JPS6256610B2 - - Google Patents
Info
- Publication number
- JPS6256610B2 JPS6256610B2 JP18229181A JP18229181A JPS6256610B2 JP S6256610 B2 JPS6256610 B2 JP S6256610B2 JP 18229181 A JP18229181 A JP 18229181A JP 18229181 A JP18229181 A JP 18229181A JP S6256610 B2 JPS6256610 B2 JP S6256610B2
- Authority
- JP
- Japan
- Prior art keywords
- mica
- heat
- laminated
- synthetic resin
- aluminum hydroxide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000010445 mica Substances 0.000 claims description 25
- 229910052618 mica group Inorganic materials 0.000 claims description 25
- 229920003002 synthetic resin Polymers 0.000 claims description 11
- 239000000057 synthetic resin Substances 0.000 claims description 11
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 claims description 10
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 7
- 239000012212 insulator Substances 0.000 claims description 6
- 238000003776 cleavage reaction Methods 0.000 claims description 2
- 230000007017 scission Effects 0.000 claims description 2
- 229920006015 heat resistant resin Polymers 0.000 claims 1
- 238000010030 laminating Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- XPNGNIFUDRPBFJ-UHFFFAOYSA-N (2-methylphenyl)methanol Chemical compound CC1=CC=CC=C1CO XPNGNIFUDRPBFJ-UHFFFAOYSA-N 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 238000003763 carbonization Methods 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
Landscapes
- Inorganic Insulating Materials (AREA)
- Insulating Bodies (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18229181A JPS5885212A (ja) | 1981-11-16 | 1981-11-16 | 耐ア−ク性のマイカ絶縁体 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18229181A JPS5885212A (ja) | 1981-11-16 | 1981-11-16 | 耐ア−ク性のマイカ絶縁体 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5885212A JPS5885212A (ja) | 1983-05-21 |
| JPS6256610B2 true JPS6256610B2 (enrdf_load_stackoverflow) | 1987-11-26 |
Family
ID=16115708
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18229181A Granted JPS5885212A (ja) | 1981-11-16 | 1981-11-16 | 耐ア−ク性のマイカ絶縁体 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5885212A (enrdf_load_stackoverflow) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0337907A (ja) * | 1989-07-03 | 1991-02-19 | Nippon Rika Kogyosho:Kk | 集成マイカ絶縁薄膜 |
-
1981
- 1981-11-16 JP JP18229181A patent/JPS5885212A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5885212A (ja) | 1983-05-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US3694699A (en) | Ceramic based substrates for electronic circuits with improved heat dissipating properties and circuits including the same | |
| JPS6256610B2 (enrdf_load_stackoverflow) | ||
| JPH0355203Y2 (enrdf_load_stackoverflow) | ||
| JPS6352496A (ja) | 回路用基板 | |
| JPS58213493A (ja) | 電気絶縁基板 | |
| JPS6325161Y2 (enrdf_load_stackoverflow) | ||
| JP2708821B2 (ja) | 電気用積層板 | |
| JPH02130146A (ja) | 電気用積層板 | |
| JPS60136298A (ja) | 多層配線板 | |
| JPS6226887Y2 (enrdf_load_stackoverflow) | ||
| CN209151421U (zh) | 一种电路板用导电双面胶 | |
| JPS6325160Y2 (enrdf_load_stackoverflow) | ||
| JP2621585B2 (ja) | 面ヒータおよびその製造法 | |
| JP2621584B2 (ja) | 面ヒータ | |
| JPH03192679A (ja) | 面状発熱体およびその製造法 | |
| JPS612290A (ja) | 面状ヒ−タ | |
| JPH01248685A (ja) | 片面金属箔張積層板の製造法および片面印刷回路板の製造法 | |
| JPS5837988A (ja) | 電気絶縁基板 | |
| JPS6256679B2 (enrdf_load_stackoverflow) | ||
| JP2510257Y2 (ja) | 耐熱絶縁板 | |
| JP2923343B2 (ja) | 電気用積層板の製造方法 | |
| JPS63270133A (ja) | 回路用基板 | |
| JPH0476298B2 (enrdf_load_stackoverflow) | ||
| CN118741780A (zh) | 石墨烯加热膜组件和烹饪设备 | |
| JP2586635B2 (ja) | 面ヒータの製造法 |