JPS6265954A - アルミナ封着用硼珪酸ガラス - Google Patents

アルミナ封着用硼珪酸ガラス

Info

Publication number
JPS6265954A
JPS6265954A JP60205850A JP20585085A JPS6265954A JP S6265954 A JPS6265954 A JP S6265954A JP 60205850 A JP60205850 A JP 60205850A JP 20585085 A JP20585085 A JP 20585085A JP S6265954 A JPS6265954 A JP S6265954A
Authority
JP
Japan
Prior art keywords
glass
alumina
thermal expansion
sealing
borosilicate glass
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60205850A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0210099B2 (enExample
Inventor
Yukinobu Imamura
今村　行延
Shigeru Yamamoto
茂 山本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Electric Glass Co Ltd
Original Assignee
Nippon Electric Glass Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Glass Co Ltd filed Critical Nippon Electric Glass Co Ltd
Priority to JP60205850A priority Critical patent/JPS6265954A/ja
Publication of JPS6265954A publication Critical patent/JPS6265954A/ja
Publication of JPH0210099B2 publication Critical patent/JPH0210099B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/15—Ceramic or glass substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Glass Compositions (AREA)
JP60205850A 1985-09-18 1985-09-18 アルミナ封着用硼珪酸ガラス Granted JPS6265954A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60205850A JPS6265954A (ja) 1985-09-18 1985-09-18 アルミナ封着用硼珪酸ガラス

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60205850A JPS6265954A (ja) 1985-09-18 1985-09-18 アルミナ封着用硼珪酸ガラス

Publications (2)

Publication Number Publication Date
JPS6265954A true JPS6265954A (ja) 1987-03-25
JPH0210099B2 JPH0210099B2 (enExample) 1990-03-06

Family

ID=16513742

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60205850A Granted JPS6265954A (ja) 1985-09-18 1985-09-18 アルミナ封着用硼珪酸ガラス

Country Status (1)

Country Link
JP (1) JPS6265954A (enExample)

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01239036A (ja) * 1988-03-16 1989-09-25 F G K:Kk 高強度ガラス
JPH01320236A (ja) * 1988-06-22 1989-12-26 Toshiba Glass Co Ltd 固体撮像素子用カバーガラス
JPH03167861A (ja) * 1989-11-27 1991-07-19 Kyocera Corp 半導体素子収納用パッケージ
JPH03167847A (ja) * 1989-11-27 1991-07-19 Kyocera Corp 半導体素子収納用パッケージ
JPH03167845A (ja) * 1989-11-27 1991-07-19 Kyocera Corp 半導体素子収納用パッケージ
JPH03167865A (ja) * 1989-11-27 1991-07-19 Kyocera Corp 半導体素子収納用パッケージ
JPH03167859A (ja) * 1989-11-27 1991-07-19 Kyocera Corp 半導体素子収納用パッケージ
JPH03167858A (ja) * 1989-11-27 1991-07-19 Kyocera Corp 半導体素子収納用パッケージ
JPH03167846A (ja) * 1989-11-27 1991-07-19 Kyocera Corp 半導体素子収納用パッケージ
JPH03167862A (ja) * 1989-11-27 1991-07-19 Kyocera Corp 半導体素子収納用パッケージ
JPH03167863A (ja) * 1989-11-27 1991-07-19 Kyocera Corp 半導体素子収納用パッケージ
JPH03173161A (ja) * 1989-11-30 1991-07-26 Kyocera Corp 半導体素子収納用パッケージ
JPH03173160A (ja) * 1989-11-30 1991-07-26 Kyocera Corp 半導体素子収納用パッケージ
JPH03173156A (ja) * 1989-11-30 1991-07-26 Kyocera Corp 半導体素子収納用パッケージ
JPH03173157A (ja) * 1989-11-30 1991-07-26 Kyocera Corp 半導体素子収納用パッケージ
US5277946A (en) * 1989-08-24 1994-01-11 Nippon Electric Glass Co., Ltd. Alumina package for hermetically containing an electronic device therein
JP2005162600A (ja) * 2003-11-11 2005-06-23 Nippon Electric Glass Co Ltd 半導体パッケージ用カバーガラス
CN113735438A (zh) * 2021-09-23 2021-12-03 成都光明光电股份有限公司 玻璃组合物

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01239036A (ja) * 1988-03-16 1989-09-25 F G K:Kk 高強度ガラス
JPH01320236A (ja) * 1988-06-22 1989-12-26 Toshiba Glass Co Ltd 固体撮像素子用カバーガラス
US5277946A (en) * 1989-08-24 1994-01-11 Nippon Electric Glass Co., Ltd. Alumina package for hermetically containing an electronic device therein
JPH03167846A (ja) * 1989-11-27 1991-07-19 Kyocera Corp 半導体素子収納用パッケージ
JPH03167863A (ja) * 1989-11-27 1991-07-19 Kyocera Corp 半導体素子収納用パッケージ
JPH03167865A (ja) * 1989-11-27 1991-07-19 Kyocera Corp 半導体素子収納用パッケージ
JPH03167859A (ja) * 1989-11-27 1991-07-19 Kyocera Corp 半導体素子収納用パッケージ
JPH03167858A (ja) * 1989-11-27 1991-07-19 Kyocera Corp 半導体素子収納用パッケージ
JPH03167847A (ja) * 1989-11-27 1991-07-19 Kyocera Corp 半導体素子収納用パッケージ
JPH03167862A (ja) * 1989-11-27 1991-07-19 Kyocera Corp 半導体素子収納用パッケージ
JPH03167845A (ja) * 1989-11-27 1991-07-19 Kyocera Corp 半導体素子収納用パッケージ
JPH03167861A (ja) * 1989-11-27 1991-07-19 Kyocera Corp 半導体素子収納用パッケージ
JPH03173160A (ja) * 1989-11-30 1991-07-26 Kyocera Corp 半導体素子収納用パッケージ
JPH03173156A (ja) * 1989-11-30 1991-07-26 Kyocera Corp 半導体素子収納用パッケージ
JPH03173157A (ja) * 1989-11-30 1991-07-26 Kyocera Corp 半導体素子収納用パッケージ
JPH03173161A (ja) * 1989-11-30 1991-07-26 Kyocera Corp 半導体素子収納用パッケージ
JP2005162600A (ja) * 2003-11-11 2005-06-23 Nippon Electric Glass Co Ltd 半導体パッケージ用カバーガラス
CN113735438A (zh) * 2021-09-23 2021-12-03 成都光明光电股份有限公司 玻璃组合物

Also Published As

Publication number Publication date
JPH0210099B2 (enExample) 1990-03-06

Similar Documents

Publication Publication Date Title
JPS6265954A (ja) アルミナ封着用硼珪酸ガラス
US4186023A (en) Sealing glass composition
US4994415A (en) SiO2 -Al2 O3 -BaO glass substrates with improved chemical resistance for use in display panels and others having thin films
JP2871163B2 (ja) 無アルカリガラス
JP2966207B2 (ja) フラットパネルディスプレー装置
JP5458893B2 (ja) ガラス、発光装置用の被覆材および発光装置
US6313052B1 (en) Glass for a substrate
JP3951514B2 (ja) シリカリン酸スズ系ガラス及び封着材料
JP2001072433A (ja) 陽極接合用ガラス
JPH05193980A (ja) 高アルミナ、アルカリ土類ホウケイ酸塩ガラスを含むフラットパネル表示装置
US3907535A (en) Process of making a partially crystallizable seal
US4710479A (en) Sealing glass composition with lead calcium titanate filler
US4537863A (en) Low temperature sealing composition
US3535133A (en) Alkali-free electronic glass and method of manufacture
EP0045359B1 (en) Sealing glass composition
JPH07237933A (ja) パッケージ用ガラス及びその製造方法
SU1565344A3 (ru) Способ получени припоечного боросвинцового стекла
JPH07126037A (ja) 接着・封止用ガラス
JP4132119B2 (ja) 耐熱性ガラス
JP4425386B2 (ja) 低融点ガラスおよび封着用組成物
JPH07330372A (ja) 低融点ガラス
JP3519121B2 (ja) 封着用組成物
US4246034A (en) Devitrifying solder sealing glasses
EP0156526B1 (en) Low pbo - containing glass for electrical devices
WILLIAMS et al. A note on the effect of lithium oxide upon the surface tension of several silicate melts