JPS6255717B2 - - Google Patents
Info
- Publication number
- JPS6255717B2 JPS6255717B2 JP16005179A JP16005179A JPS6255717B2 JP S6255717 B2 JPS6255717 B2 JP S6255717B2 JP 16005179 A JP16005179 A JP 16005179A JP 16005179 A JP16005179 A JP 16005179A JP S6255717 B2 JPS6255717 B2 JP S6255717B2
- Authority
- JP
- Japan
- Prior art keywords
- board
- sub
- substrate
- resin
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000758 substrate Substances 0.000 claims description 112
- 239000004840 adhesive resin Substances 0.000 claims description 42
- 229920006223 adhesive resin Polymers 0.000 claims description 42
- 239000000463 material Substances 0.000 claims description 35
- 238000000034 method Methods 0.000 claims description 28
- 238000004519 manufacturing process Methods 0.000 claims description 8
- 239000002131 composite material Substances 0.000 description 70
- 229920005989 resin Polymers 0.000 description 48
- 239000011347 resin Substances 0.000 description 48
- 230000008569 process Effects 0.000 description 20
- 229910000679 solder Inorganic materials 0.000 description 20
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 16
- 229910052782 aluminium Inorganic materials 0.000 description 16
- 239000000853 adhesive Substances 0.000 description 14
- 230000001070 adhesive effect Effects 0.000 description 14
- 238000007639 printing Methods 0.000 description 11
- 238000012545 processing Methods 0.000 description 9
- 239000010410 layer Substances 0.000 description 8
- 239000005011 phenolic resin Substances 0.000 description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
- 239000011889 copper foil Substances 0.000 description 7
- 229920001568 phenolic resin Polymers 0.000 description 7
- 239000011253 protective coating Substances 0.000 description 7
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 6
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 6
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 6
- 230000017525 heat dissipation Effects 0.000 description 6
- 239000011521 glass Substances 0.000 description 5
- 238000004080 punching Methods 0.000 description 5
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 4
- 239000003990 capacitor Substances 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 4
- 238000000016 photochemical curing Methods 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- 229920001187 thermosetting polymer Polymers 0.000 description 4
- 238000012546 transfer Methods 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 3
- 238000007598 dipping method Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229910052742 iron Inorganic materials 0.000 description 3
- 238000007650 screen-printing Methods 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 2
- 230000003321 amplification Effects 0.000 description 2
- 238000001723 curing Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000010304 firing Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000003199 nucleic acid amplification method Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- IDCBOTIENDVCBQ-UHFFFAOYSA-N TEPP Chemical compound CCOP(=O)(OCC)OP(=O)(OCC)OCC IDCBOTIENDVCBQ-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920006254 polymer film Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000001568 sexual effect Effects 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
- Combinations Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16005179A JPS5683091A (en) | 1979-12-10 | 1979-12-10 | Method of manufacturing hybrid integrated circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16005179A JPS5683091A (en) | 1979-12-10 | 1979-12-10 | Method of manufacturing hybrid integrated circuit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5683091A JPS5683091A (en) | 1981-07-07 |
| JPS6255717B2 true JPS6255717B2 (ko) | 1987-11-20 |
Family
ID=15706848
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16005179A Granted JPS5683091A (en) | 1979-12-10 | 1979-12-10 | Method of manufacturing hybrid integrated circuit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5683091A (ko) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008263225A (ja) * | 2008-07-07 | 2008-10-30 | Dainippon Printing Co Ltd | プリント配線板の製造装置 |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5689278U (ko) * | 1979-12-10 | 1981-07-16 | ||
| JPS58137297A (ja) * | 1982-02-09 | 1983-08-15 | 日本電気ホームエレクトロニクス株式会社 | 高周波回路の配線方法 |
| JP2006139316A (ja) * | 2006-02-10 | 2006-06-01 | Ushio Inc | 原稿読み取り用光源装置 |
| JP5099064B2 (ja) * | 2009-04-07 | 2012-12-12 | パナソニック株式会社 | 電子部品実装システムおよび電子部品実装方法 |
-
1979
- 1979-12-10 JP JP16005179A patent/JPS5683091A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008263225A (ja) * | 2008-07-07 | 2008-10-30 | Dainippon Printing Co Ltd | プリント配線板の製造装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5683091A (en) | 1981-07-07 |
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