JPS6250219B2 - - Google Patents
Info
- Publication number
- JPS6250219B2 JPS6250219B2 JP9994480A JP9994480A JPS6250219B2 JP S6250219 B2 JPS6250219 B2 JP S6250219B2 JP 9994480 A JP9994480 A JP 9994480A JP 9994480 A JP9994480 A JP 9994480A JP S6250219 B2 JPS6250219 B2 JP S6250219B2
- Authority
- JP
- Japan
- Prior art keywords
- station
- workpiece
- flux
- cleaning
- section
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 230000004907 flux Effects 0.000 claims description 39
- 238000004140 cleaning Methods 0.000 claims description 29
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 29
- 238000005476 soldering Methods 0.000 claims description 26
- 229910000679 solder Inorganic materials 0.000 claims description 21
- 238000005406 washing Methods 0.000 claims description 9
- 238000004506 ultrasonic cleaning Methods 0.000 claims description 7
- 238000000861 blow drying Methods 0.000 claims description 6
- 239000007788 liquid Substances 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 3
- 238000001514 detection method Methods 0.000 description 4
- 239000002245 particle Substances 0.000 description 3
- 239000007921 spray Substances 0.000 description 2
- 238000011109 contamination Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
Landscapes
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9994480A JPS5725279A (en) | 1980-07-23 | 1980-07-23 | Soldering apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9994480A JPS5725279A (en) | 1980-07-23 | 1980-07-23 | Soldering apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5725279A JPS5725279A (en) | 1982-02-10 |
| JPS6250219B2 true JPS6250219B2 (enrdf_load_html_response) | 1987-10-23 |
Family
ID=14260811
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9994480A Granted JPS5725279A (en) | 1980-07-23 | 1980-07-23 | Soldering apparatus |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5725279A (enrdf_load_html_response) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05230815A (ja) * | 1992-02-21 | 1993-09-07 | Ube Ind Ltd | 除塵装置 |
| JPH05311628A (ja) * | 1992-05-12 | 1993-11-22 | Ube Ind Ltd | 除塵装置 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112053819B (zh) * | 2020-09-02 | 2021-11-23 | 杭州瞳阳科技有限公司 | 一种基于贴片电子元器件的生产线 |
-
1980
- 1980-07-23 JP JP9994480A patent/JPS5725279A/ja active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05230815A (ja) * | 1992-02-21 | 1993-09-07 | Ube Ind Ltd | 除塵装置 |
| JPH05311628A (ja) * | 1992-05-12 | 1993-11-22 | Ube Ind Ltd | 除塵装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5725279A (en) | 1982-02-10 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR100365078B1 (ko) | 도포방법및도포장치 | |
| WO2004046418A1 (ja) | 基板処理装置及び基板処理方法 | |
| US5865894A (en) | Megasonic plating system | |
| US6112355A (en) | Overflow scrub-washing method and apparatus | |
| JPS6250219B2 (enrdf_load_html_response) | ||
| JPH03231428A (ja) | 半導体ウエハの洗浄方法 | |
| JP2886157B1 (ja) | カップ式めっき方法及びそれに用いる清浄装置 | |
| US6637641B1 (en) | Systems and methods for manufacturing a circuit board | |
| JP4028406B2 (ja) | 現像処理方法及び現像処理装置 | |
| JPH0957223A (ja) | 部品洗浄装置 | |
| JP3453022B2 (ja) | 現像装置 | |
| JPH11169802A (ja) | 電子部品洗浄方法および電子部品洗浄装置 | |
| JPS60168154A (ja) | 塗布による電子写真感光体の製造方法および製造装置 | |
| JPH0142504B2 (enrdf_load_html_response) | ||
| JPS6188531A (ja) | 集積回路装置の洗浄装置 | |
| JPH118192A (ja) | 処理装置および処理方法 | |
| JPS63221625A (ja) | 半導体ウエハの洗浄方法 | |
| JP2508445B2 (ja) | 粘性液体供給装置 | |
| JPH09327644A (ja) | 液剤塗布装置及び方法 | |
| JP3474668B2 (ja) | 塗装装置 | |
| JPH01194323A (ja) | 現像装置 | |
| JP2908157B2 (ja) | 回路基板のエッチング方法およびエッチング装置 | |
| JP3215366B2 (ja) | 電子部品洗浄装置 | |
| JPH06151405A (ja) | 基板乾燥方法 | |
| KR0132530B1 (ko) | 캐치 컵 |