JPS6258655B2 - - Google Patents

Info

Publication number
JPS6258655B2
JPS6258655B2 JP16097382A JP16097382A JPS6258655B2 JP S6258655 B2 JPS6258655 B2 JP S6258655B2 JP 16097382 A JP16097382 A JP 16097382A JP 16097382 A JP16097382 A JP 16097382A JP S6258655 B2 JPS6258655 B2 JP S6258655B2
Authority
JP
Japan
Prior art keywords
resin
mold
thickness
pusher
plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP16097382A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5950534A (ja
Inventor
Shozo Nakamura
Susumu Tsujiku
Masao Goto
Ataru Yokono
Hajime Murakami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP16097382A priority Critical patent/JPS5950534A/ja
Publication of JPS5950534A publication Critical patent/JPS5950534A/ja
Publication of JPS6258655B2 publication Critical patent/JPS6258655B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/0055—Moulds or cores; Details thereof or accessories therefor with incorporated overflow cavities
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3406—Components, e.g. resistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP16097382A 1982-09-17 1982-09-17 半導体の樹脂封止方法 Granted JPS5950534A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16097382A JPS5950534A (ja) 1982-09-17 1982-09-17 半導体の樹脂封止方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16097382A JPS5950534A (ja) 1982-09-17 1982-09-17 半導体の樹脂封止方法

Publications (2)

Publication Number Publication Date
JPS5950534A JPS5950534A (ja) 1984-03-23
JPS6258655B2 true JPS6258655B2 (de) 1987-12-07

Family

ID=15726152

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16097382A Granted JPS5950534A (ja) 1982-09-17 1982-09-17 半導体の樹脂封止方法

Country Status (1)

Country Link
JP (1) JPS5950534A (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW325744U (en) * 1993-07-21 1998-01-21 Ciba Geigy Ag Two-sided contact lens mold
JP5235312B2 (ja) * 2007-02-22 2013-07-10 サンデン株式会社 インバータ一体型電動圧縮機の製造方法
JP5247045B2 (ja) * 2007-02-22 2013-07-24 サンデン株式会社 インバータ一体型電動圧縮機の製造方法
JP2008202566A (ja) * 2007-02-22 2008-09-04 Sanden Corp インバータ一体型電動圧縮機
JP6398399B2 (ja) * 2013-09-06 2018-10-03 富士電機株式会社 半導体装置およびその製造方法

Also Published As

Publication number Publication date
JPS5950534A (ja) 1984-03-23

Similar Documents

Publication Publication Date Title
US7037756B1 (en) Stacked microelectronic devices and methods of fabricating same
US7517722B2 (en) Method of producing a universal semiconductor housing with precrosslinked plastic embedding compounds
TW495725B (en) Method of manufacturing COF package
US7960209B2 (en) Semiconductor device assembly process
US20090093088A1 (en) Roll-on encapsulation method for semiconductor packages
TW546790B (en) Semiconductor package having a resin cap member
CN206301777U (zh) 半导体封装件
TW202036812A (zh) 半導體裝置封裝方法及半導體裝置
JPS6258655B2 (de)
JPS5848442A (ja) 電子部品の封止方法
JPH10135254A (ja) 半導体装置の製造方法及び半導体装置
JP2002270627A (ja) 半導体装置の製造方法
JPS58182837A (ja) 樹脂封止半導体装置の製造方法
JPH0434958A (ja) 樹脂封止型半導体装置およびその製造方法
JP2932995B2 (ja) 半導体装置の製造方法と半導体素子実装用基板保持具
JP2010147033A (ja) フリップチップ実装方法とフリップチップ実装装置
JPH04302457A (ja) 混成集積回路基板の製造方法
JPS61113243A (ja) 混成集積回路の実装方法
JPS5887834A (ja) 半導体装置の樹脂封止方法
JPH04280459A (ja) 樹脂封止型半導体装置
TW511258B (en) Substrate-on-chip packaging process
JPS6292331A (ja) 半導体チツプの封止方法
JPH03284857A (ja) 半導体装置の製造方法
JPH11259621A (ja) Ｉｃモジュールの製造方法及びｉｃモジュール
JPH0327541A (ja) 半導体装置の製造方法