JPS6257106B2 - - Google Patents
Info
- Publication number
- JPS6257106B2 JPS6257106B2 JP55175608A JP17560880A JPS6257106B2 JP S6257106 B2 JPS6257106 B2 JP S6257106B2 JP 55175608 A JP55175608 A JP 55175608A JP 17560880 A JP17560880 A JP 17560880A JP S6257106 B2 JPS6257106 B2 JP S6257106B2
- Authority
- JP
- Japan
- Prior art keywords
- coating layer
- aluminum coating
- lead frame
- etching
- base material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910052782 aluminium Inorganic materials 0.000 claims description 47
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 47
- 239000011247 coating layer Substances 0.000 claims description 30
- 238000000034 method Methods 0.000 claims description 29
- 238000005530 etching Methods 0.000 claims description 27
- 239000000463 material Substances 0.000 claims description 24
- 239000007788 liquid Substances 0.000 claims description 14
- 230000000873 masking effect Effects 0.000 claims description 13
- 238000004519 manufacturing process Methods 0.000 claims description 9
- 238000005253 cladding Methods 0.000 claims description 6
- 238000007740 vapor deposition Methods 0.000 claims description 6
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- 238000005507 spraying Methods 0.000 claims description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 4
- 239000007864 aqueous solution Substances 0.000 description 4
- 239000010410 layer Substances 0.000 description 4
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 239000007921 spray Substances 0.000 description 3
- 229910000990 Ni alloy Inorganic materials 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000010970 precious metal Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 238000003486 chemical etching Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 238000011978 dissolution method Methods 0.000 description 1
- 238000000866 electrolytic etching Methods 0.000 description 1
- 229910000833 kovar Inorganic materials 0.000 description 1
- 238000007645 offset printing Methods 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 235000011121 sodium hydroxide Nutrition 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
- H01L21/4828—Etching
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17560880A JPS5799763A (en) | 1980-12-12 | 1980-12-12 | Manufacture of lead frame for integrated circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17560880A JPS5799763A (en) | 1980-12-12 | 1980-12-12 | Manufacture of lead frame for integrated circuit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5799763A JPS5799763A (en) | 1982-06-21 |
| JPS6257106B2 true JPS6257106B2 (US07582779-20090901-C00044.png) | 1987-11-30 |
Family
ID=15999063
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17560880A Granted JPS5799763A (en) | 1980-12-12 | 1980-12-12 | Manufacture of lead frame for integrated circuit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5799763A (US07582779-20090901-C00044.png) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6372889A (ja) * | 1986-09-12 | 1988-04-02 | Showa Alum Corp | リ−ドフレ−ムの製造方法 |
| JPS63160367A (ja) * | 1986-12-24 | 1988-07-04 | Hitachi Ltd | 樹脂封止型半導体装置 |
| DE10348715B4 (de) | 2003-10-16 | 2006-05-04 | Infineon Technologies Ag | Verfahren zum Herstellen eines Flachleiterrahmens mit verbesserter Haftung zwischen diesem und Kunststoff sowie Flachleiterrahmen |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4952976A (US07582779-20090901-C00044.png) * | 1972-09-22 | 1974-05-23 | ||
| JPS553642A (en) * | 1978-06-23 | 1980-01-11 | Hitachi Ltd | Manufacturing semiconductor device |
-
1980
- 1980-12-12 JP JP17560880A patent/JPS5799763A/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4952976A (US07582779-20090901-C00044.png) * | 1972-09-22 | 1974-05-23 | ||
| JPS553642A (en) * | 1978-06-23 | 1980-01-11 | Hitachi Ltd | Manufacturing semiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5799763A (en) | 1982-06-21 |
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