JPS6284147A - エポキシ樹脂組成物 - Google Patents
エポキシ樹脂組成物Info
- Publication number
- JPS6284147A JPS6284147A JP22421085A JP22421085A JPS6284147A JP S6284147 A JPS6284147 A JP S6284147A JP 22421085 A JP22421085 A JP 22421085A JP 22421085 A JP22421085 A JP 22421085A JP S6284147 A JPS6284147 A JP S6284147A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- resin composition
- parts
- copolymer
- weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP22421085A JPS6284147A (ja) | 1985-10-07 | 1985-10-07 | エポキシ樹脂組成物 |
DE86113812T DE3689022T2 (de) | 1985-10-07 | 1986-10-06 | Epoxyharzzusammensetzung. |
EP86113812A EP0218228B1 (en) | 1985-10-07 | 1986-10-06 | Epoxy resin composition |
US07/179,538 US4877822A (en) | 1985-10-07 | 1988-04-08 | Epoxy resin composition |
US07/397,739 US5053445A (en) | 1985-10-07 | 1989-08-23 | Epoxy resin composition |
DE4006450A DE4006450A1 (de) | 1985-10-07 | 1990-03-01 | Polyimidharzmassen und damit eingekapselte halbleiterbauelemente |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP22421085A JPS6284147A (ja) | 1985-10-07 | 1985-10-07 | エポキシ樹脂組成物 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6284147A true JPS6284147A (ja) | 1987-04-17 |
JPS6360069B2 JPS6360069B2 (ko) | 1988-11-22 |
Family
ID=16810247
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP22421085A Granted JPS6284147A (ja) | 1985-10-07 | 1985-10-07 | エポキシ樹脂組成物 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6284147A (ko) |
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6320325A (ja) * | 1986-07-14 | 1988-01-28 | Toshiba Corp | 樹脂封止型半導体装置 |
JPS63114243A (ja) * | 1986-10-31 | 1988-05-19 | Nitto Electric Ind Co Ltd | 半導体装置 |
JPH0216118A (ja) * | 1988-07-05 | 1990-01-19 | Shin Etsu Chem Co Ltd | エポキシ樹脂組成物及び半導体装置 |
JPH02117958A (ja) * | 1988-07-05 | 1990-05-02 | Shin Etsu Chem Co Ltd | ポリイミド樹脂組成物及び半導体装置 |
JPH03100014A (ja) * | 1989-09-13 | 1991-04-25 | Sumitomo Bakelite Co Ltd | 半導体封止用エポキシ樹脂組成物 |
JPH03100015A (ja) * | 1989-09-13 | 1991-04-25 | Sumitomo Bakelite Co Ltd | 半導体封止用エポキシ樹脂組成物 |
US5114994A (en) * | 1990-03-23 | 1992-05-19 | Mitsubishi Denki Kabushiki Kaisha | Epoxy resin composition for sealing semiconductor |
JPH05129475A (ja) * | 1991-11-05 | 1993-05-25 | Shin Etsu Chem Co Ltd | タブ型半導体装置用封止材及びタブ型半導体装置 |
JP2007182561A (ja) * | 2005-12-08 | 2007-07-19 | Hitachi Chem Co Ltd | 電子部品用液状樹脂組成物、及びこれを用いた電子部品装置 |
JP2015061899A (ja) * | 2013-08-20 | 2015-04-02 | 信越化学工業株式会社 | オルガノシロキサン変性ノボラック樹脂及びその製造方法 |
JP2016160317A (ja) * | 2015-02-27 | 2016-09-05 | 信越化学工業株式会社 | 半導体封止用樹脂組成物及び半導体装置 |
EP3190144A1 (en) | 2016-01-07 | 2017-07-12 | Shin-Etsu Chemical Co., Ltd. | Epoxy-modified silicone resin, making method, curable composition, and electronic part |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6376923B1 (en) | 1999-06-08 | 2002-04-23 | Shin-Etsu Chemical Co., Ltd. | Flip-chip type semiconductor device sealing material and flip-chip type semiconductor device |
US6429238B1 (en) | 1999-06-10 | 2002-08-06 | Shin-Etsu Chemical Co., Ltd. | Flip-chip type semiconductor device sealing material and flip-chip type semiconductor device |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5821417A (ja) * | 1981-07-29 | 1983-02-08 | Shin Etsu Chem Co Ltd | 硬化性エポキシ樹脂組成物 |
-
1985
- 1985-10-07 JP JP22421085A patent/JPS6284147A/ja active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5821417A (ja) * | 1981-07-29 | 1983-02-08 | Shin Etsu Chem Co Ltd | 硬化性エポキシ樹脂組成物 |
Cited By (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6320325A (ja) * | 1986-07-14 | 1988-01-28 | Toshiba Corp | 樹脂封止型半導体装置 |
JPS63114243A (ja) * | 1986-10-31 | 1988-05-19 | Nitto Electric Ind Co Ltd | 半導体装置 |
JPH0216118A (ja) * | 1988-07-05 | 1990-01-19 | Shin Etsu Chem Co Ltd | エポキシ樹脂組成物及び半導体装置 |
JPH02117958A (ja) * | 1988-07-05 | 1990-05-02 | Shin Etsu Chem Co Ltd | ポリイミド樹脂組成物及び半導体装置 |
JPH03100014A (ja) * | 1989-09-13 | 1991-04-25 | Sumitomo Bakelite Co Ltd | 半導体封止用エポキシ樹脂組成物 |
JPH03100015A (ja) * | 1989-09-13 | 1991-04-25 | Sumitomo Bakelite Co Ltd | 半導体封止用エポキシ樹脂組成物 |
US5114994A (en) * | 1990-03-23 | 1992-05-19 | Mitsubishi Denki Kabushiki Kaisha | Epoxy resin composition for sealing semiconductor |
JPH05129475A (ja) * | 1991-11-05 | 1993-05-25 | Shin Etsu Chem Co Ltd | タブ型半導体装置用封止材及びタブ型半導体装置 |
JP2007182561A (ja) * | 2005-12-08 | 2007-07-19 | Hitachi Chem Co Ltd | 電子部品用液状樹脂組成物、及びこれを用いた電子部品装置 |
JP2015061899A (ja) * | 2013-08-20 | 2015-04-02 | 信越化学工業株式会社 | オルガノシロキサン変性ノボラック樹脂及びその製造方法 |
JP2016160317A (ja) * | 2015-02-27 | 2016-09-05 | 信越化学工業株式会社 | 半導体封止用樹脂組成物及び半導体装置 |
EP3190144A1 (en) | 2016-01-07 | 2017-07-12 | Shin-Etsu Chemical Co., Ltd. | Epoxy-modified silicone resin, making method, curable composition, and electronic part |
KR20170082972A (ko) | 2016-01-07 | 2017-07-17 | 신에쓰 가가꾸 고교 가부시끼가이샤 | 에폭시 변성 실리콘 수지 및 그 제조 방법, 경화성 조성물 및 전자 부품 |
US9896550B2 (en) | 2016-01-07 | 2018-02-20 | Shin-Etsu Chemical Co., Ltd. | Epoxy-modified silicone resin, making method, curable composition, and electronic part |
Also Published As
Publication number | Publication date |
---|---|
JPS6360069B2 (ko) | 1988-11-22 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
EXPY | Cancellation because of completion of term |