JPH0387177U - - Google Patents
Info
- Publication number
- JPH0387177U JPH0387177U JP1989147032U JP14703289U JPH0387177U JP H0387177 U JPH0387177 U JP H0387177U JP 1989147032 U JP1989147032 U JP 1989147032U JP 14703289 U JP14703289 U JP 14703289U JP H0387177 U JPH0387177 U JP H0387177U
- Authority
- JP
- Japan
- Prior art keywords
- board
- generating component
- cooling
- cooling plate
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000001816 cooling Methods 0.000 claims description 4
- 239000000110 cooling liquid Substances 0.000 claims 1
- 238000007654 immersion Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
Description
第１図は、本考案の実施例を示す図であり、同
図ａは断面図、同図ｂはＡ−Ａ′断面図、第２図
は、本考案が適用されるシステムを示す図であり
、第３図は、従来の構造図である。
図において、１……基板、２……冷却プレート
、３……発熱部品、６……ピン、をそれぞれ示す
。
FIG. 1 is a diagram showing an embodiment of the present invention; FIG. 1A is a sectional view, FIG. 3 is a conventional structural diagram. In the figure, 1...board, 2...cooling plate, 3...heat generating component, 6...pin, respectively.
Claims (1)
と共に、該基板１との密閉状態を保持する冷却プ
レート２とを有してなる浸漬冷却構造において、 前記冷却プレート２の外壁を貫通し、前記発熱
部品３の近傍まで形成される熱伝導性に優れた複
数のピン６を設けたことを特徴とする浸漬冷却構
造。[Claims for Utility Model Registration] A board 1 on which a heat-generating component 3 is mounted; a cooling plate 2 that supplies and discharges a cooling liquid to the board 1 and maintains a sealed state with the board 1; An immersion cooling structure comprising: A plurality of pins 6 having excellent thermal conductivity are provided which penetrate the outer wall of the cooling plate 2 and reach the vicinity of the heat generating component 3. structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989147032U JPH0727637Y2 (en) | 1989-12-22 | 1989-12-22 | Immersion cooling structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989147032U JPH0727637Y2 (en) | 1989-12-22 | 1989-12-22 | Immersion cooling structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0387177U true JPH0387177U (en) | 1991-09-04 |
| JPH0727637Y2 JPH0727637Y2 (en) | 1995-06-21 |
Family
ID=31693565
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989147032U Expired - Lifetime JPH0727637Y2 (en) | 1989-12-22 | 1989-12-22 | Immersion cooling structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0727637Y2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004297069A (en) * | 2003-03-27 | 2004-10-21 | Stmicroelectronics Inc | System and method for direct convective cooling of exposed integrated circuit die surface |
| WO2007102498A1 (en) * | 2006-03-06 | 2007-09-13 | Tokyo University Of Science Educational Foundation Administrative Organization | Method of ebullient cooling, ebullient cooling apparatus, flow channel structure and application product thereof |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56103453A (en) * | 1980-01-21 | 1981-08-18 | Hitachi Ltd | Lsi apparatus system |
| JPS57103338A (en) * | 1980-12-19 | 1982-06-26 | Hitachi Ltd | Boiling cooling device |
-
1989
- 1989-12-22 JP JP1989147032U patent/JPH0727637Y2/en not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56103453A (en) * | 1980-01-21 | 1981-08-18 | Hitachi Ltd | Lsi apparatus system |
| JPS57103338A (en) * | 1980-12-19 | 1982-06-26 | Hitachi Ltd | Boiling cooling device |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004297069A (en) * | 2003-03-27 | 2004-10-21 | Stmicroelectronics Inc | System and method for direct convective cooling of exposed integrated circuit die surface |
| JP4657617B2 (en) * | 2003-03-27 | 2011-03-23 | エスティーマイクロエレクトロニクス，インコーポレイテッド | System and method for direct convection cooling of an exposed integrated circuit die surface |
| WO2007102498A1 (en) * | 2006-03-06 | 2007-09-13 | Tokyo University Of Science Educational Foundation Administrative Organization | Method of ebullient cooling, ebullient cooling apparatus, flow channel structure and application product thereof |
| JPWO2007102498A1 (en) * | 2006-03-06 | 2009-07-23 | 学校法人東京理科大学 | Boiling cooling method, boiling cooling device, flow channel structure, and application product thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0727637Y2 (en) | 1995-06-21 |