JPS6284940U - - Google Patents
Info
- Publication number
- JPS6284940U JPS6284940U JP1985177588U JP17758885U JPS6284940U JP S6284940 U JPS6284940 U JP S6284940U JP 1985177588 U JP1985177588 U JP 1985177588U JP 17758885 U JP17758885 U JP 17758885U JP S6284940 U JPS6284940 U JP S6284940U
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- led
- substrates
- view
- lamp
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims description 11
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 230000002265 prevention Effects 0.000 claims description 2
- 238000004382 potting Methods 0.000 claims 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
Description
第１図は本考案によるシート状基板の平面図と
搭載したＬＥＤランプの一部の拡大平面図、第２
図は第１図の側面図と拡大断面図、第３図はスク
ライブ線を入れただけのシート状基板の部分断面
図、第４図は本考案の他の実施例を示す平面図、
第５図はさらに本考案の他の実施例を示す断面図
、第６図はＬＥＤランプの斜視図である。
１……シート状基板、２……基板、３……スク
ライブ線、４……流れ防止溝、５……切欠、７…
…透明樹脂、８……厚膜配線、９……ＬＥＤチツ
プ、１０……金線、１１……ＬＥＤランプ素子。
Fig. 1 is a plan view of a sheet-like substrate according to the present invention and an enlarged plan view of a part of the mounted LED lamp;
The figures are a side view and an enlarged sectional view of FIG. 1, FIG. 3 is a partial sectional view of a sheet-like substrate with only scribe lines, and FIG. 4 is a plan view showing another embodiment of the present invention.
FIG. 5 is a sectional view showing another embodiment of the present invention, and FIG. 6 is a perspective view of an LED lamp. DESCRIPTION OF SYMBOLS 1... Sheet-like substrate, 2... Substrate, 3... Scribe line, 4... Flow prevention groove, 5... Notch, 7...
...Transparent resin, 8...Thick film wiring, 9...LED chip, 10...Gold wire, 11...LED lamp element.
Claims (1)
ツプを接続し、その上に樹脂ポツテイングを行う
ようにしたＬＥＤランプにおいて、複数個の基板
に分割されるシート基板に、各基板の角隅を円形
に近づけるための切欠きを形成し、かつ各基板相
互の連結部分に分割用スクライブ線と樹脂の流れ
防止溝とを形成してなることを特徴とするＬＥＤ
ランプ用基板。 In an LED lamp in which thick-film wiring is applied to an insulating substrate, an LED chip is connected, and resin potting is performed on the insulated substrate, a sheet substrate is divided into multiple substrates, and each corner of each substrate is shaped into a circle. An LED characterized in that a notch is formed to allow the substrates to approach each other, and a dividing scribe line and a resin flow prevention groove are formed at the mutually connecting portion of each substrate.
Lamp board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985177588U JPH0416456Y2 (en) | 1985-11-19 | 1985-11-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985177588U JPH0416456Y2 (en) | 1985-11-19 | 1985-11-19 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6284940U true JPS6284940U (en) | 1987-05-30 |
| JPH0416456Y2 JPH0416456Y2 (en) | 1992-04-13 |
Family
ID=31118927
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985177588U Expired JPH0416456Y2 (en) | 1985-11-19 | 1985-11-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0416456Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015106620A (en) * | 2013-11-29 | 2015-06-08 | 日亜化学工業株式会社 | Method of manufacturing light emitting device |
-
1985
- 1985-11-19 JP JP1985177588U patent/JPH0416456Y2/ja not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015106620A (en) * | 2013-11-29 | 2015-06-08 | 日亜化学工業株式会社 | Method of manufacturing light emitting device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0416456Y2 (en) | 1992-04-13 |