JPS6250219B2 - - Google Patents

Description

[Detailed description of the invention] The present invention relates to a soldering device.

When electronic components are completed, their external terminals, or leads, are generally soldered to improve solderability and appearance. Soldering to the leads is performed using, for example, a soldering device shown in FIG. That is, the electronic component (work) 1 is supported and rotated at the tip of the support arm mechanism 3 attached to the rotary table 2 every 60 degrees. The rotary table 2 sequentially and intermittently rotates a loader station 4, a flux application station 5, a soldering station 6, a solder curing station 7, a cleaning station 8, and an unloader station 9. As shown in FIG. 2, the flux application station 5 is provided with a flux tank 10 having a jet type structure, and the lead 11 of the workpiece 1 is exposed to the jet part 14 of the flux liquid 13 which is raised by the rotation of the fan 12. Dip to ensure flux adhesion. Further, the soldering station 6 is provided with a jet type solder tank 15.
In addition, a cooling fan 1 is installed at the solder curing station 7.
6 is provided to harden the solder attached to the leads 11. In addition, the washing station 8 is equipped with multiple running water washing tanks 17 as shown in FIG. Wash away. Further, the work 1 is attached to the support arm mechanism 3 at the loader station 4, and the work 1 is removed from the support arm mechanism 3 at the unloader station 9.

Incidentally, in such a soldering apparatus, the index time of the intermittent movement of the rotary table 2 is determined by the cleaning operation which takes the longest time. but,
Other tasks take extremely short periods of time, resulting in poor work efficiency and little practical benefit from integrated processing. For example, while washing with running water takes approximately 10 to 15 minutes, a few seconds to several tens of seconds is sufficient for other tasks.

On the other hand, if the working time at each station is made to coincide with the cleaning working time, the following problems will arise in the flux application work. That is, when a water-soluble flux is used as the flux, more flux than necessary will adhere. As a result,
When the workpiece is placed in the next solder tank, solder particles are generated due to the scattering of excess flux, and an undesirable phenomenon occurs in which these solder particles adhere to undesired parts of the workpiece.

SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a soldering apparatus that can shorten the work index time of soldering work to improve work efficiency and form a uniform solder film.

In order to achieve such an object, the present invention provides a soldering method in which a workpiece is sequentially moved through a flux application station, a soldering station, a solder curing station, and a cleaning station, and the workpiece is processed at each station, and solder is applied to the workpiece. In the apparatus, the cleaning station is provided with a shower cleaning section, a running water cleaning section with shower, a running water type ultrasonic cleaning section, and an air blow drying section, respectively, along the moving direction of the workpiece, and a flux application station. In some cases, the workpiece is immersed in a flux liquid for a predetermined time using a timer or the like, and then pulled out to remove excess flux.The present invention will be explained below with reference to Examples.

FIG. 4 is a schematic cross-sectional view showing a cleaning section of a soldering apparatus according to an embodiment of the present invention, and FIG. 5 is a schematic cross-sectional view showing a flux applying section. The soldering device has various working parts as shown in FIG. The cleaning section is as shown in Figure 4.
Along the traveling direction of the workpiece 1, a shower cleaning section 20,
Each tank is lined up with a running water cleaning section 21 with a shower, a drainage section 22, a running water type ultrasonic cleaning section 23, and an air blow drying section 24, forming a cleaning section as a whole. Work 1
As shown in FIG. 5, it is held at the tip of a support arm mechanism 3 attached to a rotary table 2 by a commonly used clamper mechanism (not shown) and moves over each tank. Showers 25 for spraying water onto the workpiece 1 are disposed above and below the workpiece movement path of the shower cleaning section 20, and the workpiece 1 is moved through these showers 25.
The upper and lower parts are cleaned by Further, a drainage hole 27 is provided at the bottom of the tank 26. The running water washing section 21 with a shower is provided with a supply hole 29 for supplying water at the bottom of a tank 28, and constitutes a running water washing tank in which water overflows vigorously from the edge of the tank 28, and the workpiece 1 is washed with this running water. At the same time, showers 30 are provided above and below the workpiece moving path to spray water toward the workpiece 1 to agitate the flowing water and further effectively remove flux adhering to the workpiece. The tank 31 of the running water type ultrasonic cleaning unit 23 is also a running water cleaning tank having a structure similar to the tank 28 and having a supply hole at the bottom. is arranged to vibrate the running water and remove flux that has penetrated into the fine details of the workpiece 1. The tank 33 of the drainage section 22 is a tank in which water overflowing from the shower-equipped running water cleaning section 21 and the running water type ultrasonic cleaning section 23 is drained from a drainage hole 34 provided at the lower part. Furthermore, in the tank 35 of the air blow drying section 24,
Air injection pipes 36 are provided above and below the moving path of the workpiece 1 to spray heated air toward the workpiece 1, so as to blow away moisture adhering to the workpiece 1 and heat it to dry it. Also,
A drainage hole 37 is provided at the bottom of the tank 35.
According to such a cleaning section, since cleaning tanks with excellent cleaning effects are arranged in series, the index time for transferring the workpiece 1 can be reduced to about several tens of seconds.

FIG. 5 shows a flux tank 10 in the flux application station 5. As shown in FIG. This flux tank 10 has a fan 12 rotated by a motor 38.
The flux liquid 13 is transferred to a pair of guide plates 39 by
The lead 11 of the workpiece 1 is immersed in the top of the jet part 14. Further, in order to prevent excessive application of flux, the motor 38 is set to operate only for a certain period of time by a timer 40. The timer 40 starts operating when a timer start detection switch (micro switch or the like) 41 is turned on. Timer start detection switch 4
The detection lever 1 contacts the cam surface of the cam 43 attached to the rotating support column 42 of the support arm mechanism 3, and when the support arm mechanism 8 positions the work 1 on the flux tank 10, the timer start detection switch 4 is activated.
1 becomes ON and operates. Then, after the time set by the timer has elapsed, the motor 38 stops rotating, so the flux jet stops, the flux liquid level falls, and the lead 11 is removed from the flux liquid. After that, the excess flux attached to the leads 11 falls off from the leads 11, so when the leads 11 are placed in the solder solution of the next station, the amount of flux is appropriate, so the generation of solder particles is extremely small. , soldering is done uniformly.

According to such an embodiment, the index time for transferring the work in the cleaning section can be made extremely short, so that the efficiency of the soldering work can be improved. In addition, the washing section combines showering and running water washing, and has a structure that prevents dirty water from being carried into the next tank, reducing the amount of water used.

Further, in this embodiment, since no more flux is applied than necessary, uniform soldering can be achieved without scattering of solder, and no solder is wasted. Also,
Since the flux is not brought into the solder bath more than necessary, the amount of foaming caused by the surfactant contained in the flux is reduced. As a result, it is possible to prevent the outflow of bubbles and the scattering of the solder, so that it is also possible to prevent contamination of the soldering device and the environment.

Note that the present invention is not limited to the above embodiments.

As described above, according to the soldering device of the present invention,
Since it is possible to efficiently solder the workpiece and also to perform uniform soldering, it is possible to improve the yield and reduce the soldering cost.

[Brief explanation of the drawing]

FIG. 1 is a schematic plan view of the soldering device, FIG. 2 is a sectional view of the flux tank, FIG. 3 is a sectional view of the cleaning tank, and FIG. 4 is a sectional view of the cleaning section according to an embodiment of the present invention. , FIG. 5 is a sectional view of the flux application section. 1... Workpiece, 3... Support arm mechanism, 10...
... Flux tank, 11 ... Lead, 20 ... Shower cleaning section, 21 ... Running water washing section with shower, 23 ...
...Flowing water type ultrasonic cleaning section, 24...Air blow drying section.

Claims (1)

[Scope of Claims] 1. A soldering device in which a workpiece is sequentially moved through a flux application station, a soldering station, a solder curing station, and a cleaning station, and each station processes the workpiece to adhere solder to the workpiece, wherein the cleaning station The soldering apparatus is characterized in that at least one of each of a shower cleaning section, a running water washing section with a shower, a running water type ultrasonic cleaning section, and an air blow drying section are arranged along the moving direction of a workpiece. 2. In a soldering device that sequentially moves a workpiece through a flux application station, a soldering station, a solder curing station, and a cleaning station, processes the workpiece at each station, and attaches solder to the workpiece, the cleaning station is configured to move the workpiece in the direction of movement of the workpiece. A shower cleaning section, a running water cleaning section with a shower, a running water type ultrasonic cleaning section, and an air blow drying section are arranged along the flux application station, and the flux application station immerses the workpiece in the flux liquid for a predetermined period of time. A soldering device characterized by being configured as follows.