JP2003100687A - Substrate treating device and its cleaning method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To make the hydrophilic properties of constituent members using hydrophilic members (hydrophilic members) of a substrate treating device maintainable without removing the members from the device nor stopping the device. SOLUTION: The substrate treating device has a substrate holding section 12 which rotates a substrate W while holding the substrate W and treats the substrate W held by means of the section 12 by supplying a treating liquid. The device uses hydrophilic members 40a-40d on at least the surfaces of the constituent members 16, 18, 22, and 24 to which the treating liquid adheres at the time of treating the substrate W by supplying the treating liquid. At the same time, the device is provided with a cleaning solution supply section 42 which supplies the treating liquid to the surfaces of the members 40a-40d.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate processing apparatus and a cleaning method therefor, and more particularly to a semiconductor wafer, a glass substrate,
A substrate processing apparatus such as a cleaning apparatus, an etching apparatus, a resist coating apparatus, and a cleaning method including a spin drying step of supplying a predetermined processing liquid to a substrate such as a liquid crystal panel to process the substrate, and then spin drying. Regarding

[0002]

2. Description of the Related Art For example, in a semiconductor device manufacturing process, a surface of a substrate such as a semiconductor wafer is subjected to a copper plating treatment or a CMP (chemical mechanical polishing) treatment, and then a cleaning for removing impurities and contaminants. The treatment is widely performed.

As a substrate cleaning device (substrate processing device) for cleaning the substrate, a substrate holding part for holding the substrate horizontally and rotating it, and a chemical solution for the front and back surfaces of the substrate held by the substrate holding part A processing liquid supply unit (processing liquid supply nozzle) for supplying a processing liquid such as pure water is provided, and the processing liquid is supplied to the substrate while rotating the substrate, and then pure water for rinsing is supplied to the substrate. It is generally known that the substrate is cleaned by cleaning. In this type of substrate cleaning device,
It is also widely practiced to spin the substrate by spinning it at a high speed after the cleaning process.

As described above, in the substrate processing apparatus in which the processing of the substrate with the processing solution and the spin-drying are continuously performed in the same module, the processing solution such as the chemical solution remains on the surface of the components of the apparatus. Sometimes. And like this,
When the treatment liquid remains on the surface of the component member of the apparatus, the droplet may reattach to the substrate or may be dried and cause particles.

For this reason, by using a hydrophilic member in which the liquid does not easily remain in the apparatus constituent member to which the processing liquid adheres during the processing such as cleaning, the residue of the processing liquid is stopped on the surface of the apparatus constituent member. Something is being done to prevent it.

[0006]

However, even if a hydrophilic member in which a liquid is less likely to remain is used as a component member of the apparatus, as the substrate is processed, the processing liquid contaminated from the substrate and organic substances in the atmosphere become dirty. May adhere to the surface of the hydrophilic member, which may gradually change the surface of the hydrophilic member to a hydrophobic surface. Then, when the surface of the hydrophilic member is changed to a hydrophobic surface in this way, the liquid is likely to remain on this surface, and in order to prevent this, the device constituent member using the hydrophilic member is removed from the device. There was a problem that it was necessary to replace or wash.

The present invention has been made in view of the above, and has a device component (hydrophilic member) without removing the device component using a hydrophilic member from the device or stopping the device. An object is to provide a substrate processing apparatus capable of maintaining hydrophilicity.

[0008]

According to a first aspect of the present invention, there is provided a substrate holding unit for holding and rotating a substrate, and a processing liquid is supplied to the substrate held by the substrate holding unit to process the substrate. In a substrate processing apparatus, a hydrophilic member is used on at least the surface of an apparatus component member to which the processing liquid adheres when the processing liquid is supplied to process the substrate, and a cleaning liquid containing a chemical liquid is supplied to the surface of the hydrophilic member. The substrate processing apparatus is provided with a cleaning liquid supply unit.

As a result, it is possible to prevent the treatment liquid from remaining on the surface of the apparatus constituting member using the hydrophilic member, and to prevent the droplets and the like from adhering to the substrate, and moreover, the surface of the hydrophilic member contains the chemical liquid. By supplying a cleaning liquid to clean the surface,
It is possible to prevent the surface of the hydrophilic member from becoming contaminated with the dirty processing liquid from the substrate, organic matter in the air, and the like to become a hydrophobic surface.

According to a second aspect of the present invention, the apparatus constituting member includes a substrate holding part for holding and rotating a substrate, a processing liquid supply part for supplying a processing liquid to the substrate held by the substrate holding part, and the substrate. 2. The substrate processing apparatus according to claim 1, further comprising a scattering prevention cup that surrounds the periphery of the holding portion to prevent the processing liquid from scattering.

According to a third aspect of the present invention, the cleaning liquid comprises:
The substrate processing apparatus according to claim 1, wherein the substrate processing apparatus is a liquid containing at least one of an alkali and an oxidizing agent. When a cleaning liquid containing an alkali or an oxidant is sprinkled on the deposit such as an organic substance deposited on the surface of the hydrophilic member, the deposit is separated from the surface of the hydrophilic member, whereby the deposit is separated from the surface of the hydrophilic member. It can be easily removed.

According to a fourth aspect of the present invention, a hydrophilic member is used on at least the surface of an apparatus constituting member to which the processing liquid adheres when the processing liquid is supplied to the substrate held by the substrate holding unit to process the substrate. The method for cleaning a substrate processing apparatus is characterized in that the surface of the hydrophilic member is cleaned with a cleaning solution containing a chemical solution. The invention according to claim 5 is the method for cleaning a substrate processing apparatus according to claim 4, wherein the cleaning liquid is a liquid containing at least one of an alkali and an oxidizing agent.

According to a sixth aspect of the present invention, a hydrophilic member is used on at least the surface of an apparatus constituting member to which the processing liquid adheres when the processing liquid is supplied to process the substrate, and the hydrophilic member is formed on the surface of the hydrophilic member. A plating apparatus comprising: a cleaning device having a cleaning liquid supply unit for supplying a cleaning liquid containing a chemical liquid; and a plating treatment tank for plating the surface of a substrate.

According to a seventh aspect of the present invention, a hydrophilic member is used on at least the surface of an apparatus constituting member to which the processing liquid adheres when the processing liquid is supplied to process the substrate, and the hydrophilic member is formed on the surface of the hydrophilic member. A CMP comprising: a cleaning device having a cleaning liquid supply unit for supplying a cleaning liquid containing a chemical liquid, a polishing unit having a polishing table and a top ring for polishing the surface of the substrate, and a transfer robot for transferring the substrate.
It is a device.

[0015]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 shows a substrate processing apparatus according to an embodiment of the present invention, which is applied to a single-wafer type substrate cleaning apparatus in which substrates are cleaned one by one and spin-dried.

This substrate cleaning apparatus (substrate processing apparatus) has a substrate holding section 12 which is disposed inside the cleaning cover 10 and holds the substrate W detachably. This substrate holder 1
The reference numeral 2 includes a disc-shaped support plate 16 which is connected to the upper end of the substrate rotating mechanism 14 and rotates, and a plurality of spin chucks 18 which are provided upright on the outer peripheral portion of the support plate 16 with a predetermined interval. The spin chuck 18 detachably holds the peripheral edge of the substrate W.

A surface nozzle (processing liquid supply unit) 2 located above the side of the substrate holding unit 12 and supplying a processing liquid such as a chemical liquid or pure water to the surface of the substrate W held by the substrate holding unit 12.
0 is located on the upper surface of the central portion of the support plate 16 and
Back surface nozzles (processing liquid supply unit) 22 for supplying a processing liquid such as a chemical liquid or pure water are arranged on the back surface of the substrate W held by 2. Here, for cleaning the substrate W, various treatment liquids are used and supplied to the front and back surfaces of the substrate. Examples of the treatment liquid include ammonia hydrogen peroxide, hydrochloric acid hydrogen peroxide, dilute hydrofluoric acid, and the like. .

Although not shown, when applied to an etching apparatus, for example, various etching solutions are used as a processing solution and supplied to the surface of the substrate. For example, an etching solution of copper (processing solution) is used. Examples thereof include dilute hydrofluoric acid and hydrogen peroxide water, and examples of the processing liquid used for cleaning the back surface include the processing liquid used for the cleaning and hydrogen peroxide water. Furthermore, when applied to a resist coating apparatus, various resist solutions are used as processing solutions and supplied to the surface of the substrate.

Further, a substantially cylindrical shatterproof cup 24 is arranged so as to be movable up and down, and this shatterproof cup 24 surrounds the periphery of the substrate holding part 12 when raised and holds the substrate held by the substrate holding part 12. When the W is washed with the processing liquid, the processing liquid is prevented from scattering and the substrate holding portion 12 is opened when the W is lowered.

At the bottom of the cleaning cover 10, the drain port 2
6 is provided, and this drain port 26 is provided with a cleaning cover 10
It communicates with the steam separator 28 which is arranged outside. The gas separated by the steam separator 28 is exhausted by the exhaust pipe 30.
Therefore, the liquid is discharged from the drain pipe 32.

Here, a hydrophilic member is used on the surface of the apparatus constituting member to which the substrate W is held by the substrate holder 12 and to which the treatment liquid adheres when the treatment liquid is supplied and washed. That is, in this example, the support plate 16 of the substrate holding unit 12 is
Of the spin chuck 18, the hydrophilic member 40b on the entire outer peripheral surface of the spin chuck 18, the hydrophilic member 40c on the entire outer peripheral surface of the back nozzle 22, and the hydrophilic member 40d on the inner peripheral surface of the shatterproof cup 24. Are used respectively.

As described above, by using the hydrophilic members 40a to 40d in which the liquid does not easily remain on the surfaces of the device constituting members 16, 18, 22, 24 to which the treating liquid adheres, the residue of the treating liquid is constituted. By preventing the processing liquid from remaining on the surfaces of the members 16, 18, 22, and 24, it is possible to prevent the droplets and the like from adhering to the substrate.

Then, located directly above the substrate holding portion 12, the apparatus constituting members 16, 18, 22, to which the processing liquid adheres,
The cleaning liquid containing the chemical liquid is supplied to the surfaces of the hydrophilic members 40a to 40d used for the surfaces of the hydrophilic members 40a to 40d.
A cleaning nozzle (cleaning liquid supply unit) 42 for cleaning d is arranged. As a result, for example, after the cleaning process for one substrate is completed, the cleaning process for an arbitrarily set number of substrates is completed, or after an arbitrarily set time has elapsed, the cleaning nozzle 42 is first made hydrophilic. Member 40a-40d
The cleaning liquid is supplied toward the surface of the member to clean it with the chemical liquid, and thereafter, the hydrophilic member 40a to the hydrophilic member 40a through the cleaning nozzle 42.
Pure water for rinsing is supplied toward the surface of 40d to rinse the surfaces of the hydrophilic members 40a to 40d. Thus, by cleaning the surfaces of the hydrophilic members 40a to 40d with the cleaning liquid, It is possible to prevent the surfaces of the elastic members 40a to 40d from becoming contaminated by the dirty processing liquid from the substrate W or organic substances in the air and becoming a hydrophobic surface.

As described above, when the cleaning liquid containing at least one of the alkali and the oxidizing agent is sprinkled on the deposit (treatment liquid) such as organic substances deposited on the surfaces of the hydrophilic members 40a to 40d, the deposit is hydrophilic. ~ 40d from the surface of the hydrophilic member 40a ~ 40d.
It can be easily removed from the surface of d.

As the cleaning liquid, for example, a liquid containing at least one of an alkali and an oxidizing agent is used. As the alkaline, an organic alkali such as ammonia or tetramethylammonium hydroxide is used, and as the oxidizing agent, hydrogen peroxide is used. Examples include water.

In this example, since the front surface nozzle 20 is arranged at a position where the treatment liquid does not adhere, a hydrophilic member is not used on this surface, but the front surface nozzle 20 does not adhere to the treatment liquid. In the case where the treatment liquid is placed on the surface, a hydrophilic material may be used on the surface to which the treatment liquid is attached. Further, the device constituent members 16, 18, 22, to which the processing liquid adheres,
Although the hydrophilic members 40a to 40d are used only on the surface of 24, such a device-constituting member may be formed of a hydrophilic member.

Next, the substrate cleaning processing by the substrate cleaning apparatus (substrate processing apparatus) of this embodiment and the cleaning processing by this substrate cleaning apparatus will be described. First, with the shatterproof cup 24 lowered, a substrate W is inserted into the cleaning cover 10 through a substrate loading / unloading hole (not shown) provided in the cleaning cover 10 with a robot hand or the like to hold the substrate. It is held by the spin chuck 18 of the unit 12. After that, the scattering prevention cup 24 is raised. In this state, the substrate is rotated at, for example, 1 to 2000 rpm, and during this rotation, the processing liquid is supplied to the front and back surfaces of the substrate W from the front surface nozzle 20 and the back surface nozzle 22 to process (clean) the substrate W with the processing liquid. After that, pure water as a rinse liquid is supplied to the front and back surfaces of the substrate W from the front surface nozzle 20 and the back surface nozzle 22 for rinsing.

Next, the front surface nozzle 20 and the rear surface nozzle 22
The supply of pure water from the above is stopped, and thereafter, the substrate W is rotated at a high speed of, for example, 1500 rpm to 3000 rpm to be spin-dried. Then, the rotation of the substrate W is stopped,
After lowering the scattering prevention cup 24, the spin-dried substrate is received from the spin chuck 18 of the substrate holder 12 by a robot hand or the like, taken out from the inside of the cleaning cover 10 and conveyed to the next step.

Here, for example, every time a substrate is cleaned by the substrate cleaning device, an arbitrarily set number of substrates are processed, or the substrate cleaning device is cleaned at an arbitrarily set time.

That is, with the anti-scatter cup 24 raised, the substrate holder 12 is moved to, for example, 1 to 2000 rpm.
The cleaning liquid is supplied from the cleaning nozzle 42 to the surfaces of the hydrophilic members 40a to 40d used on the surfaces of the apparatus constituent members 16, 18, 22, 24 to which the processing liquid adheres during the rotation. The cleaning treatment of the surface with a cleaning liquid of -40d is performed for several seconds to 30 seconds, for example. After that,
Pure water as a rinse liquid is supplied from the cleaning nozzle 42 to the surfaces of the hydrophilic members 40a to 40d, and a rinse treatment with pure water is performed for, for example, several seconds to 60 seconds. Then, the supply of pure water from the cleaning nozzle 42 is stopped, and then the substrate holding unit 12 is rotated at a high speed of, for example, 1500 rpm to 3000 rpm to spin-dry.

In the above example, the present invention is applied to a substrate cleaning apparatus, but for example, a substrate processing apparatus including a spin process such as an etching apparatus, a resist coating apparatus and a resist stripping apparatus in general. Of course, it can be applied to. Further, for example, when a liquid containing an oxidizer or an alkali is used as the processing liquid, the processing liquid may be used as it is as a cleaning liquid. In such a case, cleaning is performed simultaneously with the processing of the substrate. .

FIG. 2 is a diagram showing an outline of a plating apparatus in which the substrate processing apparatus (substrate cleaning apparatus) shown in FIG. 1 is incorporated. This plating apparatus includes load / unload units 50 and 52 for receiving or unloading a substrate cassette (not shown) accommodating a substrate (not shown) such as a semiconductor wafer as a material to be processed, and a substrate 1 Two transfer robots 54 and 56 for transferring the substrates one by one, a pretreatment tank 58 for performing a pretreatment such as coating with a treatment liquid on the substrate surface, a plating treatment tank 60 for performing a plating treatment, and a rough substrate. It comprises a rough cleaning unit 62 that also functions as a load stage while cleaning, a substrate cleaning apparatus (substrate processing apparatus) 64 shown in FIG. Pretreatment tank 58 and plating treatment tank 6
0 may be one that simultaneously processes a plurality of substrates or may be a single wafer processing type. Further, it may be a dip type in which a plating solution or a processing solution is constantly held, or a type in which supply and discharge are repeated each time.

A method of performing a plating process in the plating apparatus having such a configuration will be described along the process flow of one substrate (not shown). First, the substrate cassette containing the substrates is mounted on the load / unload units 50 and 52. Next, the transfer robot 54 takes out the substrates one by one from the substrate cassette and transfers them to the rough cleaning unit (load stage) 62. The substrate is received by the transfer robot 56, and mounted on, for example, a pretreatment tank 58 containing a treatment liquid.
Then, after the substrate is immersed in the treatment liquid for a predetermined time to perform the pretreatment, the transfer robot 56 takes out the pretreated substrate from the pretreatment device 58 and places the substrate in the plating treatment tank 60 containing the plating liquid. Mount and perform electrolytic copper plating.

After the plating is completed, the transfer robot 56 takes out the plated substrate from the plating treatment tank 60 and mounts it on the rough cleaning unit 62. Here, the first cleaning of the substrate (rough cleaning) is performed. Next, the transfer robot 54 takes out the substrate from the rough cleaning unit 62, transfers it to the substrate cleaning device 64, performs the second cleaning, and continuously performs the drying. Next, the transfer robot 54 transfers the substrate from the substrate cleaning device 64 to the load / unload unit 50,
It is transferred to the substrate cassette in 52, carried out as a clean plated substrate, and transferred to the next step such as CMP. In this apparatus, there are a plurality of pretreatment baths 58 and plating treatment baths 60, and the transfer robots 54, 56 are controlled and programmed so as to continuously and efficiently process the substrates, and the operating rate is very high. It is a device.

FIG. 3 shows a CMP apparatus incorporating the substrate cleaning apparatus (substrate processing apparatus) shown in FIG. As shown in FIG. 3, in this CMP apparatus, a pair of polishing sections 201a and 201b are arranged to face each other at one end of a space on the floor having a rectangular shape, and a substrate cassette is mounted on each of the other ends. Place a pair of load / unload units 202
a and 202b are arranged. Polishing parts 201a, 20
1b and load / unload unit 202a, 202b
A transfer robot 204 for transferring the substrate is provided on the line connecting
Two a and 204b are arranged to form a transfer line. On both sides of this transfer line, one reversing machine 205, 206 and rough cleaning units 207a, 207b for carrying out rough cleaning with the reversing machine 205, 206 interposed respectively are shown in FIG.
Substrate cleaning apparatus (substrate processing apparatus) 208a, 208 shown in FIG.
b and are arranged.

The two polishing units 201a and 201b basically have the same specifications and are arranged symmetrically with respect to the transfer line. The polishing table 211 has a polishing cloth attached to its upper surface, and the polishing target is a polishing object. A top ring unit 212 that holds a certain substrate by vacuum suction and presses it onto the polishing table 211 to polish it, and a dressing unit 213 that dresses the polishing cloth on the polishing table 211 are provided. In addition, the polishing unit 201a,
The pusher 2 for transferring the substrate to and from the top ring unit 212 is provided on each of the transfer lines 201b.
14 are provided. The polishing table may be a turntable type, a scroll type, a belt type, or the like.

Each of the transfer robots 204a and 204b has a joint arm that is bendable in a horizontal plane, and uses two upper and lower grips as a dry finger and a wet finger, respectively. Since two robots are used in this embodiment, the first robot 204a is basically used.
Indicates cassettes 202a, 202 from the reversing machines 205, 206.
The second robot 204b uses the reversing machine 205,
The areas on the side of the polishing portions 201a and 201b with respect to 206 are respectively taken over.

The reversing machines 205 and 206 are for reversing the semiconductor wafer upside down, and the transfer robots 204a and 204a.
It is arranged at a position where the hand of b can reach. In the present embodiment, the two reversing machines 205 and 206 are separately used for handling a dry substrate and for handling a wet substrate. Rough cleaning unit 207 for performing rough cleaning (primary cleaning)
The type of a and 207b is arbitrary, but for example, it is a cleaning unit of the type in which both the front and back surfaces of the substrate are wiped with a roller having a sponge.

In the CMP apparatus having such a configuration, C
A method of performing MP processing will be described along the processing flow of one substrate (not shown). First, the substrate cassette containing the substrates is mounted on the load / unload units 202a and 202b. Next, the transfer robot 204a takes out the substrates one by one from the substrate cassette and transfers them to the reversing machine 205 to invert them. The transfer robot 2 transfers the substrate after the reversal.
04b receives and transfers to pusher 214. The substrate on the pusher 214 is suction-held by the top ring unit 212, and the substrate is rotated through the top ring unit 212, and is pressed against the rotated polishing table 211 with a predetermined pressure, whereby the surface of the substrate ( Polish the bottom surface). Then, the polished substrate is pushed by a pusher 2
Return to 14.

Then, the substrate after polishing is transferred to the robot 204.
b is removed from the pusher 214, and the rough cleaning unit 2
It is attached to 07a. Here, the first cleaning of the substrate (rough cleaning) is performed. Next, the transfer robot 204a takes out the substrate from the rough cleaning unit 207a, and the reversing machine 205
Invert with. After that, the transfer robot 204a moves the substrate to the substrate cleaning device 208a to perform the second cleaning and continuously dry the substrate. Next, the transfer robot 2
04a allows the substrate to be transferred from the substrate cleaning device 208a to the substrate cassettes 202a, 2a in the loading / unloading unit.
It is moved to 02b and is discharged as a clean CMP-processed substrate.

[0041]

As described above, according to the present invention,
By supplying a cleaning liquid containing a chemical solution to the surface of the hydrophilic member and cleaning the surface, the surface of the hydrophilic member is contaminated with the treatment liquid soiled from the substrate, organic matter in the air, etc. Can be prevented. As a result, the hydrophilicity of the device component (hydrophilic member) can be maintained without removing the device component using the hydrophilic member from the device or stopping the device.

[Brief description of drawings]

FIG. 1 is a cross-sectional view showing a substrate processing apparatus applied to a substrate cleaning apparatus according to an embodiment of the present invention.

FIG. 2 is a plan layout view of a plating apparatus incorporating the substrate cleaning apparatus (substrate cleaning apparatus) shown in FIG.

FIG. 3 is a plan layout view of a CMP apparatus incorporating the substrate cleaning apparatus (substrate cleaning apparatus) shown in FIG.

[Explanation of symbols]

10 Wash cover 12 Substrate holder 16 Support plate 18 Spin chuck 20 Surface nozzle (treatment liquid supply part) 22 Backside nozzle (treatment liquid supply unit) 24 Shatterproof cup 28 steam separator 40a-40d hydrophilic member 42 Cleaning nozzle (cleaning liquid supply unit) W board

Front page continuation (51) Int.Cl. ⁷ Identification code FI theme code (reference) H01L 21/306 H01L 21/306 JF term (reference) 3B201 AA02 AA03 AB34 BB24 BB92 BB93 BB96 CC01 CC13 CD11 5F043 DD13 EE07 EE08 EE40

Claims (7)

[Claims] 1. A substrate processing apparatus which has a substrate holding unit for holding and rotating a substrate, and supplies a processing liquid to the substrate held by the substrate holding unit to process the substrate. A substrate processing, characterized in that a hydrophilic member is used on at least the surface of an apparatus constituent member to which the processing liquid adheres during processing, and a cleaning liquid supply unit for supplying a cleaning liquid containing a chemical liquid to the surface of the hydrophilic member is provided. apparatus. 2. The apparatus constituting member encloses a substrate holding part for holding and rotating a substrate, a processing liquid supply part for supplying a processing liquid to the substrate held by the substrate holding part, and a periphery of the substrate holding part. The substrate processing apparatus according to claim 1, further comprising a scattering prevention cup for preventing the processing liquid from scattering. 3. The substrate processing apparatus according to claim 1, wherein the cleaning liquid is a liquid containing at least one of alkali and oxidant. 4. A hydrophilic member is used as at least the surface of an apparatus constituting member to which the processing liquid is attached when the processing liquid is supplied to the substrate held by the substrate holding part and the hydrophilic member is used as the surface of the hydrophilic member. The method for cleaning a substrate processing apparatus comprises cleaning the substrate with a cleaning liquid containing a chemical liquid. 5. The cleaning method for a substrate processing apparatus according to claim 4, wherein the cleaning liquid is a liquid containing at least one of an alkali and an oxidizing agent. 6. A hydrophilic member is used on at least the surface of an apparatus constituting member to which the processing liquid is attached when the processing liquid is supplied to process the substrate, and a cleaning liquid containing a chemical liquid is supplied to the surface of the hydrophilic member. A plating apparatus comprising: a cleaning apparatus having a cleaning liquid supply unit; and a plating treatment tank for plating the surface of a substrate. 7. A hydrophilic member is used on at least the surface of an apparatus constituting member to which the processing liquid adheres when the processing liquid is supplied to process the substrate, and a cleaning liquid containing a chemical liquid is supplied to the surface of the hydrophilic member. A CMP apparatus comprising: a cleaning device having a cleaning liquid supply unit, a polishing unit having a polishing table and a top ring for polishing the surface of a substrate, and a transfer robot for transferring the substrate.