JPS6255687B2 - - Google Patents

Info

Publication number
JPS6255687B2
JPS6255687B2 JP55140464A JP14046480A JPS6255687B2 JP S6255687 B2 JPS6255687 B2 JP S6255687B2 JP 55140464 A JP55140464 A JP 55140464A JP 14046480 A JP14046480 A JP 14046480A JP S6255687 B2 JPS6255687 B2 JP S6255687B2
Authority
JP
Japan
Prior art keywords
inspection
electronic component
lead frame
protrusions
section
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP55140464A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5764946A (en
Inventor
Hiroyuki Nakajima
Mutsuyo Kanetani
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP55140464A priority Critical patent/JPS5764946A/ja
Publication of JPS5764946A publication Critical patent/JPS5764946A/ja
Publication of JPS6255687B2 publication Critical patent/JPS6255687B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP55140464A 1980-10-09 1980-10-09 Inspecting method for electric characteristics of electronic parts and device used therefor as well as electronic parts Granted JPS5764946A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55140464A JPS5764946A (en) 1980-10-09 1980-10-09 Inspecting method for electric characteristics of electronic parts and device used therefor as well as electronic parts

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55140464A JPS5764946A (en) 1980-10-09 1980-10-09 Inspecting method for electric characteristics of electronic parts and device used therefor as well as electronic parts

Publications (2)

Publication Number Publication Date
JPS5764946A JPS5764946A (en) 1982-04-20
JPS6255687B2 true JPS6255687B2 (enrdf_load_stackoverflow) 1987-11-20

Family

ID=15269201

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55140464A Granted JPS5764946A (en) 1980-10-09 1980-10-09 Inspecting method for electric characteristics of electronic parts and device used therefor as well as electronic parts

Country Status (1)

Country Link
JP (1) JPS5764946A (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05152388A (ja) * 1991-11-28 1993-06-18 Sharp Corp 半導体集積回路装置の検査装置

Also Published As

Publication number Publication date
JPS5764946A (en) 1982-04-20

Similar Documents

Publication Publication Date Title
KR100206644B1 (ko) 반도체 디바이스의 자동검사장치 및 방법
CN208288471U (zh) 一种汽车led材料的自动测试分选装置
CN211593186U (zh) 一种在线点料计数机
CN109742635A (zh) 一种smt贴片连接器全自动装配工艺
KR100339174B1 (ko) 검사 장치 및 방법
KR20100098884A (ko) 엘이디 패키지 제조용 스트립 검사장치
JPS6255687B2 (enrdf_load_stackoverflow)
CN110877017A (zh) 一种电源变压器生产测试监控方法
US6128074A (en) Method and apparatus for inspection of pin grid array packages for bent leads
JPS6317225B2 (enrdf_load_stackoverflow)
JPH06124981A (ja) 半導体装置の製造方法
GB2148865A (en) Automated burn-in board unloader and IC package sorter
US4222488A (en) Methods and apparatus for sorting articles
JPH06281698A (ja) Ｉｃオートハンドラ方法
US4573934A (en) System for identifying envelopes having excessive panel-funnel offset and dispensing articles
JPS6034030A (ja) Ｉｃオ−トハンドラ装置及びｉｃオ−トハンドラ方法
JPS5923423Y2 (ja) リ−ドの曲がつたｉｃの検出排除装置
JPS6222739B2 (enrdf_load_stackoverflow)
JP3507850B2 (ja) ペレットの端詰め回収装置
JPS6240434Y2 (enrdf_load_stackoverflow)
JPS6167299A (ja) 電子部品の打抜き収納装置
JPH06201777A (ja) Ｉｃハンドラ
CN116399426A (zh) 一种土工布全自动检测系统
CN117047459A (zh) 全自动圆盘式探针组装机
CN116174338A (zh) 一种汽轮机叶片智能分选装备及方法