JP2012156198A - Light-emitting device, and method of manufacturing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a light-emitting device arranged so that a translucent member can be attached to a light-emitting face easily, and a method of manufacturing the light-emitting device.SOLUTION: The light-emitting device comprises: a substrate 1; a concavity 3 formed in an almost center portion of a surface of the substrate 1 by drawing; and an LED chip 2. The concavity 3 has: a mount face 32 for mounting the LED chip 2 which has a circular form in plan view, and is parallel with the surface of the substrate 1; and a curved face 31 curved from the periphery of the concavity 3 toward the center thereof. The LED chip 2 is mounted on the mount face 32 with e.g. silver paste or the like. An electrode of the LED chip 2, and a land 4 are connected by a gold wire 7 by wire bonding. The inside of the concavity 3 is filled with translucent resin so that the LED chip 2 and the gold wire 7 are buried therein.

Description

  The present invention relates to a light-emitting device including an LED chip and a method for manufacturing the light-emitting device.

  In recent years, light-emitting diodes have attracted attention as light sources for lighting devices. In addition to indoor lighting devices, light emitting diodes have been used in a wide range of fields, such as lighting devices used outdoors such as road lighting or road signs, illumination light sources, and decorations for amusement equipment.

  Such a light emitting diode (LED lamp) has a structure in which, for example, an LED chip is die-bonded on the surface of an aluminum substrate on which an insulating layer, a copper foil, and a resist are sequentially laminated, and the LED chip electrode and the electrode on the copper foil are Are connected with a gold wire, and a silicon resin is coated in a convex shape so as to cover the LED chip and the gold wire (see Patent Document 1).

JP 2005-85912 A

  However, in the LED lamp of Patent Document 1, since the LED chip is mounted on the surface of the substrate and the silicon resin is coated so as to cover the LED chip, the silicon resin portion that covers the LED chip is exposed from the substrate surface. It has a protruding structure, and the light emitting surface is not flat. For this reason, when attaching translucent members, such as glass or a lens, to a light emitting surface, since the attachment structure becomes complicated, the structure which attaches a translucent member easily was desired.

  This invention is made | formed in view of such a situation, and it aims at providing the light-emitting device which can attach a translucent member to a light emission surface easily, and the manufacturing method of this light-emitting device.

  A light-emitting device according to a first aspect of the present invention is the light-emitting device including an LED chip, wherein a recess is formed on the surface by drawing, a metal substrate having the LED chip mounted in the recess, and the surface of the substrate And a translucent resin filled in the recess so as to be substantially in the same plane.

  The light emitting device according to a second invention is characterized in that, in the first invention, the concave portion has a curved surface curved from the peripheral portion toward the central portion of the concave portion.

  The light emitting device according to a third aspect of the present invention is the light emitting device according to the first aspect or the second aspect, wherein the connecting surface for connecting the lead includes a lead connecting portion having a concave step with respect to the surface of the substrate, The solder is welded to the lead connecting portion so that the surface of the solder to be connected does not exceed the surface of the substrate.

  The light emitting device according to a fourth aspect of the present invention is the light emitting device according to the third aspect, wherein the lead has a covering portion, is provided with a notch at an edge of the substrate, and the lead connecting portion is connected to the notch. The covering portion is inserted into the cutout portion and wired on the back side of the substrate.

  According to a fifth aspect of the present invention, there is provided the light emitting device according to any one of the first to fourth aspects, further comprising a translucent member having a contact surface that contacts the surface of the substrate.

  A light emitting device according to a sixth invention is the light emitting device according to the fifth invention, wherein the translucent member includes a peripheral portion surrounding an edge of the substrate in a state where the surface of the substrate is in contact with the contact surface, The sealing member may further include a sealing member provided inside the peripheral portion so as to seal the substrate with the light transmitting member.

  A light emitting device according to a seventh invention is characterized in that, in the fifth invention or the sixth invention, the translucent member includes a lens for condensing or diffusing light from the LED chip.

  According to an eighth aspect of the present invention, there is provided a light emitting device manufacturing method comprising: a step of forming a recess in a surface of a metal substrate by drawing; and the LED chip is formed in the formed recess. A mounting step; and a step of filling the recess in which the LED chip is mounted with a translucent resin.

  According to a ninth aspect of the present invention, there is provided the method for manufacturing a light emitting device according to the eighth aspect, further comprising a step of cutting a part of the back surface of the substrate corresponding to the portion where the concave portion is formed.

  In the first invention and the eighth invention, a recess is formed on the surface of a metal substrate by drawing, and an LED chip is mounted in the recess. The concave portion is filled with a translucent resin so as to be substantially flush with the surface of the substrate. Since the concave portion is formed by drawing in the portion where the LED chip is mounted, the surface of the translucent resin covering the LED chip can be made substantially flush with the surface of the substrate. Note that “substantially the same plane” includes not only the same plane but also the case where the surface of the translucent resin is below the surface of the substrate as long as it does not exceed the surface of the substrate. With the above-described configuration, the entire surface of the substrate including the light emitting surface can be made substantially flat, so that a translucent member such as glass or a lens can be easily attached to the surface of the substrate. In addition, since the concave portion for mounting the LED chip is formed by drawing, the entire substrate surface can be made substantially flat even when using a substrate on which a wiring pattern made of copper foil or the like is formed in advance.

  In the second invention, the concave portion has a curved surface curved from the peripheral portion of the concave portion toward the central portion. Since the concave portion is formed by drawing, the concave portion is curved from the peripheral portion toward the central portion. Since the concave portion is formed by drawing, the shape of the concave portion on the substrate surface is a circular shape, an elliptical shape, a rectangular shape with corners formed by curves, or the like. The shape of the recess can be appropriately determined according to the number of LED chips to be mounted in the recess.

  In the third invention, the connecting surface for connecting the lead includes the lead connecting portion having a concave step with respect to the surface of the substrate. Solder is welded to the lead connection portion so that the surface of the solder connecting the lead to the connection surface does not exceed the surface of the substrate. When the leads are connected to the connection surface, the lead connection portion has a concave step with respect to the surface of the substrate, so that a space for welding solder is formed, and the surface of the solder does not exceed the surface of the substrate (with the surface of the substrate). Even when connecting the leads to the substrate, the entire substrate surface including the light emitting surface can be made to be a substantially flat surface, so glass or a lens, etc. The translucent member can be easily attached to the surface of the substrate.

  In the fourth aspect of the invention, the substrate is provided with a notch at the edge, the lead connecting portion is connected to the notch, and the lead covering portion is inserted into the notch and wired to the back side of the substrate. is there. Since the notch for inserting the lead cover is provided, when connecting the lead to the connection surface, the lead cover can be wired from the notch to the back side of the board (opposite to the light emitting surface). The wiring of the covering portion can be removed from the light emitting surface side, and it is not necessary to provide a region necessary for the wiring of the covering portion on the light emitting surface side. Even when a plurality of substrates are arranged in a plane (two-dimensional arrangement), the wiring area of the covering portion on the light emitting surface is not necessary, so that the substrate integration density can be increased.

  In the fifth invention, the translucent member having an abutting surface that abuts on the surface of the substrate is provided. Since the surface of the substrate including the light emitting surface is substantially the same plane, the light transmitting member can be attached to the surface of the substrate simply by forming the contact surface of the light transmitting member flat. It becomes easier compared. In addition, oxidation or sulfidation can be prevented by attaching a translucent member in contact with the surface of the substrate including the light emitting surface, and especially when used outdoors for road lighting, etc., to prevent the influence of exhaust gas. can do.

  In the sixth invention, the translucent member includes a peripheral portion surrounding the edge of the substrate in a state where the surface of the substrate is in contact with the contact surface. A sealing member is further provided inside the peripheral portion to seal the substrate with the light transmissive member. Since the substrate is sealed with the sealing member in a state where the surface of the substrate is in contact with the translucent member provided with the peripheral portion, the substrate can be waterproofed by the translucent member and the sealing member. In addition, since gas or the like can be prevented from entering the substrate, reliability can be improved.

  In the seventh invention, the translucent member includes a lens that collects or diffuses the light from the LED chip. Thereby, a required light distribution characteristic can be obtained.

  In the ninth invention, a part of the back surface of the substrate corresponding to the portion where the recess is formed is cut out. When a recess is formed by drawing by removing a part of the back surface of the substrate corresponding to the location where the recess is formed, when a part of the substrate is pushed from the front side to the back side by drawing. However, the amount of the substrate protruding from the back surface of the substrate can be reduced, and the process of flattening the back surface of the substrate can be simplified.

  According to the present invention, since the entire substrate surface including the light emitting surface can be made substantially flat (substantially the same plane), a translucent member such as glass or a lens can be easily attached to the surface of the substrate.

3 is a plan view illustrating an example of a structure of the light-emitting device of Embodiment 1. FIG. 3 is a cross-sectional view illustrating an example of a structure of the light-emitting device of Embodiment 1. FIG. 5 is an explanatory diagram illustrating an example of a method for manufacturing the light-emitting device of Embodiment 1. FIG. 6 is a schematic diagram illustrating an example of a main part of a lead connection portion of the light emitting device of Embodiment 2. FIG. FIG. 10 is a main part cross-sectional view showing an example of a lead connection state of the light emitting device of the second embodiment. FIG. 12 is a schematic diagram illustrating another example of the main part of the lead connection portion of the light emitting device according to the second embodiment. FIG. 10 is a main part cross-sectional view showing another example of a lead connection state of the light emitting device of the second embodiment. 7 is a plan view illustrating an example of a structure of a light-emitting device according to Embodiment 3. FIG. 6 is a cross-sectional view illustrating an example of a structure of a light-emitting device of Embodiment 4. FIG. FIG. 10 is a cross-sectional view illustrating an example of the structure of a light-emitting device according to Embodiment 5.

(Embodiment 1)
Hereinafter, the present invention will be described with reference to the drawings illustrating embodiments thereof. FIG. 1 is a plan view showing an example of the structure of the light-emitting device 100 according to Embodiment 1, and FIG. 2 is a cross-sectional view showing an example of the structure of the light-emitting device 100 according to Embodiment 1. 1 and 2, reference numeral 1 denotes a metallic substrate. The substrate 1 may be made of an aluminum material (for example, A5052) or an aluminum alloy. Further, the substrate 1 may be a substrate or may be anodized. A resin insulating layer (not shown) is formed on one surface of the substrate 1. The material of the insulating layer is, for example, an epoxy resin and a filler. On the upper surface of the insulating layer, there are a connection surface 5 for connecting a lead (not shown) for supplying power to the LED chip 2 from the outside, a land 4 connected to the electrode of the LED chip 2 by a gold wire 7, and a land 4 A conductive pattern 6 for connecting to the connection surface 5 is formed.

  The land 4, the connection surface 5, the conductive pattern 6, and the mounting surface of the LED chip 2 are formed of copper foil. The surface of the land 4 is plated with, for example, an alloy of nickel and gold, the connection surface 5 and the LED. For example, the surface of the mounting surface of the chip 2 is plated with gold. A resist (not shown) is provided on the insulating layer of the substrate 1 and the surface of the conductive pattern 6.

  The shape of the substrate 1 in plan view is rectangular, and for example, the length (length in the longitudinal direction) is about 8 mm, the width (length in the short direction) is about 5 mm, and the thickness is about 2 mm. In addition, the dimension of the board | substrate 1 is not limited to this.

  A concave portion 3 is formed in a substantially central portion of the surface 101 of the substrate 1 by drawing. The drawing process uses a tool such as a pin jig or die, constrains the periphery of the substrate with a holding jig, and pushes a predetermined part of the substrate into the die with the pin jig. It is the processing method to form. The concave portion 3 has, for example, a circular shape in plan view. The shape of the concave portion 3 in plan view is not limited to a circular shape, and may be an elliptical shape or a rectangular shape with curved corners depending on the number of LED chips 2 to be mounted.

  The concave portion 3 has a circular shape in plan view for mounting the LED chip 2, and includes a mounting surface 32 parallel to the surface 101 of the substrate 1 and a curved surface 31 curved from the peripheral portion of the concave portion 3 toward the central portion. Have. That is, the recess 3 is a dimple-like depression formed on the surface of the substrate 1. Since the concave portion 3 is formed by drawing, the concave portion 3 is curved from the peripheral portion toward the central portion. Further, since the concave portion 3 is formed by drawing, the shape of the concave portion 3 in plan view is a circular shape, an elliptical shape, a rectangular shape with curved corners, or the like.

  The diameter of the recess 3 in a plan view is, for example, about 4.6 mm, and the diameter of the mounting surface 32 in a plan view is about 3.5 mm. Moreover, the depth of the recessed part 3 is about 1 mm, for example.

  The LED chip 2 is, for example, a blue LED chip that emits blue light. The shape of the LED chip 2 is about 1 mm in length and width, and about 0.1 mm in height (thickness). Note that the light emission color of the LED chip 2 is not limited to blue, and may be a desired light emission color such as red or green.

  The LED chip 2 is mounted on the mounting surface 32 using, for example, silver paste or the like. Since the dimension between the mounting surface 32 on which the LED chip 2 is mounted and the back surface 102 of the substrate 1 is about 1 mm, the heat generated in the LED chip 2 is easily conducted to the back surface 102 side of the substrate 1, The heat dissipation effect can be enhanced.

  Between the electrode of the LED chip 2 and the land 4 plated with nickel / gold alloy, wire bonding is performed by a gold wire 7. A resist (not shown) is formed on portions other than the lands 4 made of a nickel / gold alloy and the connecting surfaces 5 plated with gold. In the example of FIG. 1, four lands 4 are formed, but one of the two is connected to a plus (positive) side wiring, and the other two are connected to a minus (negative) side wiring. Connected. By providing two lands of each polarity, the current capacity that can flow through the substrate 1 can be increased.

  The recess 3 is filled with a translucent resin 8 so as to cover the LED chip 2 and the gold wire 7. The translucent resin 8 is, for example, a transparent silicon resin containing a phosphor. The phosphor is, for example, a yellow phosphor that converts light from the LED chip 2 having a blue emission color into white. In addition, the translucent resin 8 can change the kind or content rate of a fluorescent substance according to the luminescent color of the LED chip 2, or does not need to contain a fluorescent substance.

  In the example of FIG. 2, the land and the conductive pattern are omitted for simplification.

  In the light emitting device 100 according to the present embodiment, the recess 3 is formed on the surface 101 of the metal substrate 1 by drawing, and the LED chip 2 is mounted in the recess 3. The recess 3 is filled with a translucent resin 8 so as to be substantially flush with the surface 101 of the substrate 1. That is, the surface 81 as the light emitting surface of the translucent resin 8 and the surface 101 of the substrate 1 form substantially the same flat surface, in other words, the substrate 1 including the surface 81 of the translucent resin 8 as the light emitting surface. The entire surface 101 is substantially flat. Since the concave portion 3 is formed by drawing in the portion where the LED chip 2 is mounted, the surface 81 of the translucent resin 8 covering the LED chip 2 can be made substantially flush with the surface 101 of the substrate 1. The substantially same surface includes not only the same surface but also the case where the surface 81 of the translucent resin 8 does not exceed the surface 101 of the substrate 1 and is below the surface 101 of the substrate 1. . With the above-described configuration, the entire substrate surface including the light emitting surface (at least except for the connecting portion of the leads) can be made substantially flat (substantially the same plane). Can be easily attached to. Further, since the recess 3 for mounting the LED chip 2 is formed by drawing, the entire substrate surface can be made substantially flat even when using the substrate 1 on which a wiring pattern made of copper foil or the like is formed in advance. That is, when the LED chip is mounted on the substrate 1 on which a wiring pattern made of copper foil or the like is formed in advance, the LED chip and the translucent resin that covers the LED chip protrude from the substrate surface. Although it was difficult to attach an optical member (translucent member) such as a lens, according to the present embodiment, a translucent member such as glass or a lens can be easily attached to the surface 101 of the substrate 1.

  Further, since the back surface 102 of the substrate 1 is flat, a heat radiating plate (not shown) or the like can be easily attached, and the entire back surface 102 of the substrate 1 can be brought into contact (contacted) with the heat radiating plate. The effect can be enhanced.

  Next, a method for manufacturing the light emitting device 100 according to Embodiment 1 will be described. FIG. 3 is an explanatory view showing an example of a method for manufacturing the light emitting device 100 of the first embodiment. As shown in FIG. 3A, a substrate 1 having a required dimension is prepared. An insulating layer 11, a copper foil 12 on which a required circuit pattern is formed, and a resist (not shown) are laminated on the substrate 1. The copper foil 12 is composed of lands 4, connection surfaces 5, and conductive patterns 6.

  Next, as shown in FIG. 3B, a part of the back surface 102 of the substrate 1 corresponding to the location where the recess 3 is formed is cut out to form the cut-out portion 13. The cut portion 13 can be formed by, for example, counterboring with a drill. The shape of the excision part 13 is, for example, a circular shape, and the depth of the excision part 13 can be, for example, about 0.5 mm to 1 mm. When the concave portion 3 is formed by drawing by cutting off a part of the back surface 102 of the substrate 1 corresponding to the location where the concave portion 3 is formed, a part of the substrate 1 is drawn from the front side to the back side by drawing. Even when pushed inward, the amount of the substrate 1 protruding from the back surface of the substrate 1 can be reduced, and the process of flattening the back surface of the substrate 1 can be simplified.

  Next, as shown in FIG. 3C, the curved surface 31 and the mounting surface 32 are formed by extruding the substrate 1 from the surface 101 side of the substrate 1 using a pin jig, a die, or the like (pressure molding, drawing, etc.). A concave portion (dimple portion) 3 having the shape is formed. At this time, a protrusion 14 is generated on the back surface 102 of the substrate 1 by drawing.

  Next, as shown in FIG. 3D, the back surface 102 of the substrate 1 is flattened by polishing the protruding portion 14 to a flat surface 15 by polishing.

  Next, as shown in FIG. 3E, the LED chip 2 is mounted on the recess 3 with silver paste, and the electrode of the LED chip 2 and the land 4 are wire-bonded with a gold wire 7. An appropriate amount of translucent resin 8 is filled so as to cover the LED chip 2 and the gold wire 7, and is cured using, for example, a curing furnace. Further, if necessary, the periphery of the substrate 1 can be cut to a required size.

  Note that the step of forming the cut portion 13 shown in FIG. 3B can be omitted depending on the size of the protruding portion 14 by drawing. However, by including the step shown in FIG. 3B, by forming the cut portion 13 on the back surface of the concave portion (dimple portion) 3 in advance by counterboring or the like, the protruding portion 14 protruding by pressure molding or drawing processing is formed. The flattening operation can be simplified.

(Embodiment 2)
In the first embodiment described above, the connection surface 5 for connecting the leads is formed on the surface 101 of the substrate 1. However, the present invention is not limited to this. By making the connection surface 5 for connecting the leads have a concave step with respect to the surface 101 of the substrate 1, it is possible to prevent the solder for connecting the leads from protruding on the surface 101 of the substrate 1. .

  FIG. 4 is a schematic diagram illustrating an example of a main part of a lead connection portion of the light emitting device 110 according to the second embodiment. FIG. 5 is a main part illustrating an example of a lead connection state of the light emitting device 110 according to the second embodiment. It is sectional drawing. As shown in FIGS. 4 and 5, a substantially rectangular parallelepiped lead connecting portion 20 having a step d with respect to the surface 101 of the substrate 1 and having a connecting surface 5 for connecting a lead 41 having a covering portion 40. Is provided at the edge of the substrate 1. That is, the lead connection portion 20 is formed such that the connection surface 5 connecting the leads 41 forms a concave step d with respect to the surface 101 of the substrate 1. The solder 43 is welded to the lead connection portion 20 so that the surface 431 of the solder 43 that connects the lead 41 to the connection surface 5 does not exceed the surface 101 of the substrate 1. In addition, the shape of the lead connection part 20 is not limited to the shape illustrated in FIG.4 and FIG.5.

  When the lead 41 is connected to the connection surface 5, the connection surface 5 of the lead connection portion 20 has a concave step d with respect to the surface 101 of the substrate 1, so that a space for welding the solder 43 is formed. 431 can be lower than the surface 101 of the substrate 1 (does not exceed the surface 101 of the substrate 1), and even when the leads 40 are connected to the substrate 1, the entire substrate surface including the light emitting surface is substantially flush. Since it can be (substantially flat surface), a translucent member such as glass or a lens can be easily attached to the surface of the substrate 1.

  The lead connection portion 20 may be formed by drawing the edge portion of the substrate 1 on which the connection surface 5, the conductive pattern 6, and the like are formed. In the case of drawing, the lead connection portion 20 has a substantially rectangular parallelepiped shape with curved corners. The lead connection portion 20 may be formed by processing the edge of the substrate 1 before forming the connection surface 5, the conductive pattern 6, and the like.

  FIG. 6 is a schematic diagram illustrating another example of the main part of the lead connection portion of the light emitting device 110 according to the second embodiment, and FIG. 7 illustrates another example of the lead connection state of the light emitting device 110 according to the second embodiment. It is principal part sectional drawing which shows these. As shown in FIGS. 6 and 7, a notch portion 21 formed at the edge of the substrate 1 is provided, the lead connection portion 20 is connected to the notch portion 21, and the covering portion 40 of the lead 41 is connected to the notch portion 21. And is wired on the back surface 102 side of the substrate 1.

  Since the notch portion 21 for inserting the covering portion 40 of the lead 41 is provided, when the lead 41 is connected to the connection surface 5, the covering portion 40 of the lead 41 is moved from the notch portion 21 to the back side of the substrate 1 (with the light emitting surface). The wiring of the covering portion 40 can be removed from the light emitting surface side, and it is not necessary to provide a region necessary for the wiring of the covering portion 40 on the light emitting surface side. Further, even when a plurality of substrates are arranged in a plane (two-dimensional arrangement), the wiring area of the covering portion 40 on the light emitting surface is not necessary, so that the integration density of the substrates 1 can be increased. Moreover, since the coating | coated part 40 is penetrated to the notch part 21, it can prevent that the coating | coated part 40 protrudes from the side surface 103 of the board | substrate 1, and it becomes possible to arrange | position the board | substrates 1 closely.

  6 and 7, when the lead 41 is connected to the connection surface 5, the connection surface 5 of the lead connection portion 20 has a concave step d with respect to the surface 101 of the substrate 1. Therefore, a space for welding the solder 43 is formed, and the surface 431 of the solder 43 can be located below the surface 101 of the substrate 1 (does not exceed the surface 101 of the substrate 1). Even in the case of connection, the entire substrate surface including the light emitting surface can be made substantially coplanar, so that a translucent member such as glass or a lens can be easily attached to the surface of the substrate 1.

  The notch 21 may be formed after the connection surface 5 and the conductive pattern 6 are formed, or may be formed before the connection surface 5 and the conductive pattern 6 are formed.

  The shape of the notch 21 in plan view is not limited to the rectangular shape illustrated in FIG. 6, and may be other shapes such as a circular shape. Further, in the example of FIG. 6, the lead connection portion 20 is continuously provided along the bottom peripheral edge 211 of the three peripheral edges 211, 212, and 213 of the rectangular notch 21, thereby The end surface 201 has a structure in which the end surface 201 is recessed from the side surface 103 of the substrate 1 toward the central portion of the substrate 1. However, the present invention is not limited to this structure, and the lead connection portion 20 is provided continuously along the peripheral edge 212. A space for inserting the covering portion 43 may be provided between the connecting portion 20 and the peripheral edge 213, or by connecting the lead connecting portion 20 along the peripheral edge 213, the space between the lead connecting portion 20 and the peripheral edge 212 may be provided. A space through which the covering portion 43 is inserted may be provided.

(Embodiment 3)
In the above-described embodiment, the configuration is such that one LED chip 2 and the recess 3 are provided on the substrate 1. However, the present invention is not limited to this, and a plurality of LED chips 2 and the recess 3 are provided on the substrate 1. You can also.

  FIG. 8 is a plan view showing an example of the structure of the light emitting device 120 according to the third embodiment. As shown in FIG. 8, the shape of the substrate 1 in plan view is rectangular, and for example, the length (length in the longitudinal direction) is about 24 mm, the width (length in the short direction) is about 15 mm, and the thickness is It is about 2 mm. In addition, the dimension of the board | substrate 1 is not limited to this.

  On the surface 101 of the substrate 1, nine concave portions 3 are formed in three rows and three columns by drawing. The concave portion 3 has, for example, a circular shape in plan view. The concave portion 3 has a circular shape in plan view for mounting the LED chip 2, and includes a mounting surface 32 parallel to the surface 101 of the substrate 1 and a curved surface 31 curved from the peripheral portion of the concave portion 3 toward the central portion. Have.

  The diameter of the recess 3 in a plan view is, for example, about 4.6 mm, and the diameter of the mounting surface 32 in a plan view is about 3.5 mm. Moreover, the depth of the recessed part 3 is about 1 mm, for example.

  The LED chip 2 is, for example, a blue LED chip that emits blue light. The shape of the LED chip 2 is about 1 mm in length and width, and about 0.1 mm in height (thickness).

  Each LED chip 2 is connected by a conductive pattern 6, and the light emitting device 120 has a configuration in which nine LED chips 2 are connected in series. Since one LED chip 2 can supply, for example, 1 W (watt) of power, the light emitting device 120 can be realized as a 9 W light source module as a whole. Since a plurality of LED chips 2 are mounted, the emission spectrum of the light emitting device 120 can be adjusted. That is, even when a white light emission color is emitted by the combination of the LED chip 2 as a blue LED and a yellow phosphor, for example, reddish white, bluish white, greenish white, etc. The light emission color can be adjusted by controlling the current value of each LED chip 2 or dimming control according to the user's preference or usage environment.

  In addition, in the example of FIG. 8, although it is the structure which mounts one LED chip 2 in one recessed part 3, it is not limited to this, For example, the three LED chips 2 can be arrange | positioned linearly. It is also possible to form three strip-shaped recesses having the dimensions of 2 in parallel, and to mount three LED chips 2 in each recess. Further, the number of LED chips 2 is not limited to nine, and may be other numbers.

(Embodiment 4)
A light-transmitting member such as glass or a lens can be attached to the light-emitting device of the above-described embodiment. FIG. 9 is a cross-sectional view illustrating an example of the structure of the light emitting device 130 according to the fourth embodiment. As shown in FIG. 9, the light emitting device 130 has a contact surface 91 that contacts the surface 101 of the substrate 1, and a translucent member having a plurality of lenses 92 that collect or diffuse the light from each LED chip 2. 9 is provided.

  Since the surface 101 of the substrate 1 including the light emitting surface is substantially the same plane (substantially flat), the light transmitting member 9 is attached to the surface 101 of the substrate 1 only by forming the contact surface 91 of the light transmitting member 9 flat. Therefore, the translucent member 9 can be easily attached as compared with the conventional case. Further, by attaching the translucent member 9 in contact with the surface 101 of the substrate 1 including the light emitting surface, oxidation or sulfuration can be prevented. The influence can be prevented. In addition, by providing the lens 92, a required light distribution characteristic can be obtained.

(Embodiment 5)
FIG. 10 is a cross-sectional view illustrating an example of the structure of the light-emitting device 140 of the fifth embodiment. As shown in FIG. 10, in the light emitting device 140, the translucent member 9 includes a peripheral portion 93 that surrounds the edge of the substrate 1 with the surface 101 of the substrate 1 in contact with the contact surface 91. Further provided is a sealing member 17 provided inside the peripheral portion 93 to seal the substrate 1 with the light transmissive member 9. For the sealing member 17, for example, packing or gasket such as fluorine rubber, silicon rubber, or synthetic rubber can be used. The sealing member 17 may cover the entire back surface 102 of the substrate 1 or may cover only the peripheral edge of the substrate 1. In order to enhance the heat dissipation effect from the substrate 1, the sealing member 17 is preferably thin.

  Since the substrate 1 is sealed by the sealing member 17 in a state where the surface 101 of the substrate 1 is in contact with the translucent member 9 having the peripheral portion 93, the substrate 1 can be waterproofed by the translucent member 9 and the sealing member 17. In addition, since gas or the like can be prevented from entering the substrate 1, the reliability of the entire light emitting device 140 can be improved. Further, in the configuration illustrated in FIG. 10, the translucent member 9 can also be used as a case.

  In the example of FIGS. 9 and 10, the translucent member 9 is configured to include the lens 92, but is not limited thereto, and is configured not to include the lens 92 (for example, a transparent glass plate, a transparent acrylic plate). Board). Further, the shape of the lens 92 is an example, and is not limited to the examples of FIGS. 9 and 10.

DESCRIPTION OF SYMBOLS 1 Board | substrate 101 Front surface 102 Back surface 2 LED chip 3 Recessed part 31 Curved surface 32 Mounting surface 4 Land 5 Connection surface 6 Conductive pattern 7 Gold wire 8 Translucent resin 81 Surface 9 Translucent member 91 Contact surface 92 Lens 93 Circumferential part 17 Sealing member 20 Lead connecting part 21 Notch 40 Covering part 41 Lead 43 Solder

Claims (9)

In a light emitting device including an LED chip,
A concave portion is formed on the surface by drawing, and a metal substrate having the LED chip mounted on the concave portion,
And a translucent resin filled in the recess so as to be substantially flush with the surface of the substrate. The recess is
The light-emitting device according to claim 1, wherein the light-emitting device has a curved surface that is curved from a peripheral portion to a central portion of the concave portion. The connecting surface for connecting the leads comprises a lead connecting part having a concave step with respect to the surface of the substrate,
3. The light emitting device according to claim 1, wherein the solder is welded to the lead connection portion so that a surface of the solder connecting the lead to the connection surface does not exceed a surface of the substrate. apparatus. The lead has a covering portion;
Provided with a notch at the edge of the substrate,
The lead connection portion is connected to the cutout portion;
The light emitting device according to claim 3, wherein the covering portion is inserted into the cutout portion and wired on the back side of the substrate.   5. The light emitting device according to claim 1, further comprising a translucent member having a contact surface that contacts the surface of the substrate. The translucent member is
A peripheral portion surrounding an edge of the substrate in a state where the surface of the substrate is in contact with the contact surface;
The light emitting device according to claim 5, further comprising a sealing member provided inside the peripheral portion so as to seal the substrate with the light transmissive member. The translucent member is
The light emitting device according to claim 5, further comprising a lens that collects or diffuses light from the LED chip. In a method for manufacturing a light emitting device including an LED chip,
Forming a recess in the surface of the metal substrate by drawing;
Attaching the LED chip to the formed recess;
Filling the concave portion in which the LED chip is mounted with a translucent resin.   The method for manufacturing a light emitting device according to claim 8, further comprising a step of cutting a part of the back surface of the substrate corresponding to a portion where the concave portion is formed.

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