JPS60183788A - Developing unit for printed circuit board - Google Patents

Developing unit for printed circuit board

Info

Publication number
JPS60183788A
JPS60183788A JP3859784A JP3859784A JPS60183788A JP S60183788 A JPS60183788 A JP S60183788A JP 3859784 A JP3859784 A JP 3859784A JP 3859784 A JP3859784 A JP 3859784A JP S60183788 A JPS60183788 A JP S60183788A
Authority
JP
Japan
Prior art keywords
printed circuit
circuit board
organic solvent
tank
photoresist
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3859784A
Other languages
Japanese (ja)
Inventor
小出 敏夫
嶋崎 威
塚原 伸一郎
山寺 利夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Plant Construction Co Ltd
Hitachi Ltd
Hitachi Plant Technologies Ltd
Original Assignee
Hitachi Plant Construction Co Ltd
Hitachi Ltd
Hitachi Plant Technologies Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Plant Construction Co Ltd, Hitachi Ltd, Hitachi Plant Technologies Ltd filed Critical Hitachi Plant Construction Co Ltd
Priority to JP3859784A priority Critical patent/JPS60183788A/en
Publication of JPS60183788A publication Critical patent/JPS60183788A/en
Pending legal-status Critical Current

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  • Manufacturing Of Printed Circuit Boards (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 〔発明の利用分野〕 本発明は、印刷回路板上に形成されたフォトレジストを
現像する装置に係り、特に現像中の高密度の印刷回路板
に対して超音波が適用されるような現像装置に関する。
DETAILED DESCRIPTION OF THE INVENTION [Field of Application of the Invention] The present invention relates to an apparatus for developing a photoresist formed on a printed circuit board, and in particular to an apparatus for developing a photoresist formed on a printed circuit board, and more particularly, to The present invention relates to a developing device as applied thereto.

〔発明の背景〕[Background of the invention]

印刷回路板上に形成されたフォトレジストの従来の現像
装置の例について、以下第1図を用いて説明する。第1
図において、スプレー現像槽1は水平搬送コンベア5に
よって搬送される印刷回路板に対してスプレーノズル6
から有機溶剤ヲ配線パターンにスプレーして現作する現
像槽である。スプレーリンス槽6は、有機溶剤をスプレ
ーするスプレーノズル6を備え、印刷回路板上のフォト
レジストを含んだ有機溶剤を新しい有機溶剤によって洗
い流すための洗浄槽である。また水洗スプレー槽4は、
水をスプレーするスプレーノズル6を備え、印刷回路板
上の有機溶剤を除去する洗浄槽である。
An example of a conventional developing apparatus for photoresist formed on a printed circuit board will now be described with reference to FIG. 1st
In the figure, a spray developer tank 1 is provided with a spray nozzle 6 for a printed circuit board conveyed by a horizontal conveyor 5.
This is a developing tank that sprays an organic solvent onto the wiring pattern to develop it. The spray rinse tank 6 is a cleaning tank equipped with a spray nozzle 6 for spraying an organic solvent, and used to wash away the organic solvent containing the photoresist on the printed circuit board with a new organic solvent. In addition, the washing spray tank 4 is
This cleaning tank is equipped with a spray nozzle 6 that sprays water and removes organic solvents from printed circuit boards.

このような従来の現像装置ηにおいては、配線パターン
が高密度化し、配線パターン間隔が小さくなると、次の
ような問題が生じる。すなわち、配線パターン間隔が小
さい部分では、現像カ進ムにつれて、スプレーされた有
機溶剤が配線パターンの間に溜りやすく、新しい有1幾
溶剤が供給されにくくなる。一方、パターン間隔が比較
的大きい部分では、液が流れやすいため、スプレーされ
た有機溶剤が溜ることはなく、新しい有機溶剤が充分供
給される。この有機溶剤の供給量の差がフォトレジスト
の現像速度の差ζどなり、配線パターン間隔の小さい部
分は現像速度が遅くなって、配線パターン間隔が比較的
大きい部分は現像速度が早くなる。従って、印刷回路板
の同一面内に配線パターン間隔が異なるところがあれば
、現像速度の差によって現像後のフォトレジストパター
ンの寸法が異なってしまうため、従来方法は高精度を要
求される印刷回路板には適用できない。
In such a conventional developing device η, when the wiring pattern becomes denser and the interval between the wiring patterns becomes smaller, the following problems arise. That is, in areas where the wiring pattern spacing is small, as the development progresses, the sprayed organic solvent tends to accumulate between the wiring patterns, making it difficult to supply fresh solvent. On the other hand, in areas where the pattern spacing is relatively large, the liquid flows easily, so the sprayed organic solvent does not accumulate, and a sufficient amount of fresh organic solvent is supplied. This difference in the amount of organic solvent supplied results in a difference ζ in the development speed of the photoresist, and the development speed is slow in areas where the wiring pattern spacing is small, and the development speed is fast in areas where the wiring pattern spacing is relatively large. Therefore, if there are areas with different wiring pattern intervals on the same surface of a printed circuit board, the dimensions of the photoresist pattern after development will differ due to the difference in development speed. cannot be applied to

また、水平搬送のスプレー処理では、印刷回路板の上面
と下面でスプレーされた有機溶剤の流れ方が異なるため
、これによってもフォトレジストの現像速度が異なると
いう結果になる。さらに、印刷回路板の上面のみについ
ても中央部ではスプレーされた有機溶剤が滞留しやすく
、端部では有機溶剤が落下しやすいため、これによって
も現像速度が異なり、現像後のフォトレジストのパター
ン寸法が異なってくる。
Furthermore, in the horizontal transport spray process, the flow of the sprayed organic solvent on the top and bottom surfaces of the printed circuit board is different, which also results in different photoresist development speeds. Furthermore, even on the top surface of a printed circuit board, the sprayed organic solvent tends to stay in the center, and the organic solvent tends to fall off at the edges, so the development speed varies depending on this, and the pattern size of the photoresist after development. will be different.

〔発明の目的〕[Purpose of the invention]

本発明の目的は、上記問題に対処するものであり、均一
な配線パターン寸法を得る印刷回路板の現像装置を提供
することにある。
SUMMARY OF THE INVENTION It is an object of the present invention to address the above-mentioned problems and to provide a printed circuit board development apparatus that provides uniform wiring pattern dimensions.

〔発明の概要〕[Summary of the invention]

フォトレジストの現像は、未露光フォトレジストを有機
溶剤で溶解除去することであり、パターン間隔に関係な
く広い部分と狭い部分の溶解速度を同じにするには、溶
解除去すべき部分への有機溶剤の供給が同じであれば良
い。新しい有機溶剤の供給およびフォトレジストを溶解
した有機溶剤の排除を均一にできるのは、浸漬するのが
良く、それに超音波を加えることにより現像速度を早く
することができる。
Photoresist development involves dissolving and removing the unexposed photoresist with an organic solvent.In order to make the dissolution rate the same in wide and narrow areas regardless of the pattern spacing, it is necessary to apply an organic solvent to the area to be dissolved and removed. It is good if the supply of is the same. It is best to use immersion to uniformly supply new organic solvent and remove the organic solvent that has dissolved the photoresist, and by adding ultrasonic waves to it, the development speed can be increased.

すなわち、本発明は現像すべき印刷回路板が現像液(有
機溶剤)によって浸漬される現像槽中に該印刷回路板の
配線パターン面に向けて超音波を発する超音波振動子を
設けた現像装置を特徴とする。
That is, the present invention provides a developing device that includes an ultrasonic vibrator that emits ultrasonic waves toward the wiring pattern surface of the printed circuit board in a developing tank in which the printed circuit board to be developed is immersed in a developer (organic solvent). It is characterized by

さらに以下超音波振動子の配置方法の一例として、複数
の超音波振動子を印刷回路板が現像槽中に搬送されるル
ートに沿って設け、配線パターン面に対して間欠的に超
音波が照射される例が開示される。
Furthermore, as an example of the method of arranging ultrasonic transducers below, multiple ultrasonic transducers are installed along the route along which the printed circuit board is conveyed into the developer tank, and the wiring pattern surface is intermittently irradiated with ultrasonic waves. Examples are disclosed.

〔発明の実施例〕[Embodiments of the invention]

以下、本発明の一実施例を第2図により説明する。この
現像装置は、浸漬現像槽7、スプレ+3ンス槽6、水洗
スプレー槽4、水平搬送コンベア5および超音波振動子
10を有する。浸漬現像Ml 7には、貯槽11から循
環ポンプ12により有機溶剤が供給され、オーバーフロ
ーした有機溶剤が貯槽11に戻る循環系路が設けてあり
、浸漬現像槽7の液面高さを一定に保っている。また浸
漬現像槽7には、水平搬送コンベア5の上側および下(
Ill Jこ超音波振動子10がそれぞれ2個ずつ計4
個配置しである。浸漬現像槽7の液面高さは、これらの
超音波撮動子10が有機溶剤中に浸される高さに設定し
である。印刷回路板は、図示されていない駆動用モータ
ーで駆動される水平搬送コンベア5により、まず浸漬現
像槽7へ搬送される。浸漬現像槽7へ入ると同時に有機
溶剤に浸漬され、未露光フォトレジストの溶解が始まる
。印刷回路板は、水平に搬送されながら、未露光フォト
レジストの溶解が除々に行なわれ、超音波振動子10の
近くを通過するとき、印刷回路板に超音波振動が加えら
れ、未露光フォトレジストの溶解が促進される。特に印
刷回路板上の配線パターン間隔の小さい部分は、浸漬だ
けでは有機溶剤の拡散が十分性なわれないため現像速度
が遅くなるが、このようにして超音波振動を加えること
により、有機溶剤の拡散が行なわれ、”現像速度を早く
することができる。
An embodiment of the present invention will be described below with reference to FIG. This developing device includes an immersion developing tank 7, a spray +3 ounce tank 6, a washing spray tank 4, a horizontal conveyor 5, and an ultrasonic vibrator 10. The immersion developer Ml 7 is provided with a circulation path through which an organic solvent is supplied from a storage tank 11 by a circulation pump 12 and the overflowing organic solvent returns to the storage tank 11 to keep the liquid level in the immersion development tank 7 constant. ing. In addition, the immersion developer tank 7 is located above and below the horizontal transport conveyor 5 (
A total of 4 ultrasonic transducers 10, 2 each
It is arranged individually. The liquid level height of the immersion developing tank 7 is set to such a level that these ultrasonic imagers 10 are immersed in the organic solvent. The printed circuit board is first transported to an immersion developer tank 7 by a horizontal transport conveyor 5 driven by a drive motor (not shown). As soon as it enters the immersion developing tank 7, it is immersed in an organic solvent, and the unexposed photoresist begins to dissolve. While the printed circuit board is being conveyed horizontally, the unexposed photoresist is gradually melted, and when the printed circuit board passes near the ultrasonic transducer 10, ultrasonic vibration is applied to the printed circuit board, and the unexposed photoresist is dissolved. Dissolution is promoted. Particularly in areas with small wiring pattern spacing on printed circuit boards, immersion alone does not allow sufficient diffusion of organic solvents, which slows down the development speed. Diffusion takes place, and the development speed can be increased.

しかし、超音波振動を長い時間加えると、有機溶剤の拡
散が十分性なわれ、未露光フォトレジストの溶解が促進
され過ぎるため、配線パターン間隔の差による現像速度
の差が大きくなる幣害が出てくる。そこで本実施例のよ
うに、超音波振動子10を適当な間隔で設けることによ
り、印刷回路板に間欠的に超音波振動を加えると、現像
速度の差が大きくなる常客を解決できる。
However, if ultrasonic vibration is applied for a long period of time, the organic solvent will not diffuse sufficiently and the dissolution of unexposed photoresist will be promoted too much, resulting in damage such as a large difference in development speed due to the difference in wiring pattern spacing. It's coming. Therefore, by providing the ultrasonic vibrators 10 at appropriate intervals as in this embodiment, it is possible to solve the problem of frequent customers where the difference in development speed becomes large when ultrasonic vibration is applied intermittently to the printed circuit board.

このようにして、印刷回路板に対して有機溶剤に浸漬す
るだけの状態と、超音波を照射する状態を交互に繰り返
しながら、印刷回路板は搬送され、現像される。有′機
溶剤に浸漬することによって現像を行なうため、従来の
スプレーによる現像で問題のあった配線パターン間隔の
差による現像速度の差がなくなる。また印刷回路板の上
面と下面の現像速度の差は、超音波振動子10を水平搬
送コンベア5の上側と下側に設け、超音波振動の強さ、
つまりキャビテーションの強さが水平搬送コンベア5上
の印刷回路板上で一定になるよう、超音波振動子10と
印刷回路板との距離を設定すれば良い。
In this way, the printed circuit board is transported and developed while alternating between simply immersing the board in an organic solvent and irradiating it with ultrasonic waves. Since development is performed by immersion in an organic solvent, there is no difference in development speed due to differences in wiring pattern spacing, which was a problem with conventional spray development. In addition, the difference in development speed between the upper and lower surfaces of the printed circuit board can be determined by installing ultrasonic vibrators 10 on the upper and lower sides of the horizontal transport conveyor 5, and adjusting the strength of the ultrasonic vibration.
In other words, the distance between the ultrasonic transducer 10 and the printed circuit board may be set so that the strength of cavitation is constant on the printed circuit board on the horizontal conveyor 5.

浸漬現像槽7から出てきた印刷回路板は、スプレーリン
ス槽5に入り、印刷回路板上に付着しているフォトレジ
ストを含んだ有機溶剤は新しい有機溶剤で洗い流される
。印刷回路板上の未露光フォトレジストの溶解は、浸漬
現像槽7においてほぼ完了しているため、スプレーリン
ス槽3での未露光フォトレジストの溶解は少なく、その
ためスプレーによる常客は無視できる。
The printed circuit board emerging from the immersion developer tank 7 enters a spray rinse tank 5, where the organic solvent containing the photoresist adhering to the printed circuit board is washed away with fresh organic solvent. Since the dissolution of the unexposed photoresist on the printed circuit board is almost completed in the immersion developer bath 7, the dissolution of the unexposed photoresist in the spray rinse bath 3 is small, so that the patronage caused by spraying can be ignored.

本実施例によれば、印刷回路板の配線パターン間隔の差
によらず、均一なフォトレジストパターン寸法を得るよ
うに現像ができる。以下具体的に本発明の効果例を図に
より説明する。第3図は、従来のスプレー処理を行なっ
たときのマスクパターン幅とマスクパターン幅からのフ
ォトレジストパターン幅の変化量を示す。図で横軸はマ
スクパターン幅であり、縦軸はフォトレジストパターン
幅の変化量である。第4図は本発明による浸漬しながら
超音波を照射して現像を行なったときに、第5図と同様
の相関を示す図である。従来のスプレー処理では、マス
クパターン幅が70μmから300μmまで変化したと
き、現像後のフォトレジストパターン幅の変化量は+6
.2μ絹)ら−1,8μmまでバラつき、変化量の差は
5.0μmとなる。一方、浸漬しながら超音波を照射す
る本発明の装置では、+2.4μmから+0.4μmで
あり、変化量の差は2.0μmである。
According to this embodiment, development can be performed to obtain uniform photoresist pattern dimensions regardless of the difference in the wiring pattern spacing of the printed circuit board. Hereinafter, examples of the effects of the present invention will be specifically explained with reference to the drawings. FIG. 3 shows the mask pattern width and the amount of change in the photoresist pattern width from the mask pattern width when conventional spray processing is performed. In the figure, the horizontal axis is the mask pattern width, and the vertical axis is the amount of change in the photoresist pattern width. FIG. 4 is a diagram showing the same correlation as FIG. 5 when development is performed by irradiating ultrasonic waves while immersing according to the present invention. In conventional spray processing, when the mask pattern width changes from 70 μm to 300 μm, the amount of change in photoresist pattern width after development is +6
.. The difference in the amount of change is 5.0 μm. On the other hand, in the device of the present invention that irradiates ultrasonic waves while being immersed, the difference is from +2.4 μm to +0.4 μm, and the difference in the amount of change is 2.0 μm.

従って、本発明における変化量の差は、スプレー処理の
場合のそれの40チであり、フォトレジストパターン寸
法の均一性を大幅に改善する効果がある。
Therefore, the difference in the amount of change in the present invention is 40 inches compared to that in the case of spray processing, which has the effect of greatly improving the uniformity of photoresist pattern dimensions.

なお印刷回路板の片面にのみ配線パターンがあるときは
、超音波振動子10を上側または下側にのみ設ければよ
い。
Note that when the printed circuit board has a wiring pattern on only one side, the ultrasonic transducer 10 may be provided only on the upper side or the lower side.

〔発明の効果〕〔Effect of the invention〕

本発明によれば、均一な配線パターン寸法を得る印刷回
路板の現像装置が得られる。
According to the present invention, it is possible to obtain a developing device for a printed circuit board that provides uniform wiring pattern dimensions.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は従来の現像装置の構成を示す側面図、第2図は
本発明の一実施例である現像装置の構成を示す側面図、
第5図は従来の現像装置で現像した時のマスクパターン
幅とマスクパターン幅からのフォトレジストパターン幅
の変化量との相関例を示す図、第4図は本発明による現
像装置で現像した時の第3図と同様の相関例を示す図で
ある。 1・・・スプレー現像槽、 3・・・スプレーリンス槽、 4・・・水洗スプレー槽、 5・・・水平搬送コンベア、 6・・・スプレーノズル、 7・・・浸漬現像槽、 10・・・超音波振動子。 代理人弁理士 高 橋 明 夫 %i / 図 第 2 固 第 3 図 第 4 図
FIG. 1 is a side view showing the configuration of a conventional developing device, and FIG. 2 is a side view showing the configuration of a developing device according to an embodiment of the present invention.
FIG. 5 is a diagram showing an example of the correlation between the mask pattern width and the amount of change in the photoresist pattern width from the mask pattern width when developed with a conventional developing device, and FIG. 4 is a diagram when developed with the developing device of the present invention. FIG. 3 is a diagram showing a correlation example similar to FIG. 3 of FIG. DESCRIPTION OF SYMBOLS 1... Spray developing tank, 3... Spray rinsing tank, 4... Washing spray tank, 5... Horizontal transport conveyor, 6... Spray nozzle, 7... Immersion developing tank, 10...・Ultrasonic vibrator. Representative Patent Attorney Akio Takahashi%i / Figure 2 Figure 3 Figure 4

Claims (1)

【特許請求の範囲】 1、 印刷回路板上に形成されたフォトレジストを現像
する現像装置において、現像すべき前記印刷回路板が現
像液によって浸漬される現像槽中に前記印刷回路板の配
線パターン面に向けて超音波を発する超音波振動子を設
けたことを特徴とする現像装置。 2、 前記印刷回路板が前記現像槽中に搬送されるルー
トに沿って複数の前記超音波振動子を設け、前記配線パ
ターン面に対して間けつ的に超音波を照射することを特
徴とする特許請求の範囲第1項記載の現像装置。
[Claims] 1. In a developing device for developing a photoresist formed on a printed circuit board, the wiring pattern of the printed circuit board is placed in a developing tank in which the printed circuit board to be developed is immersed in a developer solution. A developing device characterized by being provided with an ultrasonic vibrator that emits ultrasonic waves toward a surface. 2. A plurality of the ultrasonic transducers are provided along the route along which the printed circuit board is conveyed into the developer tank, and the wiring pattern surface is intermittently irradiated with ultrasonic waves. A developing device according to claim 1.
JP3859784A 1984-03-02 1984-03-02 Developing unit for printed circuit board Pending JPS60183788A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3859784A JPS60183788A (en) 1984-03-02 1984-03-02 Developing unit for printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3859784A JPS60183788A (en) 1984-03-02 1984-03-02 Developing unit for printed circuit board

Publications (1)

Publication Number Publication Date
JPS60183788A true JPS60183788A (en) 1985-09-19

Family

ID=12529685

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3859784A Pending JPS60183788A (en) 1984-03-02 1984-03-02 Developing unit for printed circuit board

Country Status (1)

Country Link
JP (1) JPS60183788A (en)

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