JPS6276659A - 樹脂封止型半導体装置 - Google Patents

樹脂封止型半導体装置

Info

Publication number
JPS6276659A
JPS6276659A JP60214852A JP21485285A JPS6276659A JP S6276659 A JPS6276659 A JP S6276659A JP 60214852 A JP60214852 A JP 60214852A JP 21485285 A JP21485285 A JP 21485285A JP S6276659 A JPS6276659 A JP S6276659A
Authority
JP
Japan
Prior art keywords
resin
semiconductor device
resin sealing
sealing part
sealed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60214852A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0357623B2 (en, 2012
Inventor
Hiroshi Matsumoto
博 松本
Takao Emoto
江本　孝朗
Toshihiro Kato
加藤　俊博
Shinjiro Kojima
小島　伸次郎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP60214852A priority Critical patent/JPS6276659A/ja
Priority to DE8686304725T priority patent/DE3684184D1/de
Priority to EP86304725A priority patent/EP0206771B1/en
Priority to KR1019860006270A priority patent/KR900001668B1/ko
Publication of JPS6276659A publication Critical patent/JPS6276659A/ja
Priority to US07/334,771 priority patent/US4924351A/en
Publication of JPH0357623B2 publication Critical patent/JPH0357623B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49503—Lead-frames or other flat leads characterised by the die pad
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49575—Assemblies of semiconductor devices on lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP60214852A 1985-06-20 1985-09-30 樹脂封止型半導体装置 Granted JPS6276659A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP60214852A JPS6276659A (ja) 1985-09-30 1985-09-30 樹脂封止型半導体装置
DE8686304725T DE3684184D1 (de) 1985-06-20 1986-06-19 Verkapselte halbleiteranordnung.
EP86304725A EP0206771B1 (en) 1985-06-20 1986-06-19 Packaged semiconductor device
KR1019860006270A KR900001668B1 (ko) 1985-09-30 1986-07-30 수지봉합형 반도체장치
US07/334,771 US4924351A (en) 1985-06-20 1989-04-10 Recessed thermally conductive packaged semiconductor devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60214852A JPS6276659A (ja) 1985-09-30 1985-09-30 樹脂封止型半導体装置

Publications (2)

Publication Number Publication Date
JPS6276659A true JPS6276659A (ja) 1987-04-08
JPH0357623B2 JPH0357623B2 (en, 2012) 1991-09-02

Family

ID=16662612

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60214852A Granted JPS6276659A (ja) 1985-06-20 1985-09-30 樹脂封止型半導体装置

Country Status (2)

Country Link
JP (1) JPS6276659A (en, 2012)
KR (1) KR900001668B1 (en, 2012)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5446317A (en) * 1992-03-09 1995-08-29 Fujitsu Limited Single in-line package for surface mounting

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5446317A (en) * 1992-03-09 1995-08-29 Fujitsu Limited Single in-line package for surface mounting
US5728601A (en) * 1992-03-09 1998-03-17 Fujitsu Limited Process for manufacturing a single in-line package for surface mounting

Also Published As

Publication number Publication date
JPH0357623B2 (en, 2012) 1991-09-02
KR870003559A (ko) 1987-04-18
KR900001668B1 (ko) 1990-03-17

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term