164A (en) * 1987-07-10 1990-08-14 Hitachi, Ltd. Semiconductor cooling apparatus and cooling method thereof

Also Published As

Publication number Publication date
JPH0365901B2 (cg-RX-API-DMAC7.html) 1991-10-15

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