JPH11169802A - Electronic part washing method and electronic part washing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic parts washing device by which electronic parts can be effectively washed and dried and which has general applicability through it is small-sized. SOLUTION: An electronic parts washing device in which electronic parts 23 are washed by jetting a washing liquid to the electronic parts 23 is provided with a nozzle 20 having jetting holes 21 for jetting the washing liquid and a washing jig 17 rockably provided in front of the jetting holes 21 and moving the front of the jetting holes 21 in the state that the electronic parts 23 is held to wash the electronic parts 23 with the washing liquid jetted from the jetting holes 21. The washing jig 17 accommodates and holds the electronic parts 23 in the vertical direction. The nozzle 20 having the jetting holes 21 are arranged in a washing tank 12 containing the washing liquid and the washing liquid is jetted to the electronic parts 23 in the washing liquid.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and an apparatus for cleaning electronic components, and more particularly to a BGA (Ball Grid Arra).
y), which relates to a technique which is effective when applied to cleaning of semiconductor devices such as CSP (Chip Size Package).

[0002]

2. Description of the Related Art In recent years, attempts to use BGA, CSP and the like as means for realizing a multichip module have been widely made. These BGAs, CSPs and the like are manufactured by mounting a ball or the like on which a flux is printed or transferred on a chip or a substrate and soldering the ball at a high temperature. Then, after the soldering, the flux is cleaned, and the product is manufactured through a drying process and a test process.

[0003] Here, as a method for cleaning the flux,
Conventionally, immersion cleaning in which a product is immersed in a cleaning liquid, shower cleaning in which a cleaning liquid is sprayed on a product, and the like have been used. In this case, in the immersion cleaning, the product is accommodated in a jig or a basket, which is swung in a cleaning liquid, and the flux is cleaned by batch processing. On the other hand, in shower cleaning,
The product is conveyed by belt and immersed in a shower of cleaning liquid to continuously perform flux cleaning. There are two types of flux: rosin-based flux and water-soluble flux. At the time of washing, water or various detergents are appropriately selected depending on the type.

[0004]

However, in such a cleaning method, first, in the case of immersion cleaning,
Because of the so-called pool washing state, there is a problem that the flux cannot be sufficiently reduced by one treatment. In this case, it is possible to improve the cleaning effect by using ultrasonic cleaning together, but it is difficult to use it regularly because the wiring may be broken by ultrasonic waves. That is,
In the case of a precise semiconductor device, ultrasonic cleaning is prohibited in some cases in order to prevent defects from occurring, and in such products, immersion cleaning is repeated to remove flux.

On the other hand, in the case of shower cleaning, the cleaning efficiency is higher than that of immersion cleaning because the processing is carried out by a pressurized liquid flow, but there is a problem that the apparatus is large and space efficiency is not good. In particular, shower cleaning such as BGA is often performed by diverting a device for a printed circuit board in general.
In this case, there has been a demand for the development of a small-sized special-purpose machine with an unnecessarily large device compared to the size of the product and high cleaning efficiency.

An object of the present invention is to provide a small and versatile electronic component cleaning apparatus which can efficiently clean and dry electronic components and is small in size.

[0007] The above and other objects and novel features of the present invention will become apparent from the description of the present specification and the accompanying drawings.

[0008]

SUMMARY OF THE INVENTION Among the inventions disclosed in the present application, the outline of a representative one will be briefly described.
It is as follows.

That is, the electronic component cleaning method of the present invention comprises:
An electronic component cleaning method for cleaning an object to be cleaned by injecting a cleaning liquid to the object to be cleaned, wherein the object to be cleaned is swung in front of an injection hole from which the cleaning liquid is sprayed, and is brought into a swinging state. It is characterized by having a cleaning step of cleaning the object to be cleaned by injecting a cleaning liquid from an injection hole to the object to be cleaned. In this case, the object to be cleaned may be cleaned by spraying the cleaning liquid in the cleaning liquid, or the cleaning may be performed in the air.

Further, the electronic component cleaning method according to the present invention is a method for cleaning an object to be cleaned by immersing the object to be cleaned in a cleaning liquid, wherein the object to be cleaned is swung in the cleaning liquid. And a cleaning step of cleaning the object to be cleaned by applying ultrasonic waves to the object to be cleaned in a swinging state.

In this case, in each of the above electronic component cleaning methods, a liquid removal step of removing the cleaning liquid attached to the object to be cleaned in the cleaning step by using centrifugal force may be added. Further, after the liquid draining step, a second cleaning step and a second liquid draining step may be further added.

On the other hand, an electronic component cleaning apparatus of the present invention is an electronic component cleaning apparatus for cleaning an object to be cleaned by injecting a cleaning liquid to the object to be cleaned, and has an injection hole for injecting the cleaning liquid. Nozzle and a cleaning jig provided to be swingable in front of the injection hole, moved in front of the injection hole while holding the object to be cleaned, and cleaning the object to be cleaned with the cleaning liquid injected from the injection hole. And characterized in that:

In this case, the injection holes may be arranged in a cleaning tank containing the cleaning liquid, and the cleaning liquid may be injected into the cleaning object in the cleaning liquid. good. Further, the object to be cleaned may be stored and held in the cleaning jig in a vertical direction, thereby reducing carry-out and carry-in of the cleaning liquid.

Further, there is provided a liquid cutting jig for accommodating the object to be cleaned which has been cleaned by the cleaning jig, and the cleaning liquid attached to the object to be cleaned by centrifugal force by rotating the liquid cutting jig. You may make it further have the liquid removal apparatus which removes.

In addition, the present invention relates to an electronic component cleaning apparatus for cleaning an object to be cleaned by immersing the object to be cleaned in a cleaning liquid, and oscillating in the cleaning liquid while holding the object to be cleaned. A cleaning unit that is formed so that a cleaning jig to be replaced and an injection nozzle or an ultrasonic generator can be exchanged, and performs cleaning liquid injection or ultrasonic application to a swinging cleaning object to wash the cleaning object. Is also characterized.

[0016]

Embodiments of the present invention will be described below in detail with reference to the drawings.

(Embodiment 1) FIG. 1 is an explanatory view showing the structure of an electronic component cleaning apparatus (hereinafter abbreviated as "cleaning apparatus") according to Embodiment 1 of the present invention. FIG. FIG. 2 is an explanatory diagram showing a state in which the cleaning apparatus of FIG. 1 is viewed from above. In the first embodiment, a cleaning device used for cleaning an electronic component using a rosin-based flux will be described as an example.

The cleaning apparatus shown in FIG. 1 is roughly composed of the following four functional units. That is, a supply unit 1 for supplying a product such as BGA after the soldering process to the cleaning process, a cleaning unit 2 for cleaning the product, a drying unit 3 for drying the product after the cleaning, and the cleaning process are completed. It comprises a storage section 4 for storing products and a transfer device 5 for transferring the products to each section. The transfer device 5 takes out the product from the supply unit 1 and sends the product to the washing unit 2 and the drying unit 3 in order, so that the flux is washed and removed and the drying process is performed.

Here, the supply unit 1 is a full magazine supply unit 1 for storing a magazine 10 in which products after soldering are stored.
1a and an empty magazine storage section 11b for storing the magazine 10 that has been emptied by taking out the product. Then, the full magazine supply unit 1 is transferred by the transfer device 5.
The product to be cleaned is taken out from 1a and transported to the next cleaning section 2.

The cleaning section 2 further includes a pre-cleaning section 6, a pre-cleaning liquid cutting section 7, a post-cleaning section (second cleaning step) 8, and a post-cleaning liquid cutting section (second liquid cutting step) 9. The flux and dirt adhering to the product are removed here.
In this case, the pre-cleaning section 6 includes three cleaning machines 13 (13) in one cleaning tank 12 filled with a cleaning liquid (for example, 60 ° C.).
a to 13c) are arranged, and a primary cleaning step using a cleaning agent is performed. The post-cleaning section 8 includes three independent cleaning tanks 14a to 14c.
3d to 13f) are arranged. In this case, pure water heated to about 60 ° C. for separating oil and water is supplied to the cleaning tank 14 a of the post-cleaning section 8, and 35 μm is supplied to the cleaning tanks 14 b and 14 c.
New pure water at 0 ° C. is constantly supplied, and the rinsing process is performed in three stages. The cleaning liquid in the cleaning tank 12 and the pure water in the cleaning tanks 14a to 14c are respectively cleaned and reused by a recycle device (not shown).

On the other hand, a pre-cleaning liquid cutting unit 7 is provided between the pre-cleaning unit 6 and the post-cleaning unit 8, and a liquid cutting device 15 utilizing centrifugal force is provided therein. Further, a similar liquid draining device 15 is provided at a stage subsequent to the post-cleaning unit 8, thereby removing and collecting the liquid adhering in the pre-cleaning unit 6 and the post-cleaning unit 8 from the product.

A drying unit 3 is provided downstream of the washing unit 2, where water droplets adhering to the product are completely evaporated, and the washing process of the product is completed. Then, the dried product is transferred to the storage unit 4 and stored in the magazine 10. The storage unit 4 also includes, like the supply unit 1, an empty magazine supply unit 16a and a full magazine storage unit 16b, and the products that have been washed and dried are stored in the magazine 10 next. Is sent to the process.

By the way, the washing machine 1 in the washing apparatus is used.
In No. 3, an oscillating jet system different from the conventional immersion system or shower system is adopted, so that flux and dirt attached to the electronic component can be efficiently removed. FIGS. 3 and 4 show the washing machine 1 arranged in the washing tank 12.
It is explanatory drawing which showed the outline of No.3. Although three washing machines 13 are provided in the washing tank 12 as shown in FIG. 1, since the drawing is complicated, in FIG.
Only the units are shown. The cleaning tank 14a of the post-cleaning section 8
The washing machine 13 attached to １４14c has the same configuration.

As shown in FIG. 3 and FIG.
The cleaning tank 12 includes a cleaning jig 17 that can be moved up and down in the cleaning tank 12 and a jet nozzle (cleaning unit) 18 disposed at the bottom of the cleaning tank 12. In this case, the cleaning tank 12 is filled with the cleaning liquid, and a new cleaning liquid is supplied by a pump (not shown) at a rate of, for example, 5 liters per minute.
It is discharged from one drain port 31a.

The cleaning jig 17 is provided with a groove 19. When the cleaning jig 17 is lowered, the nozzle portion 20 of the jet nozzle (nozzle) 18 enters the groove 19. . Further, a jet injection hole (injection hole) 21 is formed in the nozzle portion 20 of the jet nozzle 18, and a cleaning liquid such as a cleaning agent or pure water is injected from the jet injection hole 21.
Further, a holding plate 22 is provided on the cleaning jig 17, and the electronic components 23 held by the frame 32 are vertically mounted on the holding plate 22. Then, the electronic component 23 is lowered while the electronic component 23 is mounted on the cleaning jig 17, the cleaning jig 17 is engaged with the jet nozzle 18, and the electronic component 23 is washed with the cleaning liquid injected from the jet injection hole 21.

Here, the jet nozzle 18 comprises four nozzle portions 20 having a large number of jet injection holes 21 and a supply pipe 24 for supplying a cleaning agent or pure water to the nozzle portions 20. 5A and 5B are explanatory views showing the configuration of the jet nozzle 18, FIG. 5A is a front view thereof, and FIG. 5B is a side view. As shown in FIG. 5B, four nozzle portions 20 are vertically installed on the upper surface of the nozzle support portion 24a of the supply pipe 24, as shown in FIG. On the other hand, the supply pipe 24 includes a nozzle support part 24a and an introduction pipe part 24b made of a hollow square pipe, and the inside thereof is in communication with the nozzle part 20. In addition, the introduction pipe portion 24b of the supply pipe 24 rises once upward from the nozzle support portion 24a and extends downward again in order to get over the side wall of the cleaning tank 12, and has a distal end from a jet pump (not shown). Pipes are connected.

Further, a large number of jet injection holes 21 each having a diameter of 1 mm are provided on the side surface of the upper frame 20a of each nozzle portion 20. Therefore, the cleaning agent and the like supplied from a jet pump (not shown) via the supply pipe 24 are ejected from the jet injection holes 21 toward the sides of the respective nozzle portions 20 as indicated by arrows in FIG. 5B. Will be. Note that the jet nozzle 18 is fixed to the cleaning tank 12 by a bracket 25 provided on the introduction pipe portion 24b. In addition, it is also possible to attach an ultrasonic cleaning unit instead of the jet nozzle 18.

FIG. 6 is an explanatory view showing the structure of the cleaning jig 17, FIG. 6a is a front view thereof, and FIG. 6b is a plan view.
FIG. 7 is an explanatory view showing a configuration of the holding plate 22 used in the cleaning jig 17 of FIG. 6, and is a view in the direction of arrow A in FIG. 6A.

As shown in FIGS. 6A and 6B, the cleaning jig 17 is used.
Has a configuration in which jig bases 27a and 27b are arranged at both ends of a jig frame 26, and four electronic component holding portions 28 are formed thereon. The electronic component holding section 28 includes a jig base 27.
a and 27b, a holding plate 22 as shown in FIG. 7, and a holding plate 30 bent in a U-shape.
The five holding plates 22 and the two holding plates 22 are respectively mounted on the support frame 29. The slots 19 are formed between the support frames 29 and between the support frame 29 and the jig frame 26. It is needless to say that the number of the electronic component holding portions 28 and the number of the holding plates 22 are not limited to the above numbers.

In this case, as shown in FIG. 7, the holding plate 22 is provided with a groove 22a having a wide open upper end at the center thereof, and the electronic component 23 is inserted into the groove 22a.
Further, the holding plate 30 is a leaf spring-shaped member and is mounted on the support frame 29 with the upper end side opened outward, and is positioned and held so that the frame 32 is sandwiched by its base 30a. . Thereby, the electronic component 2
3 is accommodated in the groove 22a of the holding plate 22 while being guided by the open upper end of the holding plate 30, and is mounted on the cleaning jig 17 in a state shown by a two-dot chain line in FIG. 6A. Also, presser plate 3
0, the magazine 32 can be positioned in the storage section 4 without displacing the frame 32.
0 can be accommodated.

On the other hand, a bracket 67 is attached to the jig frame 26, and the handle 67a is attached to a jig elevating device (not shown) to move up and down the cleaning tank 12 as shown in FIGS. It is supposed to. Then, the cleaning jig 17 is lowered to insert the nozzle portion 20 of the jet nozzle 18 into the slot 19, and the electronic component 23 is opposed to the jet injection hole 21 to swing the cleaning jig 17 up and down. FIG. 8 shows the situation at this time.

As shown in FIG. 8, the electronic component 23 held by the cleaning jig 17 is cleaned by a jet jet ejected from the jet orifice 21. At this time, the electronic component 23 is blown with a jet jet from a proximity position of 10 mm or less, and the flux attached to the vicinity of the ball is removed. Further, since the force applied to the electronic component 23 by the jet jet is received by the holding plate 22, the frame 32 is not greatly distorted or blown off.

As described above, in the washing machine 13,
The cleaning jig 17 is not only swung in the cleaning tank 12 filled with the cleaning liquid, but also jetted directly onto the electronic components 23 placed vertically, so that the cleaning jig 17 can be compared with the conventional immersion type or shower type. As a result, the parts can be efficiently cleaned in a small space.

The cleaning tank 12 is not filled with the cleaning liquid,
It is also possible to perform jet cleaning in the air. However, in the case of the submerged jet system, the jet jet is stronger than in the submerged jet system and the cleaning effect is enhanced, but the portion not hit by the jet jet is not cleaned. That point,
In the submerged jet method, the entire object to be cleaned is immersed in the cleaning agent, and the portion not hit by the jet jet is also cleaned.

The draining devices 15a and 15b (1) are provided downstream of the pre-cleaning section 6 and the
5) is provided. FIG. 9 is an explanatory diagram illustrating a configuration of a liquid draining device 15 used in the cleaning device.

Conventionally, a blow-off type liquid draining device using a so-called air blow has been used for this type of cleaning device. However, such a type of liquid draining device has the following problems. That is, first, it is necessary to use a high-output air blow in order to perform effective drainage, so that there is a problem that the air consumption is large. Another problem is that the operating noise is very loud and the working environment is not good. Further, there is a problem that the surrounding environment is deteriorated by the scattered liquid. In addition, there is a problem that the liquid attached to the electronic component is not easily collected because the liquid scatters in all directions.

Therefore, in this apparatus, the centrifugal force is used to drain the liquid, and further, the removed cleaning liquid can be easily collected and recycled, thereby saving the cleaning liquid and deteriorating the surrounding environment. Is also prevented. In addition, by reducing the carry-in of the cleaning liquid to the subsequent stage, rinsing and drying in the subsequent stage are facilitated, and the burden on wastewater treatment is reduced.

That is, in the liquid removing device 15 provided at the subsequent stage of the pre-cleaning section 6, the carry-in of the cleaning liquid from the cleaning tank 12 to the cleaning tank 14 is reduced, and the rinsing step in the cleaning tank 14 is made more efficient. For this reason, the water (pure water) in the cleaning tank 14a, which is normally the first stage of the rinsing step, contains a large amount of cleaning liquid and cannot be recycled. However, the present cleaning apparatus can also recycle the water in the first tank. It has become. Therefore, the burden of wastewater treatment on the production line can be reduced, and the cost for wastewater treatment can be reduced. Further, since the cleaning liquid removed by the liquid removing device 15 is recovered and reused again, the cleaning liquid can be saved and the running cost of the device can be reduced. Thus, in the cleaning device, the draining device 1
By utilizing the method 5, a closed system can be formed in a more efficient manner, and the running cost for the cleaning process can be reduced in total.

Further, in the liquid draining device 15 at the subsequent stage of the post-washing section 8, washing water is brought into the drying section 3 to reduce the drying efficiency, shorten the drying time, and prevent adhesion of the watermark. I'm trying. In this case, in particular, in precision cleaning for high-density ICs and the like, in order to prevent malfunction due to the attachment of impurities in the air, those having a water mark as a trace of water droplets are regarded as cleaning failure. Therefore, in order to provide high-quality electronic components, this cleaning device is designed to remove water before drying.
A liquid removal device 15 is also provided at a stage subsequent to the post-cleaning unit 8.

Therefore, the draining device 1 in the washing device is used.
The configuration of the liquid draining device 15 will now be described. As shown in FIG. 9, the liquid draining device 15 includes a liquid draining jig 33 having a cover 37 for housing and holding the frame 32, and a rotary drive for rotating the liquid draining jig 33 at a high speed. And a cover driving unit 35 for driving the cover 37. Here, the liquid cutting jig 33
In the same manner as the cleaning jig 17 of FIGS.
Can be held. Also, the liquid draining jig 33
Is fixed to a rotating shaft 36 supported by bearings 38 and 39, and is rotatably supported about the rotating shaft 36. Further, the liquid draining jig 33 is provided in a liquid draining chamber 46 separated by a partition plate 45, and a drainage port 47 is attached to a lower part of the liquid draining chamber 46. Therefore, the cleaning liquid scattered by the rotation of the liquid draining jig 33 is collected in the liquid draining chamber 46, collected through the drainage port 47, and sent to a cleaning agent tank (not shown).

The rotation drive unit 34 is provided with a servomotor (hereinafter, referred to as a servomotor).
A motor 40), a drive pulley 41 attached to an output shaft 40a of the motor 40, and a driven pulley 43 attached to the right end side of the rotating shaft 36 in the figure and connected to the drive pulley 41 via a belt 42. It is configured.

The liquid draining jig 33 is also provided with a cover 37 so that the cleaning liquid does not splash outside the apparatus when the liquid draining jig 33 is rotating at a high speed. The cover 37 is attached to a cover attachment plate 50 fixed to bearings 48 and 49, and is rotatably supported outside the liquid cutting jig 33. Normally, as shown in FIG.
It doesn't get in the way of putting in and out of 2.

The cover 37 is driven by the cover drive unit 35 and moves to the position shown by the dashed line in FIG. 9 when the liquid cutting jig 33 rotates, and rotates together with the liquid cutting jig 33. The cover driving unit 35 includes a rotary actuator 51 whose rotation angle can be controlled, and a driving pulley 5 attached to an output shaft 51 a of the rotary actuator 51.
2 and a driven pulley 54 attached to the left end side of the bearing body 48 in the drawing and connected to the drive pulley 52 via a belt 53.
It is composed of In addition, in the said liquid removal apparatus 15,
Timing pulleys are used for the pulleys including the driving pulley 41 and the driven pulley 43, and timing belts are used for the belts 42 and 53.

Then, the frame 32 is placed on the liquid cutting jig 33, the cover 37 is closed, and the liquid cutting jig 33 is rotated at a high speed. At this time, the processing conditions in the liquid removing device 15 differ depending on the properties of the liquid to be removed (viscosity, spreading rate, etc. of the liquid). FIG. 10 to FIG. 13 show data in the case where the liquid was actually drained using the liquid draining device 15. FIG. 10 is a table showing the difference in the draining effect between pure water and the cleaning agent, and FIG. 11 is a graph showing the results of FIG. FIG.
As can be seen from 0 and 11, in the case of pure water, although a large amount adheres in the form of water droplets, drainage is easy. On the other hand, in the case of the cleaning liquid, since it spreads and adheres, the amount of adhesion is smaller than that of pure water, but it is found that the liquid is difficult to drain.

On the other hand, FIG. 12 is a table comparing the draining effects of various draining methods, and FIG. 13 is a graph showing the relationship between the rotation speed and the remaining water amount in the data of FIG. As can be seen from FIG. 12, the amount of water adhesion is smaller when the electronic component is vertical than when it is horizontal. Also,
It can be seen that liquid removal using centrifugal force is more effective than air blow. Further, it can be seen that the higher the number of rotations is, the more effective the centrifugal liquid drainer is.

Next, as shown in FIGS. 1 and 2, a drying device 66 of the drying section 3 is provided downstream of the draining device 15.
Here, the electronic components that have been rinsed and cleaned are dried with hot air to finish the cleaning process. FIG.
FIG. 4 is an explanatory view showing the configuration of the drying device 66.
The drying device 66, as shown in FIG.
And a drying jig 56, a sirocco fan 57, and a heater 58. The electronic components 23 held by the drying jig 56 are heated by hot air sent from the sirocco fan 57 through the heater 58. Try to dry. In this case, similarly to the cleaning jig 17 of FIGS. 6 and 7, the drying jig 56 is provided with the holding plate 22 and the holding plate 30 so that the frame 32 can be held there. As shown in FIG. 2, a large number of drying jigs 56 are provided in parallel with the paper surface of FIG.

In this case, there is a difference in the drying time between the case where the drying is performed after draining using the draining device 15 and the case where the drying is performed without draining. FIG. 15 shows test results comparing the two, and FIG.
Is the data when the liquid was drained, and B is the data when the water droplets on the surface were wiped off with a tissue. As is clear from FIG. 15, in the case of using the liquid draining device 15, the residual water amount becomes 0 after 120 seconds, but in the case of wiping tissue, it takes 150 before the residual water amount becomes 0. I have. After the test, two lids of the sample A were peeled off, and the remaining amount of water in the gap was visually checked, but no water remained inside.

FIGS. 16 and 17 show the relationship between the number of rotations and the drying time in the liquid removing device 15. FIG. 16 shows a comparison of the drying time between the case where the rotation speed is 1000 RPM and the case where the rotation speed is 2000 RPM. FIG. 17 is a graph showing the results. As can be seen from these results, when the number of rotations is increased, the remaining amount of water is reduced accordingly, so that the drying time is naturally shortened. Therefore, FIGS.
If the conditions that can minimize the draining time and the drying time are set in accordance with the product in consideration of the data such as the above, the working efficiency can be greatly improved as compared with the conventional cleaning apparatus.

In the cleaning apparatus, the frame 32 is moved to the transfer device 5 instead of handling the tray or basket to perform the cleaning process as in other conventional cleaning devices.
For cleaning. For this reason, in the present apparatus, the amount of the cleaning liquid taken out of the tank or brought into another tank is smaller than that of the conventional apparatus. In this respect, the liquid is saved and the fatigue of the liquid is reduced.

Therefore, referring to FIGS. 1 and 2 again, the transfer device 5 includes a guide rail 59 provided along the longitudinal direction of the cleaning device, and a drive unit (not shown) on the guide rail 59 along the guide rail 59. Chuck units 60a, 60b (60) movably disposed
It is composed of FIG. 18 is an explanatory diagram showing the configuration of the chuck unit 60 used in the transfer device 5,
FIG. 7A is a diagram illustrating a state where the frame 32 is not held, and FIG. 7B is a diagram illustrating a state where the frame 32 is held. FIG. 19 is an explanatory diagram of the chuck unit 60 viewed from the side.

The chuck unit 60 includes an opening / closing beam 6.
The frame 32 can be handled and carried to a desired position by opening and closing the movable claw 63 by operating the first and second members 62. In this case, the movable claw 63 has a movable claw 63a having a tip facing right in FIG. 18 attached to the opening / closing beam 61, and a movable claw 63b having a tip facing left in FIG. I have. Also, as shown in FIG. 19, a plurality of movable claws 63 are provided in a direction perpendicular to the plane of FIG. 18, and the toes are arranged as shown in FIG. FIG. 20 is an explanatory diagram showing the arrangement of the toes of the movable claw 63.
As shown in FIG. 20, the toes of the movable claw 63a and the movable claw 63b are formed so as to overlap without interfering with each other. As a result, when the opening and closing beams 61 and 62 are moved inward (in the direction of the arrow in FIG. 18A),
As shown in (b), the movable claw 63a and the movable claw 63b are close to each other,
The frame 32 can be held between them.

A pad 64 is provided at the base of the movable claw 63 so as to secure a predetermined space between the movable claw 63a and the movable claw 63b. Therefore, the movable claws do not approach each other more than necessary and do not damage the frame 32 housed between them. Opening beam 6
Steps 1 and 62 are performed by a motor 65 provided above the chuck unit 60.

Next, the operation of cleaning the electronic parts in the cleaning apparatus having the above-described configuration will be described. First, the chuck unit 60 of the transfer device 5 shown in FIG.
is moved to the full magazine supply section 11a of the supply section 1, and the frame 32 on which the electronic components requiring cleaning are taken out of the magazine 10. At this time, the chuck unit 60a
Then, the movable claws 63 are closed by moving the opening / closing beams 61 and 62 inward, and the frame 32 is held between the movable claws 63a and 63b. In addition, in the cleaning device, the cleaning process can be performed by moving up to four frames 32 in one operation, but the number thereof can be appropriately changed by setting of each device and is not limited thereto. is not.

The transfer device 5 that has acquired the frame 32 transfers the frame to the cleaning unit 2 and places the frame 32 on the cleaning machine 13a closest to the cleaning tank 12. At this time,
In the cleaning machine 13a, the cleaning jig 17 is on standby above the liquid level in the cleaning tank 12, and the chuck unit 60a opens the movable claw 63 in a state where the frame 32 is stored and held in the electronic component holding unit 28. Move away from the washer 13a.

In the cleaning machine 13a, the cleaning jig 17 is lowered and overlaps the nozzle portion 20 of the jet nozzle 18. The jet nozzle 18 injects a cleaning liquid from the jet injection hole 21 toward the electronic component 23 held by the cleaning jig 17. Further, the cleaning jig 17 repeats ascending and descending at the same time so that the jet jet may evenly hit the electronic component 23. As a result, the flux adhering to the electronic component 23 is effectively removed by the swing operation of the cleaning jig 17 and the jet jet.

Such an operation is performed for a predetermined time (for example, 30 minutes).
Seconds), the washing apparatus performs drainage before the rinsing step. That is, the cleaning jig 17 is raised, and the transfer device 5 conveys the frame 32 to the liquid removing device 15a.
In the liquid draining device 15a, the frame 32 is attached to the liquid draining jig 33.
Is placed, and the cover 37 is closed. Then, under a predetermined condition (for example, 2000 rpm, 5 seconds), the liquid cutting jig 33
Is rotated to remove the cleaning liquid attached to the electronic component by centrifugal force.

After the cleaning liquid has been sieved in this way, the cleaning liquid is then rinsed. That is, the cleaning jig 17 is raised, and the transfer device 5 conveys the frame 32 to the cleaning tank 14 a of the post-cleaning unit 8. At this time, in the cleaning device, the transfer operation is performed by the chuck unit 60b of the transfer device 5. In the cleaning tank 14a, the cleaning machine 13d
Cleaning jig 17 is on standby above the liquid level in cleaning tank 12, and chuck unit 60b places frame 32 there and separates from cleaning machine 13d. The cleaning machine 13d rinses the electronic component 23 by the swing operation of the cleaning jig 17 and the jet jet similarly to the above-described cleaning machine 13a.

After performing the first rinsing in the cleaning tank 14a for a predetermined time (for example, 30 seconds), the rinsing is transferred to the cleaning tank 14b, and the second rinsing is performed. Perform a rinse. Then, after the third rinsing is completed, the washing water adhered to the electronic component 23 during the transfer to the liquid removing device 15b and rinsing is removed. The draining device 15
Is different depending on the properties of the liquid to be removed as described above (viscosity, spreading rate, etc. of the liquid).

After rinsing and draining, drying is finally performed. That is, the frame 32 is transported to the drying device 66 by the chuck unit 60b. In the drying device 66,
The frame 32 is placed on the drying jig 56, and the electronic component 23 is dried by hot air sent from the sirocco fan 57 via the heater 58. After this drying process,
Frame 32 containing electronic component 23 that has been dried
Is taken out of the drying device 66 by the chuck unit 60b, transferred to the storage section 4, and stored in the magazine 10. When the magazine 10 becomes full, the magazine 10 is conveyed to the full magazine supply unit 16a and sent to the next step.

By the way, when such a cleaning process is performed, if the frames 32 are processed one by one,
Waiting time occurs and processing efficiency deteriorates. Therefore, in the cleaning apparatus, three cleaning machines 13 are arranged in the cleaning tank 12, and the cleaning operation is performed with a time lag between each of the three cleaning machines 13, so that unnecessary waiting time is not generated. FIG. 21 is an explanatory diagram showing the processing pattern.

Here, as shown in FIG. 21A, the frame 32a is first put into the cleaning machine 13a by using the chuck unit 60a. Next, as shown in FIG. 21B, the frame 32b is put in the cleaning machine 13b. Then, as shown in FIG. 21C, the frame 32c is put into the cleaning machine 13c. After the frame 32c is put into the cleaning machine 13c in this way, as shown in FIG. 21D, the frame 32a is taken out from the cleaning machine 13a, which has been performing the cleaning work up to that time, using the chuck unit 60b, and the cleaning tank is cleaned. It transfers to the washing machine 13d of 14a. Before and after that, a new frame 32d is put into the washing machine 13a by using the chuck unit 60a.

After the first rinsing of the frame 32a in the washing machine 13d is completed, the frame 32a is moved to the washing machine 13e of the washing tank 14b by the chuck unit 60b, and then the frame 32b is taken out of the washing machine 13b and sent to the washing machine 13d. Move. Before or after that, a new frame 32e is cleaned by the cleaning unit 13b using the chuck unit 60a.
Put in. By repeating such a time lag operation, the time of the cleaning operation in the cleaning tank 12 can be effectively used, and the cleaning operation without waste can be performed.

As described above, according to the cleaning apparatus of the present invention, since the oscillating jet method is used for cleaning the electronic parts, it is possible to remove flux and dirt more efficiently than the conventional method. Becomes In addition, since the oscillating jet is performed by vertically arranging the electronic components, a large space is not required unlike a shower cleaning device using a belt conveyor, and a compact cleaning device can be provided.

FIG. 22 shows the results of the cleaning test when the cleaning method (oscillating jet method) according to the present invention is used and when the immersing operation is simply performed. FIG. 22 also shows the results of a cleaning test when an ultrasonic cleaning unit is attached instead of the jet nozzle 18. In the test of FIG. 22, the rinsing was performed twice, and the third rinsing was omitted.

As can be seen from FIG. 22, the cleaning effect was highest in the case of “oscillation immersion + ultrasonic wave”, and the result of “oscillation immersion + jet in liquid” was second to that. However, it was confirmed that the oscillating jet method was considerably more effective than mere immersion immersion, and it was found that the oscillating jet method was effective for cleaning electronic components that could not be subjected to ultrasonic cleaning.

The above-described various test conditions are merely examples, and the cleaning apparatus according to the present invention is not limited to these conditions. In the above-described example, the system using the submerged jet is shown. However, as described above, a system using an aerial jet as well as a submerged jet is also possible. It is also possible to use it. In addition, the cleaning method is not limited to the jet method, and the ultrasonic cleaning method can be easily adopted by replacing the unit. In this case, for example,
A different cleaning method may be used for each tank, such as an ultrasonic method for the cleaning tank 12 and a jet method for the cleaning tank 14.

On the other hand, the washing apparatus can flexibly cope with both water-soluble and rosin-based fluxes by appropriately switching the use form of the washing tank. That is, the cleaning tank 14 does not necessarily need to be used exclusively for rinsing, and the contents may be appropriately changed depending on the tank, for example, by adding a cleaning agent different from that of the cleaning tank 12 to the cleaning tank 14a. Further, as in the test in FIG. 22, the number of rinses is not limited to three, such as omitting one rinse depending on the relationship with the cleaning agent. In particular, when a water-soluble flux is used, the pre-cleaning step may be omitted, and washing may be performed, for example, three times with hot water. In this case, the cleaning tank 12 is skipped and the cleaning tank 14 is skipped from the beginning. Cleaning work.

(Embodiment 2) Next, a cleaning apparatus according to Embodiment 2 of the present invention will be described. The cleaning device according to the second embodiment is a device in which the electronic component is cleaned while being held on the frame 32 in the first embodiment, and is handled as a single item and cleaned. In this case, the second embodiment is different from the first embodiment in the configuration for holding the electronic component 23 in the transfer device 5, the washing machine 13, the liquid removal device 15, the drying device 66, and the like. Is the same as that of the cleaning apparatus of the first embodiment. Note that the same reference numerals are given to the same devices and members as in Embodiment 1, and the details are omitted.

FIG. 23 is an explanatory view showing the structure of the chuck unit 70 used in the transfer device 5 according to the second embodiment. FIG. 23a is a front view, and FIG. 23b is a side view. In the chuck unit 70, the solid piece 71 of the electronic component 23 is held by the movable claw 73 and transported while being held horizontally by vacuum suction by the press pad 72. The movable claw 73 is attached to the opening / closing beam 74 as shown in FIG. 23B, and moves in the left-right direction in the figure. The press pad 72 is provided with the press pin 7.
5 and is connected to a vacuum pump (not shown) so that the solid pieces 71 can be adsorbed on the lower surface thereof. A spring 76 is fitted on the holding pin 75, and applies a predetermined pressing force to the holding pad 72.

Further, a regulating pin 77 is provided in the chuck unit 70 in a line with the press pad 72. The restriction pin 77 is for positioning the solid piece 71 by a small diameter portion 77a having a tapered tip. Thereby, the solid piece 71 is positioned in the left-right direction in FIG. 23A and held by the chuck unit 70.

Next, a cleaning jig 80 used in the cleaning machine 13 of the second embodiment will be described. FIG. 24 is an explanatory view showing the configuration, FIG. 24a is a plan view thereof, and FIG.
Is a front view. The cleaning jig 80 includes the chuck unit 7.
Electronic component 2 transported by the transfer device 5 having
This is a dedicated jig for holding the third solid piece 71 horizontally for cleaning.
In this case, the solid piece 71 is placed on the lower jig 83 attached to the base 82 and is pressed from above by the pressing plate 84. A positioning block 85 is provided on the lower jig 83, and the solid pieces 71 are placed in the space defined by the positioning block 85.

Further, the holding plate 84 is
a, it is rotatably attached to the lower jig 83, and is automatically opened when the solid piece 71 is placed on the lower jig 83, and is closed by its own weight in the washing position. ing. FIG. 25 is an explanatory diagram showing the configuration of the opening / closing mechanism of the holding plate 84. As shown in FIG. 25, at the cleaning position (the lower side), the holding plate 84 is closed on the lower jig 83 due to its own weight.
On the other hand, when the cleaning jig 80 moves up to the solid piece mounting position (upper side), the roller 86 comes into contact with the engaging piece 88 provided in the cleaning tank 12. When the cleaning jig 80 still moves up, the arm 89 to which the roller 86 is attached is attached.
Is activated, and the holding plate 84 is flipped upward. As a result, when reaching the solid piece mounting position, the holding plate 84 is held in the state shown in the upper part of FIG. 25, and solid piece mounting becomes possible.

On the other hand, when the solid piece is mounted and descends to the washing position, the pressing plate 84 gradually starts to close due to its own weight, and when the roller 86 comes off from the engaging piece 88, the pressing plate 84 is placed on the lower jig 83. Overlap. As a result, the solid pieces 71 placed on the lower jig 83 are
Will be suppressed.

As described above, the cleaning device according to the present invention can not only clean the electronic component 23 using the frame 32 but also remove the solid piece 71 without using the frame 32.
Can be directly handled for washing. The size of the lower jig 83 and the holding plate 84 can be changed as appropriate according to the size of the solid piece 71.

Although the invention made by the present inventor has been specifically described based on the embodiments, the present invention is not limited to the above embodiments and can be variously modified without departing from the gist thereof. Needless to say,

For example, the first embodiment shows an example in which four electronic components 23 are mounted on the frame 32, and the second embodiment shows an example in which eight solid pieces 71 can be washed at once. The number is not limited to this.

In the above description, the case where the invention made by the present inventor is mainly applied to the cleaning of a semiconductor device such as a CSP, which is a field of application, has been described. However, the present invention is not limited to this. And cleaning of other electronic devices.

[0078]

Advantageous effects obtained by typical ones of the inventions disclosed in the present application will be briefly described.
It is as follows.

(1) By washing the electronic component by swinging it in front of the injection hole, it is possible to remove flux, dirt, and the like more efficiently than in the conventional method.

(2) Since the electronic components are placed vertically for cleaning, a large space is not required unlike a shower cleaning device by belt conveyance, and a compact cleaning device can be provided. In addition, the cleaning liquid is not brought into the next stage.

(3). By performing liquid removal using centrifugal force, the washing liquid can be saved. In addition, since the carry-in of the cleaning liquid to the subsequent stage can be reduced, the rinsing and drying processes in the subsequent stage become easy, and the burden on wastewater treatment is reduced. Further, by enabling the removed cleaning liquid to be easily collected, the cleaning liquid can be recycled. Therefore, the running cost can be reduced by reducing the cost of the cleaning liquid and the time required for the drying step.

[Brief description of the drawings]

FIG. 1 is an explanatory diagram illustrating a configuration of an electronic component cleaning device according to a first embodiment of the present invention.

FIG. 2 is an explanatory view showing a state where the cleaning device of FIG. 1 is viewed from above.

FIG. 3 is an explanatory view schematically showing a cleaning machine used in the cleaning apparatus of FIG. 1;

FIG. 4 is an explanatory view schematically showing a cleaning machine used in the cleaning apparatus of FIG. 1;

FIG. 5A is an explanatory diagram showing a configuration of a jet nozzle,
It is a front view of a jet nozzle.

FIG. 5B is an explanatory diagram showing a configuration of a jet nozzle;
It is a side view of a jet nozzle.

FIG. 6A is an explanatory view showing a configuration of a cleaning jig, and is a front view of the cleaning jig.

FIG. 6B is an explanatory view showing a configuration of the cleaning jig, and is a plan view of the cleaning jig.

7 is an explanatory view showing a configuration of a holding plate used in the cleaning jig of FIGS. 6a and 6b, and is a view in the direction of arrow A in FIG. 6a.

FIG. 8 is an explanatory view showing a state in which an electronic component held by a cleaning jig is cleaned by a jet jet ejected from a jet outlet.

FIG. 9 is an explanatory diagram showing a configuration of a liquid draining device used in the cleaning device of FIG. 1;

FIG. 10 is a table showing data when liquid drainage is actually performed using the liquid drainage device of FIG. 9;

FIG. 11 is a graph showing the results of FIG.

FIG. 12 is a table comparing the drainage effects of various drainage methods.

FIG. 13 is a graph showing the relationship between the rotation speed and the remaining water content in the data of FIG.

FIG. 14 is an explanatory diagram showing a configuration of a drying device used in the cleaning device of FIG. 1;

FIG. 15 is a table showing data comparing the remaining amount of water when the liquid is drained by the liquid draining device and the remaining amount of water when the water droplets on the surface are wiped off with a tissue.

FIG. 16 shows a case where the rotational speed is 1000 RPM and 2000 RPM.
It is a table | surface which shows the data which compared the drying time in case of PM.

FIG. 17 is a graph showing the results of FIG.

FIGS. 18A and 18B are explanatory diagrams showing a configuration of a chuck unit used in the transfer device, wherein FIG. 18A is a state in which a frame is not held (open state), and FIG. FIG.

FIG. 19 is an explanatory diagram of the chuck unit viewed from a side.

FIG. 20 is an explanatory diagram showing an arrangement of a toe of a movable claw.

FIG. 21 is an explanatory diagram showing a cleaning processing pattern.

FIG. 22 is a table showing the results of a cleaning test in the case of the oscillating jet system according to the present invention and another cleaning system.

FIG. 23a is an explanatory view showing a configuration of a chuck unit used in a transfer device used in a cleaning apparatus according to Embodiment 2 of the present invention, and is a front view of the chuck unit.

FIG. 23b is an explanatory view showing a configuration of a chuck unit used in the transfer device used in the cleaning device according to the second embodiment of the present invention, and is a side view of the chuck unit.

FIG. 24a is an explanatory diagram showing a configuration of a cleaning jig used in a cleaning machine used in a cleaning apparatus according to Embodiment 2 of the present invention, and is a plan view of the cleaning jig.

FIG. 24b is an explanatory diagram showing a configuration of a cleaning jig used in the cleaning machine used in the cleaning device according to the second embodiment of the present invention, and is a front view of the cleaning jig.

FIG. 25 is an explanatory diagram showing a configuration of a holding plate opening / closing mechanism.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Supply part 2 Cleaning part 3 Drying part 4 Storage part 5 Transfer device 6 Pre-cleaning part 7 Pre-cleaning liquid cutting part 8 Post-cleaning part 9 Post-cleaning liquid cutting part 10 Magazine 11a Full magazine supply part 11b Empty magazine storage part 12 Cleaning tank 13 Cleaning Machine 13a washing machine 13b washing machine 13c washing machine 13d washing machine 13e washing machine 13f washing machine 14 washing tank 14a washing tank 14b washing tank 14c washing tank 15 liquid draining device 15a liquid draining device 15b liquid draining device 16a empty magazine supply section 16b full Magazine storage unit 17 Cleaning jig 18 Jet nozzle 19 Slot hole 20 Nozzle unit 20a Upper frame 21 Jet injection hole 22 Holding plate 22a Groove 23 Electronic component 24 Supply pipe 24a Nozzle support 24b Introduction pipe 25 Bracket 26 Jig frame 27a Jig Fixture base 27b Jig base 28 Electronic component holder 29 Support REFERENCE SIGNS LIST 30 holding plate 30 a base 31 drain pipe 31 a drain port 32 frame 32 a frame 32 b frame 32 c frame 32 d frame 32 e frame 33 liquid cutting jig 34 rotation drive unit 35 cover drive unit 36 rotation shaft 37 cover 38 bearing 39 bearing 40 frame 40 motor 40 a Output shaft 41 Drive pulley 42 Belt 43 Driven pulley 45 Partition plate 46 Drainage chamber 47 Drain port 48 Bearing body 49 Bearing body 50 Cover mounting plate 51 Rotary actuator 51a Output shaft 52 Drive pulley 53 Belt 54 Driven pulley 55 Drying tank 56 Drying Jig 57 Sirocco fan 58 Heater 59 Guide rail 60 Chuck unit 60a Chuck unit 60b Chuck unit 61 Open / close beam 62 Open / close beam 63 Movable claw 6 a Movable claw 63b Movable claw 64 Pad 65 Motor 66 Drying device 67 Bracket 67a Handle 70 Chuck unit 71 Solid piece 72 Press pad 73 Movable claw 74 Open / close beam 75 Press pin 76 Spring 77 Restriction pin 77a Small diameter section 80 Cleaning jig 82 Base Table 83 Lower jig 84 Plate 84a Supporting part 85 Positioning block 86 Roller 88 Engagement piece 89 Arm

Claims (11)

[Claims] 1. An electronic component cleaning method for cleaning an object to be cleaned by injecting a cleaning liquid onto the object to be cleaned, wherein the object to be cleaned is placed in front of an injection hole from which the cleaning liquid is injected. An electronic component cleaning method, comprising a cleaning step of cleaning the object to be cleaned by oscillating the cleaning object by injecting a cleaning liquid from the injection hole to the object to be cleaned in the oscillating state. 2. The electronic component cleaning method according to claim 1, wherein a cleaning liquid is sprayed on the object to be cleaned in the cleaning liquid. 3. The electronic component cleaning method according to claim 1, wherein a cleaning liquid is sprayed on the object to be cleaned in air. 4. An electronic component cleaning method for cleaning an object to be cleaned by immersing the object to be cleaned in a cleaning liquid, wherein the object to be cleaned is oscillated in the cleaning liquid to be in an oscillating state. An electronic component cleaning method, comprising a cleaning step of cleaning the object to be cleaned by applying ultrasonic waves to the object to be cleaned. 5. The method for cleaning an electronic component according to claim 1, wherein a cleaning liquid attached to the object to be cleaned is removed using a centrifugal force in the cleaning step. An electronic component cleaning method comprising a step. 6. The electronic component cleaning method according to claim 5, further comprising a second cleaning step and a second liquid removal step after the liquid removal step. 7. An electronic component cleaning apparatus for cleaning an object to be cleaned by injecting a cleaning liquid onto the object to be cleaned, comprising: a nozzle having an injection hole for injecting the cleaning liquid; A cleaning jig that is provided to be swingable in front of the hole, moves in front of the injection hole while holding the object to be cleaned, and cleans the object to be cleaned with the cleaning liquid injected from the injection hole. An electronic component cleaning apparatus comprising: 8. The electronic component cleaning apparatus according to claim 7, wherein the cleaning jig vertically stores and holds the object to be cleaned. 9. The electronic component cleaning apparatus according to claim 7, wherein the injection holes are arranged in a cleaning tank containing the cleaning liquid, and the cleaning liquid is injected into the cleaning object in the cleaning liquid. Electronic parts cleaning equipment. 10. The electronic component cleaning apparatus according to claim 7, further comprising a liquid draining jig for storing the object to be cleaned which has been cleaned by the cleaning jig. An electronic component cleaning apparatus, further comprising a liquid removal device for removing the cleaning liquid attached to the object to be cleaned by centrifugal force by rotating the liquid removal jig. 11. An electronic component cleaning apparatus for cleaning an object to be cleaned by immersing the object to be cleaned in a cleaning solution, wherein the cleaning device oscillates in the cleaning solution while holding the object to be cleaned. A jig, a jet nozzle or an ultrasonic generator is formed so as to be replaceable, and the cleaning is performed by jetting a cleaning liquid or applying ultrasonic waves to the object to be cleaned in the oscillating state to wash the object to be cleaned. An electronic component cleaning apparatus comprising: a unit;