JPS56103453A - Lsi apparatus system - Google Patents

Lsi apparatus system

Info

Publication number
JPS56103453A
JPS56103453A JP461980A JP461980A JPS56103453A JP S56103453 A JPS56103453 A JP S56103453A JP 461980 A JP461980 A JP 461980A JP 461980 A JP461980 A JP 461980A JP S56103453 A JPS56103453 A JP S56103453A
Authority
JP
Japan
Prior art keywords
vessel
internal pressure
package
separate
housed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP461980A
Other languages
Japanese (ja)
Inventor
Katsumi Yabe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP461980A priority Critical patent/JPS56103453A/en
Publication of JPS56103453A publication Critical patent/JPS56103453A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE:To obtain an excellent cooling performance by removing internal pressure changes in a package by a method wherein a separate closed vessel for adjusting the internal pressure changes within the package is connected to the package in which IC elements are housed. CONSTITUTION:A multilayers wiring substrate made of ceramics on which a large number of IC chips are mounted is housed in the vessel 8 in which a cooling liquid 4 of carbon fluoride system is enclosed and the interval pressure 11 is produced. In this construction, the separate vessel 9 similarly enclosed with the cooling liquid 4 is prepared and connected with the vessel 8 each other through a pipe 10 provided on the lower side walls respectively. At this time, an opening is formed on the top of the separate vessel 9 and when the internal pressure 11 in the vessel 8 is increased by steam pressure, the liquid 4 is flowed into the vessel 9 to cause the internal pressure in the vessel 8 to be decreased. Thus, the internal pressure 11 in the vessel 8 is kept constant to elevate a cooling efficiency and uniformly to maintain a characteristic of the IC element.
JP461980A 1980-01-21 1980-01-21 Lsi apparatus system Pending JPS56103453A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP461980A JPS56103453A (en) 1980-01-21 1980-01-21 Lsi apparatus system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP461980A JPS56103453A (en) 1980-01-21 1980-01-21 Lsi apparatus system

Publications (1)

Publication Number Publication Date
JPS56103453A true JPS56103453A (en) 1981-08-18

Family

ID=11589066

Family Applications (1)

Application Number Title Priority Date Filing Date
JP461980A Pending JPS56103453A (en) 1980-01-21 1980-01-21 Lsi apparatus system

Country Status (1)

Country Link
JP (1) JPS56103453A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6285448A (en) * 1985-10-09 1987-04-18 Fujitsu Ltd Cooling structure for semiconductor device
JPH0387177U (en) * 1989-12-22 1991-09-04

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5238662A (en) * 1975-09-22 1977-03-25 Hitachi Ltd Cooling liquid of seething cooler

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5238662A (en) * 1975-09-22 1977-03-25 Hitachi Ltd Cooling liquid of seething cooler

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6285448A (en) * 1985-10-09 1987-04-18 Fujitsu Ltd Cooling structure for semiconductor device
JPH0365901B2 (en) * 1985-10-09 1991-10-15
JPH0387177U (en) * 1989-12-22 1991-09-04

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