JP2015106620A - Method of manufacturing light emitting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method of manufacturing a light emitting device in which an aggregate substrate is singulated to form a plurality of light emitting devices and a light extraction surface is formed in a lens shape.SOLUTION: Disclosed is a method of manufacturing a light emitting device in which an aggregate substrate is singulated to form a plurality of light emitting devices. This method includes the steps of: preparing the aggregate substrate in which a light emitting element placement region is surrounded by a groove; forming a convex lens whose edge is located in the groove by dripping resin in the light emitting element placement region; and singulating the aggregate substrate by the groove.

Description

  The present invention relates to a method for manufacturing a light emitting device.

  2. Description of the Related Art A manufacturing method of a light emitting device is known in which an aggregate substrate is divided into a plurality of light emitting devices (see Patent Documents 1 and 2).

JP 2012-182180 A JP 2013-058695 A

  By the way, it is generally known that the light extraction efficiency of the light emitting device is enhanced by forming the light extraction surface (eg, the surface of the sealing member) into a lens shape. However, the above-described conventional manufacturing method in which the collective substrate is divided into a plurality of light emitting devices has a problem that the light extraction surface is formed in a flat shape and cannot be formed in a lens shape.

  Accordingly, an object of the present invention is to provide a method for manufacturing a light-emitting device in which a light extraction surface is formed in a lens shape in a method for manufacturing a light-emitting device by dividing an aggregate substrate into a plurality of light-emitting devices.

  According to the present invention, the above problem is solved by the following means. That is, the present invention relates to a method of manufacturing a light emitting device by dividing an aggregate substrate into a plurality of light emitting devices, the step of preparing an aggregate substrate in which a light emitting element mounting region is surrounded by a groove, and the light emitting element A method for manufacturing a light-emitting device, comprising: a step of forming a convex lens having an edge positioned in the groove portion by dropping resin on a placement region; and a step of separating an aggregate substrate in the groove portion. is there.

  According to the present invention, since the light extraction surface is formed in a lens shape in the method of manufacturing a light emitting device by dividing the collective substrate into a plurality of light emitting devices, the light whose total reflection on the light extraction surface is suppressed is suppressed. A light emitting device having excellent extraction efficiency can be easily manufactured.

It is a schematic diagram explaining the manufacturing method of the light-emitting device which concerns on Embodiment 1 of this invention. In each figure, (a) is a plan view, and (b) is a cross-sectional view (a partially enlarged view of the AA cross section in the plan view). It is a schematic diagram explaining the manufacturing method of the light-emitting device which concerns on Embodiment 1 of this invention. In each figure, (a) is a plan view, and (b) is a cross-sectional view (a partially enlarged view of the AA cross section in the plan view). It is a schematic diagram explaining the manufacturing method of the light-emitting device which concerns on Embodiment 1 of this invention. In each figure, (a) is a plan view, and (b) is a cross-sectional view (a partially enlarged view of the AA cross section in the plan view). It is a schematic diagram explaining the manufacturing method of the light-emitting device which concerns on Embodiment 2 of this invention. In each figure, (a) is a plan view, and (b) is a cross-sectional view (a partially enlarged view of the AA cross section in the plan view). It is a schematic diagram explaining the manufacturing method of the light-emitting device which concerns on Embodiment 2 of this invention. In each figure, (a) is a plan view, and (b) is a cross-sectional view (a partially enlarged view of the AA cross section in the plan view). It is a schematic diagram explaining the manufacturing method of the light-emitting device which concerns on Embodiment 2 of this invention. In each figure, (a) is a plan view, and (b) is a cross-sectional view (a partially enlarged view of the AA cross section in the plan view).

  EMBODIMENT OF THE INVENTION Below, the form for implementing this invention is demonstrated, referring attached drawing.

[Method for Manufacturing Light-Emitting Device According to Embodiment 1 of the Present Invention]
1-1, 1-2, and 1-3 are schematic diagrams illustrating a method for manufacturing a light-emitting device according to Embodiment 1 of the present invention. In each figure, (a) is a plan view, and (b) is a cross-sectional view (a partially enlarged view of the AA cross section in the plan view).

  As shown in FIG. 1, the method for manufacturing a light emitting device according to the first embodiment of the present invention is a method for manufacturing a light emitting device by dividing a collective substrate 10 into a plurality of light emitting devices 100, and mounting a light emitting element A step of preparing the collective substrate 10 in which the region 12 is surrounded by the groove 14 (first step), and a step of forming the convex lens Y whose edge is located in the groove 14 by dropping the resin 20 on the light emitting element placement region 12. This is a method for manufacturing a light-emitting device, which includes (second step) and a step (third step) of dividing the collective substrate 10 into individual pieces by the grooves 14.

  Hereinafter, it demonstrates in order.

(First step)
First, as shown in FIG. 1A, a collective substrate 10 in which the light emitting element placement region 12 is surrounded by the groove 14 is prepared. The collective substrate 10 is a lead frame substrate including a resin molded body 16, and the groove portion 14 is formed in the resin molded body 16. The resin molded body 16 has a recess X, and the light emitting element placement region 12 is formed on the inner bottom surface of the recess X of the resin molded body 16. On the other hand, the groove part 14 is formed in the outer upper surface of the recessed part X which the resin molding 16 has. The shape of the recessed part X which the resin molding 16 has, and the shape of the light emitting element mounting area | region 12 are not specifically limited.

  The material of the lead frame substrate is not particularly limited, but it is preferable to form the lead frame substrate with a material having a relatively high thermal conductivity. By forming with such a material, heat generated from the light-emitting element can be efficiently released. For example, a material having a thermal conductivity of about 200 W / (m · K) or more, a material having a relatively large mechanical strength, and a material that can be easily punched or etched are preferable. The lead frame is usually formed with a uniform film thickness, but may be partially thick or thin.

  As the collective substrate 10 including the resin molded body 16, an insulating substrate such as ceramic, glass epoxy, or glass can be used in addition to a metal substrate such as a lead frame.

  As the molding material of the resin molding 16, for example, a thermoplastic resin such as a liquid crystal polymer, a polyphthalamide resin, or polybutylene terephthalate (PBT) can be used in addition to a thermosetting resin such as an epoxy resin or a silicone resin. . In addition, a white pigment such as titanium oxide may be mixed in the molding material to increase the reflectance of light in the recess X of the resin molded body 16. In addition, when the resin molding 16 has the recessed part X like this embodiment, the reflected light in a light extraction surface is made into the resin 20 by making the resin molding 16 into a material with a high reflectance of light. Since it becomes easy to be reflected on the outer upper surface of the covered recess X, the light extraction efficiency is improved.

  The resin molded body 16 may be formed by injection molding, potting molding, resin printing, transfer molding, compression molding, or the like.

The light emitting element 30 is placed in the light emitting element placement region 12. The light emitting element mounting step may be included in the first step, or the light emitting element mounting step may be provided between the first step and the second step. For example, a light emitting diode chip can be used for the light emitting element 30 placed in the light emitting element placement region 12. As the light emitting diode, one having an arbitrary wavelength can be selected according to the application. For example, the blue, the green light emitting element, ZnSe, nitride semiconductor _{(In X Al Y Ga 1-} X-Y N, 0 ≦ X, 0 ≦ Y, X + Y <1), can be used GaP, and the like. The number of the light emitting element mounting regions 12 surrounded by the groove 14 may be one or plural. When there is one, one convex lens Y is formed for one light emitting element placement region 12, and when there is a plurality, one convex lens Y is formed for a plurality of light emitting element placement regions 12. The

  The groove 14 can be formed in various shapes by appropriately selecting the blade edge angle and blade width of the blade. The corner of the upper end of the inner wall of the groove portion 14 may have a slight R shape, but is preferably a right angle or a shape close to a right angle. In this way, the upper end of the inner wall of the groove portion 14 can be further functioned as an edge portion and it becomes easy to dampen a resin 20 described later, so that the convex lens Y can be easily formed at a sufficient height.

  The groove portion 14 may be formed in advance by a mold when the resin molded body 16 is molded, but it is preferable to form the groove portion 14 using a blade or the like after the molding of the resin molded body 16. The groove portion 14 formed using a blade can be formed into a right angle or a shape close to a right angle at the upper end of the inner wall of the groove portion 14 compared to a case where the groove portion 14 is formed in advance by a mold (in other words, it becomes an R shape). Therefore, the convex lens Y can be easily formed at a sufficient height.

(Second step)
Next, as illustrated in FIG. 1B, the resin 20 is dropped on the light emitting element placement region 12. The dropped resin 20 is filled in the concave portion X of the resin molded body 16 and seals the light emitting element 30. When the inside of the concave portion X of the resin molded body 16 is filled, the resin 20 overflows from the inside of the concave portion X and spreads on the outer upper surface of the concave portion X. However, when it reaches the groove 14 formed on the outer upper surface of the recess X, it stops spreading due to its own surface tension and rises in a convex shape toward the upper side of the light emitting element placement region 12. Thereby, the convex lens Y in which an edge is located in the groove part 14 of the external upper surface of the recessed part X is formed. The convex lens Y whose edge is located in the groove portion 14 has the outer dimension of the light emitting device 100 in the top view almost equal to the outer dimension of the convex lens Y. Therefore, a convex lens that is maximally larger than the outer dimension of the light emitting device 100 is provided. Thus, the light extraction efficiency is improved, and the light emitting device 100 can be downsized.

  When the light emitting element placement region 12 is formed on the inner bottom surface of the recess X, the dropping of the resin 20 may be interrupted once when the interior of the recess X of the resin molded body 16 is filled. In this case, after the resin 20 filled in the recess X of the resin molded body 16 is cured, the dropping of the resin 20 is resumed. If it does in this way, a separate material will be used for the resin with which the inside of the recessed part X of the resin molding 16 is filled, and the resin which protrudes convexly on this resin, or a filler is contained only in one resin. It is possible to contain different fillers in both resins, and the individual functions can be efficiently exhibited in both resin layers.

  The material of the resin 20 may be any material that has insulating properties, can transmit light emitted from the light emitting element 30, and has fluidity before solidification. Specific examples include silicone resins, silicone-modified resins, epoxy resins, phenol resins, polycarbonate resins, acrylic resins, TPX resins, polynorbornene resins, or hybrid resins containing one or more of these resins. Glass may be used. Among these, silicone resins are preferable because they are excellent in heat resistance and weather resistance and have little volume shrinkage after solidification.

  As the filler that can be contained in the resin 20, for example, a phosphor or a diffusing material can be used.

As the phosphor, those known in the art can be used. Specifically, yttrium aluminum garnet (YAG) activated by cerium, lutetium aluminum garnet (LAG) activated by cerium, nitrogen-containing calcium aluminosilicate activated by europium and / or chromium (CaO- Al ₂ O ₃ —SiO ₂ ), europium activated silicate ((Sr, Ba) ₂ SiO ₄ ), and the like. Accordingly, a light emitting device that emits mixed light (for example, white light) of primary light and secondary light having a visible wavelength, and a light emitting device that emits secondary light having a visible wavelength when excited by the primary light of ultraviolet light. it can. In particular, as a phosphor that emits white light in combination with a blue light-emitting element, it is preferable to use a phosphor that is excited by blue and exhibits yellow broad light emission.

As the phosphor, a plurality of types of phosphors may be used in combination. For _{example, Si 6-Z Al Z O} Z N 8-Z: Eu, Lu 3 Al 5 O 12: Ce, BaMgAl 10 O 17: Eu, BaMgAl 10 O 17: Eu, Mn, (Zn, Cd) Zn: Cu (Sr, Ca) ₁₀ (PO ₄ ) ₆ Cl ₂ : Eu, Mn, (Sr, Ca) ₂ Si ₅ N ₈ : Eu, CaAlSiB _x N _{3 + x} : Eu, K ₂ SiF ₆ : Mn and CaAlSiN ₃ : Eu The color rendering properties and color reproducibility can also be adjusted by using phosphors such as those in a combination and blending ratio suitable for the desired color tone.

  Examples of the diffusing agent include silica, titanium oxide, zirconium oxide, magnesium oxide, magnesium carbonate, magnesium hydroxide, calcium carbonate, calcium hydroxide, calcium silicate, zinc oxide, barium titanate, aluminum oxide, iron oxide, and chromium oxide. , Manganese oxide, glass, carbon black and the like.

  Here, the phosphor is not limited to being contained in the resin 20, but a step of forming a phosphor layer including the phosphor on the surface of the light emitting element 30 may be provided before the second step. In this case, the method for forming the phosphor layer is not particularly limited, and for example, a spray method, an electrodeposition method, or an electrostatic coating method can be used. Alternatively, a phosphor sheet made of a material in which a phosphor is dispersed in the resin 20, a phosphor-containing glass plate, or the like may be bonded to the light emitting element 30 using an adhesive or the like. As the phosphor, those known in the art can be used as described above.

(Third step)
Next, as shown in FIGS. 1 to 3, the collective substrate 10 is separated into pieces by the grooves 14. For example, the singulation is performed by cutting a portion indicated by a cutting line Z in FIGS. Although the mode of individualization is not particularly limited, it can be individualized without scratching the surface of the convex lens Y if it is individualized while leaving a partial region of the groove 14. In the case of dividing into pieces while leaving a partial region of the groove portion 14, for example, a blade that is thinner than the blade used when forming the groove portion 14 is used in dividing into pieces.

  When cutting at the time of forming the groove and cutting each by cutting with a blade, if the aggregate substrate 10 is cut into pieces while leaving a partial region of the groove 14, it is cut into pieces at positions other than the groove 14. Rather than doing so, blade consumption can be reduced. Although the width of the groove portion 14 is exaggerated in the drawing, the width of the groove portion 14 is actually narrow, so that the outer dimension of the light emitting device 100 in the top view is the size of the convex lens Y (resin 20). Almost equal. For this reason, since the light emitting device 100 can be reduced in size and the number of light emitting devices 100 that can be obtained from the collective substrate 10 can be increased, mass productivity can be improved.

  According to the first embodiment of the present invention described above, the convex lens Y is formed above the light emitting element mounting region 12 in the method of manufacturing the light emitting device by separating the collective substrate 10 into a plurality of light emitting devices 100. Can do. Therefore, it is possible to provide the light emitting device 100 in which the light extraction surface is formed in a curved shape. Therefore, it is possible to manufacture the light emitting device 100 having excellent light extraction efficiency in which total reflection at the light extraction surface is suppressed.

[Method for Manufacturing Light-Emitting Device According to Embodiment 2 of the Present Invention]
2A, 2B, and 2C are schematic views illustrating a method for manufacturing a light emitting device according to Embodiment 2 of the present invention. In each figure, (a) is a plan view, and (b) is a cross-sectional view (a partially enlarged view of the AA cross section in the plan view).

  As shown in FIGS. 2-1, 2-2, and 2-3, in the method of manufacturing the light emitting device according to the second embodiment of the present invention, the collective substrate 10 includes the ceramic substrate 18 and the groove portion 14 is formed in the ceramic substrate 18. This is different from the method for manufacturing the light emitting device according to Embodiment 1 of the present invention.

(First step)
As shown in FIG. 2A, the collective substrate 10 in which the light emitting element mounting region 12 is surrounded by the groove 14 is prepared. The collective substrate 10 includes a ceramic substrate 18, and the groove 14 is formed in the ceramic substrate 18. The groove 14 is formed using a blade, for example.

The side surface of the groove portion 14 is formed with a vertical surface from the upper portion of the side surface of the groove portion 14 to the middle of the side surface of the groove portion 14, and an inclined surface having a V-shaped cross section is formed from the middle to the bottom portion of the groove portion 14. The groove portion 14 having such a shape can be formed by inserting a bevel cutting blade whose side surface is inclined by a height corresponding to substantially half the depth of the groove portion 14 and performing half dicing.
(Second step)
Next, as illustrated in FIG. 2B, the resin 20 is dropped onto the light emitting element placement region 12. The dropped resin 20 spreads on the upper surface of the collective substrate 10. However, when reaching the groove portion 14 formed on the upper surface of the collective substrate 10, the expansion is stopped by its own surface tension, and the convex portion rises upward above the light emitting element mounting region 12. Thereby, the convex lens Y is formed above the light emitting element mounting region 12.

(Third step)
As illustrated in FIG. 2C, the collective substrate 10 is separated into pieces by the grooves 14. Separation is performed by cutting a portion (V-shaped deepest portion) indicated by a cutting line Z by a break process. By performing the singulation by the break processing, no cutting powder is generated during the singulation, so that adhesion of dust such as cutting powder to the convex lens is suppressed.

  Also in the case of the second embodiment, as in the case of the first embodiment, the light emitting device 200 in which the convex lens Y is formed above the light emitting element placement region 12 and the light extraction surface is formed in a lens shape is provided. Thus, the light emitting device 200 having excellent light extraction efficiency in which total reflection on the light extraction surface is suppressed can be manufactured.

  As described above, according to the method for manufacturing the light emitting device according to the first and second embodiments of the present invention, the convex lenses Y are not formed individually after being separated into pieces, but are continuously formed before being separated into pieces. Therefore, the manufacturing cost of the light emitting device in which the convex lens Y is formed can be reduced.

  As mentioned above, although embodiment of this invention was described, these description is related with an example of this invention, and this invention is not limited at all by these description.

DESCRIPTION OF SYMBOLS 10 Collective substrate 12 Light emitting element mounting area 14 Groove part 16 Resin molding 18 Ceramic substrate 20 Resin 30 Light emitting element 100 Light emitting apparatus 200 Light emitting apparatus X Recessed part Y Convex lens Z Cutting line

Claims (5)

A method of manufacturing a light emitting device by dividing an aggregate substrate into a plurality of light emitting devices,
Preparing a collective substrate in which the light emitting element mounting region is surrounded by the groove;
Forming a convex lens having an edge located in the groove by dropping resin on the light emitting element placement region;
Separating the collective substrate at the groove,
A method for manufacturing a light-emitting device, comprising:   2. The method for manufacturing a light emitting device according to claim 1, wherein the step of separating the collective substrate at the groove portion is a step of separating the aggregate substrate while leaving a partial region of the groove portion. The collective substrate includes a resin molded body,
The method for manufacturing a light emitting device according to claim 1, wherein the groove is formed in the resin molded body. The collective substrate includes a ceramic substrate,
The method for manufacturing a light emitting device according to claim 1, wherein the groove is formed in the ceramic substrate. The collective substrate has a recess having a bottom surface having the light emitting element mounting region,
The method for manufacturing a light emitting device according to claim 1, further comprising a step of filling the concave portion with a resin containing a phosphor before forming the convex lens.

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